Product details

Technology family HCS Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 7.8 IOH (max) (mA) -7.8 Input type Schmitt-Trigger Output type Push-Pull Features High speed (tpd 10- 50ns) Data rate (max) (Mbps) 130 Rating Catalog Operating temperature range (°C) -40 to 125
Technology family HCS Supply voltage (min) (V) 2 Supply voltage (max) (V) 6 Number of channels 4 Inputs per channel 2 IOL (max) (mA) 7.8 IOH (max) (mA) -7.8 Input type Schmitt-Trigger Output type Push-Pull Features High speed (tpd 10- 50ns) Data rate (max) (Mbps) 130 Rating Catalog Operating temperature range (°C) -40 to 125
SOIC (D) 14 51.9 mm² 8.65 x 6 SOT-23-THN (DYY) 14 13.692 mm² 4.2 x 3.26 TSSOP (PW) 14 32 mm² 5 x 6.4 WQFN (BQA) 14 7.5 mm² 3 x 2.5
  • Wide operating voltage range: 2 V to 6 V
  • Schmitt-trigger inputs allow for slow or noisy input signals
  • Low power consumption
    • Typical ICC of 100 nA
    • Typical input leakage current of ±100 nA
  • ±7.8-mA output drive at 5 V
  • Extended ambient temperature range: –40°C to +125°C, TA
  • Wide operating voltage range: 2 V to 6 V
  • Schmitt-trigger inputs allow for slow or noisy input signals
  • Low power consumption
    • Typical ICC of 100 nA
    • Typical input leakage current of ±100 nA
  • ±7.8-mA output drive at 5 V
  • Extended ambient temperature range: –40°C to +125°C, TA

This device contains four independent 2-input NAND Gates with Schmitt-trigger inputs. Each gate performs the Boolean function Y = A ● B in positive logic.

This device contains four independent 2-input NAND Gates with Schmitt-trigger inputs. Each gate performs the Boolean function Y = A ● B in positive logic.

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Technical documentation

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* Data sheet SN74HCS00 Quadruple 2-Input NAND Gates with Schmitt-Trigger Inputs datasheet (Rev. C) PDF | HTML 13 Dec 2021
Application brief Catch a Digital Signal PDF | HTML 16 Jul 2021

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

14-24-LOGIC-EVM — Logic product generic evaluation module for 14-pin to 24-pin D, DB, DGV, DW, DYY, NS and PW packages

The 14-24-LOGIC-EVM evaluation module (EVM) is designed to support any logic device that is in a 14-pin to 24-pin D, DW, DB, NS, PW, DYY or DGV package,

User guide: PDF | HTML
Not available on TI.com
Evaluation board

14-24-NL-LOGIC-EVM — Logic product generic evaluation module for 14-pin to 24-pin non-leaded packages

14-24-NL-LOGIC-EVM is a flexible evaluation module (EVM) designed to support any logic or translation device that has a 14-pin to 24-pin BQA, BQB, RGY, RSV, RJW or RHL package.

User guide: PDF | HTML
Not available on TI.com
Evaluation board

HALL-TRIGGER-EVM — Evaluation module for contactless, Hall-effect variable-speed trigger with external field protection

This evaluation module (EVM) uses Hall-effect sensors to implement a trigger that outputs a varying voltage based on how far the trigger is pressed. The EVM uses a contactless approach that reduces wear and tear compared to traditional mechanical-based triggers, thereby improving product lifetime. (...)
User guide: PDF | HTML
Not available on TI.com
Simulation model

SN74HCS00 IBIS Model (Rev. B)

SCLM150B.ZIP (51 KB) - IBIS Model
Reference designs

TIDA-060032 — Contactless, Hall-effect variable-speed trigger reference design with external field protection

This reference design uses Hall-effect sensors to implement a trigger that outputs varying voltage based on how far the trigger is pressed. These types of triggers are useful in cordless power tools or any other end equipment that uses trigger displacement information.

The design uses a contactless (...)

Design guide: PDF
Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
SOIC (D) 14 Ultra Librarian
SOT-23-THN (DYY) 14 Ultra Librarian
TSSOP (PW) 14 Ultra Librarian
WQFN (BQA) 14 Ultra Librarian

Ordering & quality

Information included:
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  • MSL rating/Peak reflow
  • MTBF/FIT estimates
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  • Ongoing reliability monitoring
Information included:
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  • Assembly location

Support & training

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