loading...Need more CAN FD?
Add more CAN FD lanes to your design with the industry's first SPI-to-CAN-FD system basis chip (SBC)
Scalable camera design is in sight
Save time and increase longevity in your automotive camera design with one, modular approach
Create the TI-RSLK MAX
- Solderless assembly in under 15 minutes
- Hands-on robotics learning
- Controlled by the SimpleLink™ MSP432™ MCU
Automated doors and gates using TI mmWave sensors
Intelligently detect, track and respond
Engineering the next frontier
Discover ICs and reference designs tailored to support the longevity and dependability of your next mission