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Add more CAN FD lanes to your design with the industry's first SPI-to-CAN-FD system basis chip (SBC)
Scalable camera design is in sight
Save time and increase longevity in your automotive camera design with one, modular approach
Create the TI-RSLK MAX
- Solderless assembly in under 15 minutes
- Hands-on robotics learning
- Controlled by the SimpleLink™ MSP432™ MCU
Automated doors and gates using TI mmWave sensors
Intelligently detect, track and respond