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SOT23 Package Thermal Consideration


Thermal design is very important for small outline transistor (SOT) packages. This paper compares the thermal performance of flip-chip on lead (FCOL) SOT23 packages with conventional wire-bond SOT23 packages. The results show that FCOL packages have better thermal-dissipation capabilities. Present SOT23 package PCB layout guides and summary of the FCOL SOT23 package thermal test results are based on the TI EVM.