SOT23 Package Thermal Consideration
Thermal design is very important for small outline transistor (SOT) packages. This paper compares the
thermal performance of flip-chip on lead (FCOL) SOT23 packages with conventional wire-bond SOT23
packages. The results show that FCOL packages have better thermal-dissipation capabilities. Present
SOT23 package PCB layout guides and summary of the FCOL SOT23 package thermal test results are
based on the TI EVM.