1950 Manufacturing
begins in Mexico First
hermetically sealed thermostat introduced
1952 S&C
becomes the world’s major source of aircraft circuit
breakers
1953 Ships
first fuel elements for Sea Wolf Nuclear Submarine
1954 First
hermetic motor protector introduced Sine
switch launched, entry to precision position switches
for military First
patents issued for pressure temperature bonding process
1955 Motor
protector assembly begins at plant in Holland
1963 First
pressure switch using a snap-action sensor disc introduced Copper-clad
aluminum wire bonding process developed
1964 Electronic
clothes dryer control introduced High-volume
contract awarded to supply connectors to IBM
1965 First
miniature aircraft breakers introduced Contracted
to create switches for the Apollo Command Module, Lunar
Rover Positive
Temperature Coefficient (PTC) technology introduced $30
million contract awarded by U.S. Mint for clad coinage
1966 First
electronic connector business secured First
PTC heaters introduced
1980 S&C’s
Appliance Electronics unit ships first electronic wall
thermostat
1981 First
free-disc pressure switch introduced Work
begins on Statue of Liberty restoration project
1983 First
8EA PTC starter produced Aguascalientes,
Mexico, selected as site for expansion
1985 4TM
motor protector introduced
1988 Automotive
Pressure Transducer (APT) production launches for GM Automotive
Pressure Transducer produced for Nissan air conditioners TI-RFID
introduced for Automatic Rapid Frequency Identification
1990 First
battery protector introduced First
family of SP Combination Start and Protect Devices introduced
1992 Low-g
accelerometer introduced TIRIS
read/write transponder debuts
1994 Transmission
Range Sensor production launches for Ford TI-RFID
vehicle immobilizer developed
1995 Development
of DuraFoil™ material
1996 Plant
opens in Baoying, China Construction
begins on new facility in Aguascalientes, Mexico
1997 Mobil
Oil selects TIRIS for use in Speed Pass pay-at-pump transactions Industry's
first c24x low-cost motor controller introduced Land
Grid Array (LGA) burn-in sockets selected by Intel for
Pentium II High-Volume
Manufacturing of 0.5mm pitch Chip Scale Package (CSP)
begins
1998 Wholly-owned
China manufacturing operation opens in Baoying TIRIS
announces Tag-It™ SMART label technology
1999 Production
of DuraFoil™ material begins Subcontracting
agreement signed with Videoton in Hungary Tag-It™
SMART label low-cost RFID Transponder introduced Micro-Silicon
Strain Gauge sensor introduced
2003 Automotive
passive entry system using an RFID-enabled key created
2004 ARC
Shield™ introduced (fault circuit Interrupter) Second
plant in China opens in Changzhou Province after acquisition
of the motor protector business of Chengheng Company. Back to top