Results | Looking ahead
TI's carbon footprint was 2.42 million metric tons carbon dioxide equivalent (MMTCO2e), up from 2.38 MMTCO2e in 2011, a 1.5 percent increase. Approximately 66 percent of our carbon footprint is the result of purchased electricity.
While the overall carbon footprint increased slightly due to the addition of four large sites from our acquisition of National Semiconductor, our overall emissions per chip manufactured decreased significantly. Our normalized greenhouse gas (GHG) emissions produced per chip decreased 17 percent year on year.
In conjunction with the International Sematech Manufacturing Initiative and Semiconductor Industry Association, in 2012 we helped the U.S. Environmental Protection Agency identify and develop workable and more accurate GHG accounting methodologies for the semiconductor industry, such as stack emissions test methods for reporting direct GHG emissions.
We continued working with the global semiconductor industry to further reduce greenhouse gas (GHG) emissions, including voluntary efforts to reduce normalized perfluorocompound emissions by 30 percent per amount of product produced (based on surface area) by 2020.
Also during the year, TI:
- Reported GHG emissions to the U.S. Environmental Protection Agency in compliance with its new mandatory GHG reporting rules.
- Disclosed annual European air-travel emissions in compliance with the European Union Emissions Trading System.
- Purchased renewable energy worldwide, which accounted for 20 percent of total energy purchases for the year. This includes 4 percent purchased renewable energy certificates and 16 percent renewable energy in our grid power mix, primarily from hydroelectric power plants.
- Placed enforceable operational limitations on three U.S. sites to ensure that GHG emissions are limited and that each site remains a minor source of GHG emissions.
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TI plans to maintain compliance with existing greenhouse gas (GHG) emissions regulations and continue to report GHG emissions to the CDP. In addition, we will:
- Continue to work toward our goal of reducing GHG emissions per chip produced by 30 percent by 2015 (based on the 2010 baseline).
- Shift production from inefficient manufacturing sites in Hiji, Japan, and Houston, Texas, to more efficient facilities by mid-2013.
- Continue to drive energy efficiency in our buildings and processes to reduce upstream power plant GHG emissions.
- Continue voluntary efforts with the semiconductor industry to reduce normalized perfluorocompound emissions and help achieve the World Semiconductor Council 2020 reduction goal.
- Open an Aircraft Operators Holding Account for the purpose of trading allowances (carbon credits) and begin acquiring carbon credits. Theallowances are to offset emissions generated by corporate aircraft while flying in Europe.