Texas Instruments

2012 Corporate Citizenship Report


Like us on FacebookFollow us on TwitterE-mail

Procurement

We work to maximize the efficiency of the materials we purchase and to reduce environmental impact throughout a product's life cycle by purchasing only what our sites need, sourcing products responsibly, and reusing and recycling materials where possible.

In 2012, we continued evaluating the procurement of the supplies that make up the bulk of our global spending: direct materials, which are used to manufacture our semiconductors and are present in our final products.

The direct materials we purchase include:
  • Chemicals: this includes protective overcoat and stress buffer films that protect devices during the packaging and encapsulation processes.
  • Silicon: a silicon wafer is the foundation material on which we create semiconductor products.
  • Metals: this includes lids, substrates, sputtering targets and lead frames, which form the skeleton of integrated circuits.
  • Packaging materials: this includes materials used in assembly and test processes to house completed semiconductors and to ship final parts – such as mold compounds, bonding wire and die attach – as well as packing materials such as adhesives, bubble wrap and cardboard.
Other materials we purchase include:
  • Nonrenewable materials: minerals and natural gas.
  • Indirect materials: materials used in our operations that are not present in the final product, such as manufacturing cleansing agents and laptop computers.
We outsource the fabrication of our education technology products, which accounts for less than 5 percent of our revenue.