Due primarily to increased energy use from expanding TI’s business in 2010 – mainly an increase in overall production – our carbon footprint was 1.96 million metric tons carbon dioxide equivalent (MMTCO2e), up from 1.74 in 2009 (a 13 percent increase). However, our normalized GHG emissions produced per chip declined 24 percent year on year.
Looking ahead
TI will continue working with the global semiconductor industry to further reduce GHG emissions. One important part of our GHG emission reduction efforts is our voluntary reduction of perfluorocarbon (PFC) gas emissions. TI has joined other members of the Worldwide Semiconductor Association in establishing a reduction goal for reducing PFC emissions. We expect this goal to be finalized in the summer of 2011.
Notably, we have set an internal goal to reduce greenhouse gas emissions per chip produced by 30 percent over the next five years.
In addition, we plan to continue to report GHG emissions to the Carbon Disclosure Project. In 2011, TI will also continue monitoring and working to comply with new regulations.
