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2011 Corporate Citizenship Report

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2011 performance

Results | Looking ahead

Due primarily to increased energy use from expanding TI's business in 2011 - mainly due to the addition of several new facilities - our carbon footprint was 2.38 million metric tons carbon dioxide equivalent (MMTCO2e), up from 1.96 MMTCO2e in 2010, a 21 percent increase. Because several sites were either under capacity (which requires roughly the same amount of resources as fully loaded operations) or new facilities were ramping up, our normalized GHG emissions produced per chip increased 25 percent year-on-year.

Results

TI continued working with the global semiconductor industry to further reduce greenhouse gas (GHG) emissions, including voluntary efforts to reduce perfluorocarbon (PFC) gas emissions. TI joined other members of the Worldwide Semiconductor Council in establishing a goal for reducing PFC emissions by 30 percent per amount of good product produced (based on surface area) by 2020.

In 2011, TI also:
  • Reported GHG emissions to the EPA in compliance with the new mandatory reporting rule by the appropriate deadline.
  • Disclosed annual TI European air-travel emissions in compliance with the European Union Emissions Trading System.
  • Increased energy use by 8 percent, due primarily to the continued ramp-up of two manufacturing facilities and an assembly/test site. Approximately 62 percent of our carbon footprint is the result of purchased electricity.
  • Purchased renewable energy worldwide, which accounted for 21 percent of our total energy purchases for the year. This includes 5 percent purchased renewable energy certificates and 16 percent renewable energy in our grid power mix, primarily from hydroelectric power plants.

Looking ahead

We plan to maintain compliance with existing GHG emissions regulations and continue to report GHG emissions to the Carbon Disclosure Project. In addition, we will:
  • Continue to work toward TI's goal to reduce GHG emissions per chip produced by 30 percent by 2015 (based on the 2010 baseline).
  • Close two facilities: manufacturing sites in Hiji, Japan, and Houston, Texas. We anticipate that the transition will be complete by mid-2013. As these are two of our oldest facilities, their closure may decrease our overall emissions.
  • Integrate three facilities gained in the National Semiconductor acquisition into TI's overall manufacturing processes, introducing new product flows, evaluating GHG emissions, and deploying our existing GHG strategies.
  • Continue voluntary efforts with the global semiconductor industry to reduce PFC emissions and help achieve the World Semiconductor Council 2020 reduction goal.
  • Open our Aircraft Operators Holding Account (AOHA) and exchange carbon allowances as needed. The AOHA manages carbon allowances for the European Union GHG Emissions Trading Scheme, allowing companies to earn, buy or sell them.
We do not currently expect GHG emission-reduction requirements for the semiconductor industry, but recognize that this is a possibility in the future.

Carbon footprint

 

 

 

 

 

 

 

 



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