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2010 Corporate Citizenship Report

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Corporate Citizenship Report

Climate change

TI and the U.S. semiconductor industry are working proactively to reduce greenhouse gas (GHG) emissions and are committed to global business sustainability.

According to the U.S. Environmental Protection Agency’s 2011 U.S. GHG Inventory Report, the semiconductor industry emitted 0.08 percent of the total U.S. greenhouse gas (GHG) emissions inventory in 2009.

TI invests substantial sums of dollars and employs numerous mitigation strategies to reduce GHG emissions by: These programs help reduce direct and indirect contributions to climate change. We have dedicated teams to manage and measure our progress. In addition, we also leverage external expertise and share our knowledge with government and industry entities to continue to reduce GHG emissions.

Many of our efforts to reduce GHG emissions have been in place for decades.

Mid-1970s Began formal energy conservation program
1994 Began public environmental reporting
1995 Joined industry in setting goal to reduce PFCs by 10 percent by 2010
2003 Began reporting to Carbon Disclosure Project
2006 Shifted energy use policies to align with our climate-change objectives
2007 Calculated first climate footprint

Formally linked energy conservation program with climate-change strategy

Created three-year plan for additional emission reduction activities
2008 Expanded scope of GHG emissions reporting to all six covered by the Kyoto Protocol, and added NF3

Implemented 159 projects that saved $5.1 million in utility expenses and prevented 32,000 tons of CO2 from entering the atmosphere
2009 Implemented 86 energy conservation projects that saved $3.7 million and prevented an estimated 22,000 metric tons of CO2 from entering the atmosphere
2010 Decreased the amount of energy required to design, market and manufacture a semiconductor chip by 24 percent Set a five-year goal to reduce greenhouse gas emissions per chip produced by 30 percent


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