Product packaging and distribution is another stage of product development where we work to reduce environmental impact and maintain compliance with international regulations, from reducing waste packaging to properly identifying our products.

Accurate product labeling and responsible packaging are critical for timely distribution to customers, but are also opportunities in the product distribution process to reduce environmental impact.

We identify our products consistently throughout the sales process, from order entry to package labeling, to ensure that all TI products meet international shipping standards.

After June 1, 2004, we began shipping lead-free products using packing labels that meet standards set by the Joint Electronic Device Engineering Council (JEDEC). We also provide the necessary information for compliance with the new China RoHS requirements when applicable.

Although we don’t currently track greenhouse gas emissions related to global product shipments, we do systematically review the packing material used to transport semiconductor chips between our manufacturing locations and our customers. During the past 10 years, we have significantly reduced the amount of packing materials, resulting in lower shipping weights, shipping costs and fuel consumption as well as reduced waste.

One of our sustainable packaging programs is the Multipak reusable packing system, used primarily in Japan. After receiving an order, the customer returns the entire package (box and shipping materials) to a third party, which certifies the packing for reuse. With Multipak, we are able to reuse 100 percent of the shipping container and internal packing materials. If the materials do not pass inspection, they are recycled.

Our DLP devices are shipped to customers in non-toxic reusable plastic packages. These are reused continuously until the end of their useful life and eventually recycled.