Responsible packaging and accurate product labeling are critical for timely distribution to customers and compliance with international shipping regulations. Larger and heavier packages can use more resources and impact our bottom line, which is why we explore new ways to continually reduce shipping costs, lower fuel consumption, and reduce waste.
For all of our product shipments, we try to:
As a leader in semiconductor packaging technology, we strive to minimize waste while ensuring quality delivery by:
We also stack semiconductor chips vertically, which reduces board space and allows customers to make smaller electronics that are more powerful. This also reduces the boards' total energy and cooling costs.
To conserve materials and comply with global regulations, we ship semiconductor lead (Pb)-free products using packing labels that meet the standard set jointly by the IPC-Association Connecting Electronics Industries and the Joint Electronic Device Engineering Council J-STD-609.
TI's Education Technology division keeps a close eye on the packaging industry, which is working diligently to find an alternative to the plastic packaging. However, finding a suitable alternative is challenging because we must balance environmental considerations with damage-free transport of products and the practical needs of the retail stores that sell our products.
Many European Union member states recycle ET display packaging under the EU Green Dot program. A green dot indicates that the packaging is part of a privately organized recycling system and that expenses for proper reuse or disposal have been paid.