Wai L.

Engineering change in imaging

Wai refuses to be mediocre. He likes to win. As a Texas Instruments Fellow and a chief technologist for audio imaging and sensor products for digital performance, Wai has enabled great inventions at TI for nearly two decades, including low-power DSPs and high-speed serial interfaces. He knows what it takes to succeed.

Today, Wai spends most of his time working with a team to enable 3D imaging sensors for cameras. According to Wai, 3D sensors will completely change modern camera usage. Current cameras only collect 2D information, but cameras coupled with 3D imaging sensors will have the capability to communicate more information about depth and the surrounding areas in a shot. A wide range of applications can result with the utilization of these 3D imaging sensors. For example, technology in the robotic, industrial and automotive industries could employ the 3D imaging sensor for safety purposes like accident prevention and monitoring.

In the end, TI’s customers are what really inspire Wai to innovate. He says most of his good ideas come from talking to his customers and understanding their needs. According to Wai, delivering a solution to a customer is fine, but anticipating their needs beyond the current solution and addressing future problems is real innovation.

 

“Innovation is about foreseeing a problem in the future.”

 

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