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20082007, 2006
Annual Reports
 
200720062005
Quarterly Earnings Releases
 
Latest Quarter          
Mid-Quarter Update Releases
 
Latest Mid-Quarter          
 Latest SEC Filings
 
10K, 10Q, 8K -----------
All SEC Filings (EDGAR)
 
10K, 10Q, 8K, Forms 3, 4, & 5
SEC Form Description

 2007 FINANCIAL STATEMENTS*
Statements of Income
Balance Sheets
Cash Flows
Stockholders' Equity

 HISTORICAL FINANCIAL
 STATEMENTS-SELECTED ITEMS*
Annual Income Statements
 
 GAAP (.xls)
 Business Segment (.xls)
 Quarterly Income Statements
 
 GAAP (.xls)
 Business Segment (.xls)
Balance Sheet (.xls)
Cash Flows (.xls)
Semiconductor Revenue by Product (.xls)
History of Stock-Based Compensation Expense (.xls)


*Restated to reflect sale of the former Sensors & Controls business and transfer of RFID operations into the Semiconductor segment.
 
Investor Calendar
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 LATEST FINANCIAL CONFERENCES
Ron Slaymaker to speak at Baird investor conference
   (Chicago, IL)
   (May 14, 2008, 2:30 p.m. Central time)
    
View Webcast    

 FINANCIAL HEADLINES
TI Vice President Ron Slaymaker to speak at Baird investor conference
Texas Instruments to webcast CEO remarks at 2008 financial analyst meeting
TI reports financial results for 1Q08
Texas Instruments board declares quarterly dividend
Texas Instruments to broadcast its first-quarter 2008 earnings conference call on the web
Texas Instruments to broadcast its annual meeting of stockholders on the web
TI updates first-quarter 2008 business outlook
TI CEO Rich Templeton to speak at Morgan Stanley investor conference
TI Chairman Tom Engibous to Retire in April; President and CEO Rich Templeton to Assume Chairmanship
Texas Instruments Acquires POWERPRECISE Solutions to Expand Power Management Business
TI Acquires Integrated Circuit Designs, Inc. to Expand Low-Power RF Design Resources
TI to Repurchase Additional $5 Billion in Stock, Increase Dividend 25 Percent
TI Doubles Dividend
TI to Repurchase Additional $5 Billion in Stock, Increase Dividend by 33 Percent

 BUSINESS HEADLINES
Texas Instruments introduces industry's first single chip to integrate GPS, Bluetooth® and FM technology
Texas Instruments OMAP35x™ processors inspire new inventive applications with unprecedented combination of high performance at handheld power levels
TI senior vice president challenges industry to unlock innovation for friendlier, easier and smarter mobile user experience
TI's New OMAP™ 3 chip brings HD camcorder and rich full-page Web browsing to mobile devices
Ericsson announces one-chip HSPA solution for Open OS enabled mobile devices
Chinese Manufacturers Amoi and TCL Leverage TI Technology for Handsets Shipping Around the Globe
Wireless Pioneer Texas Instruments Marks Five Years of Single-Chip Innovation
Ericsson and Texas Instruments to Co-develop Innovative 3G Solutions for Handset Manufacturers
Texas Instruments Expands Voice over IP Portfolio with New Addition to IP Phone Product Suite
TI Executive Marks 25 Years of DSP Technology, Promises to Continue Innovation and Create New Market Opportunities
Texas Instruments Launches "LoCosto ULC" Single-Chip Platform for Low-Cost Color MP3 Camera Phones
Texas Instruments Delivers Industry's First 720p High-Definition Video Playback and "Life-Like" 3D Graphics for Mobile Phones with OMAP™ 3 Platform
Texas Instruments CEO Says TI Single-Chip Cell Phone Technology Gives Emerging Economies First Phones Today, "Complete Global Access" Tomorrow
Motorola Expands Strategic Relationship with Texas Instruments to Include High-Volume 3G, WiMAX and OMAP™ Technologies
 
Stock Price

 SPEECHES, EVENTS
 & CONFERENCE CALLS
Executive Presentations
2008 Financial Analyst Meeting
 
Presentations
Webcast
TI Stockholders Meeting Webcast
 
Remarks: Rich Templeton
Stockholders Vote

 CORPORATE GOVERNANCE
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Corporate Governance Guidelines & Committee Charters (PDF)
TI Board of Directors
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TI Values & Ethics Statement/Code of Business Conduct (PDF)
Code of Ethics for TI CEO & Senior Financial Officers (PDF)
Accounting and Audit Hotline
Ethics


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