TI serves a large number of customers across a wide range of end equipment areas with innovative semiconductor devices – from catalog and custom analog products to wireless and embedded processing products such as digital signal processors (DSPs) and microcontrollers.

Collaborative model extends semiconductor manufacturing capacity, fuels technology advancement

To maintain leadership quality, reliability and competitiveness across these very diverse product areas, TI relies on a flexible process technology development and semiconductor manufacturing model that leverages both internal and external strengths and capabilities, as well as relationships with multiple leading-edge foundry partners. This model allows TI to deliver differentiated semiconductor solutions based on the most advanced process technologies available – at the right price, performance and volumes our customers require. It also ensures that our customers have a continuity of supply.

TI’s flexible model includes internal development and manufacturing of analog process technologies and joint development with foundries on advanced digital CMOS technologies. Coupled with TI’s innovative design techniques, these process technologies help enable smaller, faster and more power-efficient semiconductor products.

The role of technology research