Today, TI's internal semiconductor manufacturing operations span nine countries and include more than four million square feet of clean room space across 20 factories that fabricate, assemble, test and package billions of analog, embedded processing and wireless products each year.
TI is committed to providing the semiconductor capacity that our customers need to get to market fast and grow. This is accomplished through a flexible manufacturing strategy to ensure our customers receive the products they need, when they need them at the right price and performance.
Our process technology, manufacturing and design teams collaborate closely to enable differentiated products and improve time to market for customers. For example, TI's Analog Technology Development and Worldwide Manufacturing teams transferred multiple processes in parallel, on or ahead of schedule into TI's new factories in Chengdu, China, Aizu, Japan, and Richardson, Texas, quickly addressing customer demand for these products.
Investing for growth
While many TI competitors have reduced the size of their capital investments over the last few years, TI has made significant capital equipment and capacity expansions to support the growing demand for its comprehensive analog semiconductor portfolio. These investments enable TI to deliver the lead-times, performance, volumes and low costs that our analog customers need throughout product life cycles, which can span anywhere from five to 20 years.
In fact, TI spent $1.8 billion in 2009 and 2010 on capital expenditures to increase capacity. Less than 18 months after those capacity expansions, TI qualified initial analog process technologies and began shipping analog product from three new semiconductor manufacturing facilities. In September 2011, TI also expanded its manufacturing footprint to include new factories in Maine, Scotland and Malaysia as a result of its acquisition of National Semiconductor.
Capacity Milestones
Wafer fab capacity
In January 2011, TI announced it has qualified 10 analog devices in its Chengdu, Aizu and RFAB facilities, and is shipping analog products from all three of its new wafer fabs.
In October 2010, TI acquired a 200mm wafer fab in Chengdu, China with a 200mm clean room capable of producing more than 25K wafers per month and a second clean room for future expansion. Since that time, TI has qualified its NexFET™ low-voltage MOSFET technology in the factory, and plans are underway to qualify LBC5, a BiCMOS power technology, by the end of 2011.
In July 2010, TI announced the acquisition of a 200mm wafer fab in Aizu-Wakamatsu, Japan. TI qualified and began shipping its HPA07 high-performance analog CMOS technology from the fab in March. The site has a second clean room capable of 200mm or 300mm capacity for future expansion.
In 3Q09, TI announced the opening of RFAB, the industry's first 300mm analog wafer fab in Richardson, Texas. Today, RFAB is in full production with each wafer producing thousands of analog chips. Analog process technologies running in the fab include LBC7, a linear BiCMOS technology used in power management devices, and C05, an 180-nm technology that has been optimized for analog.
Assembly and test capacity
In early 2009, TI opened Clark, an 800,000-square-foot assembly and test facility in the Philippines, which quickly ramped production with the latest packaging technologies. TI is currently expanding capacity in this facility, with plans to double the site's output by 3Q10.
Industry firsts
TI has long history of leadership in semiconductor manufacturing. Recent firsts include:
TI’s Clark Assembly/Test facility was the first facility in the Philippines to earn Gold certification from the Leadership in Energy and Environmental Design (LEED).
RFAB is the industry's first wafer fab to produce analog ICs on 300mm (12 inch) wafers, allowing TI to double the number of chips over the more commonly used and smaller 200mm (8 inch) wafers. Read the fact sheet to learn more.
RFAB was the first semiconductor factory to earn Gold certification with the U.S. Green Building Council's Leadership in Energy and Environmental Design (LEED) program for its sustainable design.
TI's Assembly/Test facility in Baguio was the first to earn LEED certification in the Philippines.
Manufacturing responsibly
TI’s approach to environmental stewardship is comprehensive. We continually strive to reduce air emissions, energy consumption, water use and waste, while increasing resource conservation and efficiency in all aspects of our operations.
Our environmental policy and principles guide our efforts to operate sustainably – from manufacturing conscientiously designed products to designing sustainable buildings to minimize environmental and economic impacts from operations.
In short, we work every day to achieve a healthy balance between people, profits, products and the planet. See TI's Corporate Citizenship Report for more.
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While many TI competitors have reduced the size of their capital investments over the last few years, TI has made significant capital equipment and capacity expansions to support the growing demand for its comprehensive analog semiconductor portfolio. These investments enable TI to deliver the lead-times, performance, volumes and low costs that our analog customers need throughout product life cycles, which can span anywhere from five to 20 years.
In October 2010, TI acquired a 200mm wafer fab in Chengdu, China with a 200mm clean room capable of producing more than 25K wafers per month and a second clean room for future expansion. Since that time, TI has qualified its 
In July 2010, TI announced the acquisition of a 200mm wafer fab in Aizu-Wakamatsu, Japan. TI qualified and began shipping its HPA07 high-performance analog CMOS technology from the fab in March. The site has a second clean room capable of 200mm or 300mm capacity for future expansion. 
In 3Q09, TI announced the opening of RFAB, the industry's first 300mm analog wafer fab in Richardson, Texas. Today, RFAB is in full production with each wafer producing thousands of analog chips. Analog process technologies running in the fab include LBC7, a linear BiCMOS technology used in power management devices, and C05, an 180-nm technology that has been optimized for analog. 
In early 2009, TI opened Clark, an 800,000-square-foot assembly and test facility in the Philippines, which quickly ramped production with the latest packaging technologies. TI is currently expanding capacity in this facility, with plans to double the site's output by 3Q10.