Overview

Texas Instruments Incorporated (TI) is the leading manufacturer of wireless semiconductors, delivering the foundation of today's wireless technology and solutions, and driving innovations to deliver the next generation of mobility. From traditional voice-centric mobile phones to the most advanced, multimedia-rich 3G devices, TI delivers a broad range of complete semiconductor and software solutions to meet the requirements of handset manufacturers, mobile operators and application software developers.

For more than 15 years, TI has delivered a flexible, scalable technology platform that crosses multiple wireless market segments from GSM/GPRS/EDGE to 3G and beyond. As a proven semiconductor partner to the wireless industry, TI is accelerating the mobile connectivity revolution by providing multiple non-cellular wireless connectivity technologies to allow seamless communication with any device over any network, anywhere, anytime.

Today, mobile device users want access to a range of services on the handset. TI's focus is on real-time communications with high-performance and low-power consumption. Its proven wireless technology provides a broad portfolio of solutions, from the high-volume, high-growth emerging markets to the more established markets with more complex high-end requirements.

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Making Wireless ... Innovative

TI bases its technology on open industry standards, giving its customers maximum flexibility to deliver unique mobile devices to the marketplace in the shortest time possible. TI partners with handset manufacturers to develop devices that offer the most advanced voice and data connectivity options for consumers and enterprise users. The company has developed flexible solutions that are optimized to meet the demands of the handset environment and enable handset manufacturers, mobile operators and software application providers to fulfill consumer demand for smaller, faster, sleeker, more powerful devices. The following TI offerings ensure that its customers have the tools they need to drive wireless innovation:

• High-performance, scalable OMAP™ applications processors deliver the performance and power efficiency necessary to provide a robust user experience.
• OMAP-Vox™ integrated solutions that merge both modem and applications functionality onto the existing OMAP architecture and share a common software platform
• TI's single-chip "LoCosto" product family leverages DRP™ technology to enable dramatic reductions in power, board area, silicon area and cost
• Single-chip connectivity solutions for mobile TV, Bluetooth® technology, Wi-Fi® and GPS
• Market-proven, market-leading GSM/GPRS chipsets with more than 400 million 2G/2.5G chipsets shipped to 58+ customers
• Complete hardware and software reference designs
• Process technology innovation: shipped more than 1 billion units at 130nm and more than 400 million units at 90nm; 65nm now in production.

Every generation of new technology poses a challenge, and TI's proven strategy is to lead with customized solutions for high-volume customers and follow with merchant solutions. This strategy has proven successful for TI, as today the company has the majority of market share in GSM/GPRS mobile devices. Additionally, about half of 3G WCDMA handsets use TI basebands, and even more use OMAP applications processors.

According to research analyst firm Informa and the Global Mobile Suppliers Association, there are more than 88 million 3G WCDMA subscribers worldwide as of October 2006. As the 3G market matures, the mobile phone is transforming from a trendy gadget into a "must-have" personal communication, information, entertainment and productivity device. With the emergence of high-performance technologies for imaging, audio and graphics, mobile entertainment is expected to be a key driver for wireless services revenue.

During the past several years, TI has provided both 3G WCDMA modems and OMAP processors to industry-leading handset manufacturers worldwide, including Europe, Japan and Korea. As a result, TI leads the market in 3G WCDMA digital basebands (source: Forward Concepts, Cellular Handsets & Chip Markets 2006). The company also continues to invest in the future, including development of solutions for High-Speed Downlink Packet Access (HSDPA), a 3.5G standard that extends 3G WCDMA data rates beyond 10 Mbps for the downlink. Beyond HSDPA, TI is developing a number of Orthogonal Frequency Division Multiplexing (OFDM) technologies, which offer a fundamental network throughput benefit over Code Divisional Multiple Access (CDMA) technologies and are expected to be applied in many future wireless systems.

Along with greater access and processing capabilities comes the need to secure the information and applications enabled by these mobile computing technologies. Texas Instruments' M-Shield™ mobile security technology provides the highest level of terminal and content security in the industry today, setting the benchmark for the level of security needed to protect high-value multimedia content against unauthorized usage, and enable mobile transactions such as ticketing, banking, brokering and shopping by protecting end users. TI believes that the combination of these technologies will become increasingly important in the years ahead.

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Making Wireless ... Entertaining

TI's mobile television solutions bring high-quality broadcast TV programming and the latest multimedia content to handsets. The combination of TI's Hollywood™ mobile TV-on-a-chip solution with its OMAP platform provides the foundation for delivering live TV content to on-the-go consumers.

Cutting-edge mobile entertainment applications will propel 3G to become a high-volume, high-revenue market. TI´s wireless portfolio already delivers compelling, high-performance mobile entertainment and multimedia features for the market through its widely-adopted OMAP platform. In fact, TI's OMAP processors power the vast majority of 3G FOMA handsets, which deliver mobile entertainment capabilities to more than 24 million subscribers in the rapidly growing Japanese market (source: NTT DoCoMo Web site). According to research analyst firm IDC, TI has 67 percent market share in wireless application processors (source: Worldwide Applications Processor and Media Coprocessor 2005 Vendor Shares, August 2006).

TI's OMAP architecture redefines mobile entertainment. OMAP™ 2 processor-enabled handsets deliver a consumer electronics-quality user experiences to the mobile phone, including such applications as mobile TV, hi-fi music with 3D effects, up to DVD-quality video, high-end gaming console functionality, best-in-class color display and up to 6-megapixel-quality digital photography. Adding more productivity and communication capabilities to the design, the new OMAP™ 3 architecture transforms the mobile phone into a work-life tool.

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Making Wireless ... Accessible

With a focus on innovation, TI delivers the technology to wirelessly connect the world.

Driving many of the present and future wireless innovations, TI's innovative DRP™ technology applies digital techniques to simplify radio frequency (RF) processing, and dramatically cuts the cost and power consumption of transmitting and receiving information wirelessly. TI's DRP technology cuts the silicon area, board area and power consumption in half - delivering excellent cost, power and performance benefits. This technique allows for the integration of multi-chip wireless systems onto a single chip and enables handset manufacturers and operators to build cost-effective handsets that address multiple market segments.. TI's "LoCosto" family of scalable single-chip solutions range in capability from supporting GSM phones voice-only and black and white displays to more advanced handsets that support a robust set of features for the higher end of emerging markets, including audio encoding like MP3 and AAC, Bluetooth® solutions, megapixel cameras, calendaring and more. TI is committed to delivering new DRP technology-based solutions, enabling its customers the flexibility to provide feature-rich devices to a broader market including emerging wireless markets like India, China and Africa, and growing feature phone markets in Europe, Asia and the U.S.

The OMAP-Vox platform leverages TI's advanced OMAP 2 architecture enabling easy migration of applications developed on earlier TI OMAP products enabling significant software reuse. The OMAP-Vox hardware platform merges modem and application processing functionality onto the existing OMAP architecture, saving system space, cost and power and allowing the use of a single hardware platform for products with air interfaces ranging from GSM/GPRS/EDGE to UMTS, HSDPA and beyond. In addition, a common software platform can be reused for a variety of growing market requirements to bring overall development costs down and save years of software design effort so manufacturers can quickly and cost-effectively deliver 3G handsets. These feature provide greater flexibility for customized design and migration of developer technology to future product generations.

In addition, TI is accelerating the mobile connectivity revolution to change the way people use their mobile phones, allowing seamless connections across multiple wireless networks and technologies. TI offers the broadest portfolio of mobile connectivity technologies in the industry, including WLAN, Bluetooth® wireless technology, A-GPS, Ultra Wideband, radio frequency identification and mobile TV. The company also combines cellular systems expertise that enables TI to deliver the most flexible solutions optimized specifically to meet the demands of the handset environment.

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