Overview

Texas Instruments Incorporated (TI) is a leading manufacturer of wireless semiconductors, delivering the foundation of today's wireless technology and solutions, and driving innovations to deliver next-generation mobility. From traditional voice-centric mobile phones to the most advanced, multimedia-rich 3G devices, TI delivers a broad range of proven, complete semiconductor and software solutions to meet the requirements of handset manufacturers, mobile operators and application software developers. A leader in innovation, TI’s customer-driven culture and market-driven products uniquely position the company to capitalize on wireless growth opportunities.

For nearly 20 years, TI has delivered flexible, scalable technology platforms that cross multiple wireless market segments from GSM/GPRS/EDGE to 3G and beyond. In addition, TI is accelerating the mobile connectivity revolution by providing multiple non-cellular wireless connectivity technologies that allow seamless communication with any device over any network, anywhere, anytime.

The wireless market’s continued growth is driven by two factors: explosive subscriber growth in emerging economies and consumers upgrading or replacing their mobile phones to have the newest, most compelling features. Market researchers predict that by 2013, more than two-thirds of the world’s population will be carrying a mobile phone - just over 4.1 billion subscribers (Source: Strategy Analytics, June 2008).

To address this demand, TI continues to advance its OMAP™ and OMAP-Vox™ platforms for multimedia features and entertainment, and DRP™ single-chip technology for affordability, while also providing a full array of mobile connectivity solutions, including Wi-Fi®, GPS, Bluetooth® wireless technology and others. Leveraging its DRP technology, TI also is providing the ability to integrate multiple radios, solving co-existence issues including radio interference, access to system resources, handover and seamless integration of applications using multiple air interfaces. TI’s broad, proven product portfolio, combined with the company’s deep, longstanding expertise in the wireless industry, produces cost-effective, flexible solutions that give its customers the ability to differentiate their products with value-added features and functions. TI is making wireless technology innovative, entertaining and accessible to consumers around the globe.

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Making Wireless ... Innovative

TI bases its technology on open industry standards, and continually innovates to give its customers maximum flexibility to deliver unique mobile devices to the marketplace in the shortest time possible. TI partners with its handset manufacturer customers to develop devices that offer the most advanced voice and data connectivity options for consumers and enterprise users.

The company’s complete wireless portfolio for cellular, applications and connectivity – including analog – allows TI to offer scalable custom and standard chipset solutions from the low to the high end of the market. These flexible solutions meet the quick time-to-market demands of the handset environment and enable players at all levels of the wireless value chain to fulfill consumers’ needs for smaller, faster, sleeker, more powerful products. The following TI offerings ensure its customers have the tools they need to drive wireless innovation:

• High-performance, scalable OMAP applications processors deliver the advanced multimedia and power efficiency necessary to provide a robust user experience.
• The single-chip LoCosto™ product family leverages TI's innovative DRP™ technology to make multimedia affordable across a range of market segments.
• Proven multi-radio expertise and the industry’s broadest connectivity portfolio, including Bluetooth wireless technology, Wi-Fi and GPS chips.
• M-Shield™ mobile security technology provides terminal and content security, sets the benchmark for the level of security needed to protect high-value multimedia content against unauthorized usage, and enables mobile transactions by protecting end users.
• SmartReflex™ technology enables efficient performance and power management.

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Making Wireless ... Entertaining

As high-performance technologies for imaging, audio and graphics emerge, TI believes that compelling mobile entertainment features will drive industry growth and wireless services revenue. Cutting-edge mobile entertainment applications will propel 3G to become a high-volume, high-revenue market. TI’s wireless portfolio already delivers cool, high-performance mobile entertainment and multimedia features to consumers worldwide through its widely-adopted OMAP platform:

• OMAP 2 architecture: Delivers consumer electronics-quality user experiences, including mobile TV, digital music with 3D effects, up to DVD-quality video, best-in-class color display and up to 6-megapixel digital camera functionality.
• OMAP 3 architecture: Provides increased productivity, entertainment and communication capabilities, and transforms the mobile phone into a work-life tool. Also supports 12-megapixel camera capture, 720p high definition video capture and movie playback and the ability to connect to DLP® projector in XGA resolution.
• OMAP-Vox integrated solutions: Merges modem and applications functionality onto the existing OMAP architecture, and shares a common software platform for reduced development time and costs.
• OMAP-DM platform: Highly integrated video and imaging engine that offers excellent performance, flexibility for 2.5G and 3G camera phone applications and leverages leading-edge process technology.
• TI’s OMAP products and DLP display technologies: OMAP technology combines with DLP technology to allow consumers to capture and share personalized content stored on their phones, and view them via DLP technologies, such as pocket projectors and HDTVs.
• OMAP mobile gaming platform: Enables high-performance, console-quality gaming for handsets; OMAP gaming developer platform and industry activities allow TI to drive mobile gaming to its fullest potential.

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Making Wireless ... Accessible

TI delivers the technology to wirelessly connect the world. The company’s innovative advancements are connecting users worldwide and making the latest features available and affordable for all markets:

• DRP: TI’s revolutionary DRP technology defined the single-chip market. This technology applies digital techniques to simplify radio frequency (RF) processing, and dramatically cut the cost and power consumption of wirelessly transmitting and receiving information. Scalable for 3G and beyond, TI’s DRP technology is well positioned to further drive the wireless single-chip revolution, taking single-chip solutions to new market segments.
• LoCosto: TI’s LoCosto family of scalable single-chip solutions range from supporting voice-only GSM phones with black and white displays to more advanced handsets with robust feature sets, including audio encoding like MP3 and AAC, Bluetooth solutions, multi-megapixel cameras, calendaring and more. TI is committed to delivering new DRP technology-based solutions, providing its customers with the flexibility to provide feature-rich phones to a broader market, including emerging wireless economies like parts of Latin America; India; China; Africa; and growing feature phone markets in Europe, Asia and the U.S.
• OMAP and OMAP-Vox: The OMAP-Vox hardware platform merges modem and application processing functionality onto the existing OMAP architecture, saving system space, cost and power, and allowing the use of a single hardware platform for products with air interfaces ranging from GSM/GPRS/EDGE to 3G/WCDMA, HSPA and beyond. In addition, a common software platform can be reused, saving years of software design effort. These features provide greater flexibility for customized designs, and bring overall development costs down, so manufacturers can quickly deliver 3G handsets.
• Mobile Connectivity Solutions: TI is accelerating the mobile connectivity revolution to change the way people use mobile phones, offering seamless connections across multiple wireless networks and technologies. TI offers the broadest portfolio of proven mobile connectivity technologies in the industry, including W-Fi, Bluetooth wireless technology, A-GPS, ultra-wideband (UWB) and radio frequency identification (RFID). The company also combines cellular systems expertise that empowers TI to deliver solutions optimized specifically to meet the demands of the handset environment.

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Positioned for Today and the Future

As the 3G market matures and “beyond 3G” technologies emerge, the mobile phone continues to transform from a trendy gadget to a must-have personal communication, information, entertainment and productivity device. TI’s technologies drive today’s handsets and will continue to make wireless innovative, entertaining and accessible in the future.

TI provides both 3G/WCDMA modems and OMAP processors to industry-leading handset manufacturers worldwide. As a result, TI leads the market in 3G/WCDMA digital basebands (Source: Cellular Handsets & Chip Markets report, Forward Concepts, May 2008). The company also invests in the future, including the development of solutions for High-Speed Packet Access (HSPA), a 3.5G standard that extends 3G/WCDMA data rates beyond 10 megabits per second (Mbps) for the downlink.

For technologies beyond 3G and HSPA, TI today is shipping custom products to large OEMs for HSDPA and WiMAX technologies. The company is developing several Orthogonal Frequency Division Multiplexing (OFDM)-based technologies, which offer a fundamental network throughput benefit over Code Divisional Multiple Access (CDMA) technologies and are expected to be applied in many future wireless systems. TI announced a custom engagement with Motorola for mobile WiMAX initiatives and expects handsets to be in the market in 2008. The company also is actively engaged with the 3GPP standards body regarding the development of Long Term Evolution (LTE) technology, and actively contributes to other industry standards bodies, including the WiMAX Forum and IEEE, to fully define what 4G technologies will encompass.