Connecting the unconnected
by Remi El-Ouzzane, General Manager, 2.5G Business,
Wireless Terminals Business Unit
Mobile phones are becoming an effective tool to “connect
the unconnected” with information, resources and,
simply, each other.
Wireless technology provides widespread voice and Internet
connectivity to millions who have never had these capabilities.
This segment, known as the low-cost or even the ultra
low-cost market, represents a significant global opportunity.
But it is not the only opportunity.
As handset costs decrease and multimedia gains broader
appeal, a wireless growth vector emerges with a new
breed of low-cost devices that will include rich multimedia
performance. To address this growing segment, we must
support integration of rapidly advancing multimedia
features.
TI addresses this need through continued achievements
in its single-chip technology. TI’s recently announced
single-chip OMAP-Vox™ EDGE product, the OMAPV1035
processor, leverages TI’s innovative DRP™
integrated digital Radio Frequency (RF) technology.
Codenamed “eCosto,” the solution combines
a cellular modem and applications processor in one chip
to bring video capture, playback and streaming, multimegapixel
digital cameras, color Liquid Crystal Displays (LCDs)
and interactive 2D/3D gaming to affordable phones for
the mass market.
As an industry, we must continue to push the functionality
envelope, offer more personalization opportunities and
provide a richer user experience. TI was the first company to introduce a single-chip
solution for GSM/GRPS mobile phones with its industry
groundbreaking “LoCosto” solution.
We’re now taking this pioneering solution a step
further with “eCosto” to make multimedia-rich
phones affordable for the masses. Great opportunities
are ahead for wireless, and together as an industry,
we can bring multimedia applications to the global market.
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