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MSP430F261x/MSP430F241x
64-/80-Pin High-End F16x/14x Upgrade
The 261x and 241x serve as a high-end pin and function-compatible migration path for customers using the 64-pin F16x and F14x families. On-chip memory has doubled to 120 kB, GPIO pin count is now 64 and performance has increased to 16 MIPS. In addition, there is 8 KB of RAM, 12-bit 200 kSPS ADC (two),
12-bit DAC, (two) USCI, DMA, MPY timer_A3/B7 and WDT+. These devices are compatible in price with their predecessors, the F16x and F14x.
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Applications: Sensor systems, industrial control applications, handheld meters |
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Package: 64-pin LQFP/TQFP, 80-pin LQFP |
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Recommended Development Tools:
MSP-FET430U64, MSP-FET430U80 |
MSP430F21x2
Coming in April 2008!
Built-in 16-bit timers, a fast 10-bit A/D converter with integrated reference and a data transfer controller (DTC), a comparator and built-in communication capability that uses USCI, and up to 24 I/O pins.
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Applications:
Smoke detectors, battery chargers, wireless security, wireless sensors |
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Package:
28-pin TSSOP, 32-pin QFN |
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Recommended
Development Tools:
MSP-FET430U28 |
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New MSP430 App Notes
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PMBus Implementation using the MSP430 USCI Abstract |
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MSP430 Capacitive Single-Touch Sensor Design Guide Abstract |
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CEC-to-I²C Bridge with the MSP430 Abstract |
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Extended Memory Access Using IAR v3.42A and CCE v2 Abstract |
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Migrating from MSP430F16x to MSP430F261x Abstract |
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Migrating from MSP430F13x/14x to MSP430F23x/24x Abstract |
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MSP430 and Connexions
Earn a Free eZ430-RF2500 Tool! Contribute Content to Connexions
TI would like your help in spreading knowledge about MSP430 devices by contributing a content module of unique information to Connexions. All you have to do is go to Connexions and create an account and a module, then submit the content using the form at the Web site below. Modules include everything from basic explanations of microcontroller architecture to student design projects and common MSP430 uses, plus complete course lessons and lab setups. See www.ti.com/msp430connexions to learn how your module can earn you a FREE eZ430-RF2500 development tool. |
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| 430 Day 2008 |
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| Free three-hour lunch-and-learn |
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You will get an MSP430 architecture overview, information on future generations, wireless applications and technical demonstrations |
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Register and attend to get your FREE eZ430-RF2500 low-power wireless development tool ($49 value) |
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Starts March 27, 2008 |
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Register today! |
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Sign Up for ZigBee® Training
The Low-Power RF and ZigBee Networking Workshop is the best way to get on the fast track to ZigBee success. This hands-on, three-day course will furnish a solid foundation in RF capabilities, MAC layer communications, OSAL/HAL usage, ZigBee networking and Z-Stack™-based product development. The class is taught by an experienced engineer and provides information, techniques and strategies you will not find elsewhere. Even if you are currently just evaluating ZigBee, our training course is designed to get you started the right way.
Upcoming trainings:
USA
March 11 San Jose, Calif.
April 15 Waltham, Mass.
Europe
March 11 Landshut, Germany
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TI Products to Use With MSP430 |
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The RF360, the smallest smart IC platform in the market, will integrate TI’s ultra-low-power MSP430 microcontroller, advanced embedded Ferroelectric Random Access Memory (FRAM) and high-performance RF Analog Front-End (AFE) technologies. Leveraging a low-power architecture and enhanced write capability, the RF360 smart IC platform will offer fast chip transaction speeds that will enable governments to quickly and efficiently produce a multitude of passive electronic identification (ID), such as electronic passports (e-passports) and national ID cards. (See www.ti.com/govid.)
Ultra-low-power architecture is critical to passive (non-battery) contactless applications, such as national IDs and e-passports. With the MSP430 microcontroller as an integral component of the RF360 technology architecture, government ID customers can leverage the world’s most power-efficient microcontroller, which is used in hundreds of low-power mobile products. The MSP430’s reduced instruction set significantly decreases the size of its software code compared to other microcontrollers on the market, driving faster transaction times and lower-power consumption.
TI’s RF360 employs an advanced embedded memory technology called FRAM, which improves the speed and reliability of future smart, secure e-passports and government ID documents. The technology produces a significant improvement over the non-volatile memory technologies used in current electronic government ID, such as Electrically Erasable Programmable Read-Only Memory (EEPROM) and Flash. The technology also offers major advantages in terms of transaction speed, power consumption and enhanced write data reliability.
For more information on how the RF360 platform leverages the advantages of embedded FRAM, please download “The Advantages of FRAM-Based Smart ICs for Next-Generation Government Electronic IDs” at www.ti.com/govidwp.
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