Anwendungshinweise für SMT und Gehäuse

Hier finden Sie eine Zusammenstellung von Dokumenten zur Oberflächenmontagetechnologie (Surface Mount Technology, SMT) von TI und Anwendungshinweise zu einer Vielzahl von Gehäusethemen.

DSBGA

NanoStar & NanoFree (PDF, 750 KB)
Micro SMD Wafer Level Chip Scale Package (klein) (PDF, 13,4 MB)
Laminate CSP – Anwendungshinweise (PDF, 28,9 MB)
Mounting of Surface Components (PDF, 5,6 MB)
Thermal Derating Curves for Logic-Products Packages (PDF, 70,5 KB)
WCSP Handling Guide (PDF, 944 KB)

QFN

Leadless Leadframe Package (LLP) Application Note (PDF, 20,8 MB)
Quad Flatpack No-Lead Logic Packages (PDF, 1,0 MB)
56Pin Quad Flatpack No-Lead Logic Package (PDF, 276 KB)
Design Guide 92NLA Array QFN (PDF, 1,1 KB)
Design Summary Multi-row Quad Flat No-lead (MRQFN) (PDF, 696 KB)
Micro SMDxt Wafer Level Chip Scale Package (large) (PDF, 6,1 KB)
QFN/SON PCB Attachment Application (PDF, 877 KB)
Reworking LLP Chip Scale Package (PDF, 146 KB)
Soldering requirements for BQFN (PDF, 753 KB)
Surface Mount Package Removal (PDF, 597 KB)

Gehäuse mit Anschlusspins

Land Pattern Recommendations (PDF, 161 KB)
PowerPAD Thermally enhanced package (PDF, 906 KB)

BGA

0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (PDF, 20,8 MB)
32 Bit Logic Familes in LFBGA Packages (PDF, 1,0 MB)
BGA Application Report for SMT (PDF, 276 KB)
Flip Chip BGA Package Reference (PDF, 1,1 KB)
nFBGA Packaging (PDF, 696 KB)
Plastic Ball Grid Array SMT Guideline (PDF, 877 KB)
Bumped Die Package (PDF, 146 KB)
PCB design guidelines for 0.4mm POP (Part 1) (PDF, 753 KB)
PCB design guidelines for 0.4mm POP (Part 2) (PDF, 906 KB)
TI OMAP POP SMT design guideline (PDF, 161 KB)
MicroStar BGA Packaging Reference Guide (PDF, 76 KB)

Sonstige Gehäuse

TO-92 (PDF, 48 KB)
FemtoFET SMT Guide (PDF, 13,4 KB)
Mounting Consideration for TO-3 Packages (PDF, 13,4 MB)
PowerFLEX Surface Mount Power Packaging (PDF, 90 KB)
PowerPaD Made Easy (PDF, 20,8 MB)
Thin Very Small-Outline Package TVSOP Application Report (PDF, 1,0 MB)
TO-247 (PDF, 1,1 KB)
TO-263 THIN Package (PDF, 276 KB)
HotRod Design Guide (PDF, 676 KB)

Allgemeine Gehäuseinformationen

Semiconductor Packaging Assembly Technology (PDF, 270 KB)
Absolute Maximum Ratings for Soldering (PDF, 5,4 MB)
Wave Solder Exposure of SMT Package (PDF, 878 KB)
External Lead Finish for Plastic Packages (PDF, 787 KB)
Handling & Process Recommendations (PDF, 324 KB)
Plastic Package Moisture-Induced Cracking (PDF, 565 KB)
Pb-free and Pb Compatibility (PDF, 3,2 MB)
Electrical Performance of Packages (PDF, 21,4 MB)

Gehäuse-Referenzhandbücher

Logic Packaging Migration (PDF, 654 KB)
Design Summary for MicroSiP - enabled TPS8267xSiP (PDF, 321 KB)
Analog and Logic Packaging (PDF, 213 KB)
PCB/Substrate Passive SMT Design Guidelines (PDF, 271 KB)

Bild, thermische & elektrische Gehäuse

Recent Advancements in Bus-Interface Packing and Processing (PDF, 546 KB)
K-Factor Test-Board Design Impact on Thermal Impedance Measurements (PDF, 787 KB)
Package Thermal Characterization Methodologies (PDF, 445 KB)
Thermal Calculation Tools for Analog Components (PDF, 544 KB)
Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs (PDF, 456 KB)
Thermal Characteristics of Standard Linear and Logic (SLL) Packages and Devices (PDF, 27,4 MB)
TMS320C6x Thermal Design Considerations (PDF, 2,1 MB)
Thermal Calculator Application Note (PDF, 112 KB)
IC Package Thermal Metrics (PDF, 211 KB)
A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (PDF, 672 KB)
Understanding IC Package Power Capabilities (PDF, 546 KB)
Thermal Reference Sheet Analog (PDF, 201 KB)
How to Use a PowerPad Device (PDF, 13,4 MB)
How to use Psi-JT to calculate Junction Temperature (PDF, 279 KB)
Using Thermal Metrics for Power Devices (PDF, 546 KB)