Solution Description & Supported Functionality

GK-5432 is the world's first ARM Cortex-A15-based computer on module based on the industry new ULP COM standard. Supported by a product longevity program, it can provide up to 10 years supply starting in 2013. The GK-5432 is highest performance computer module in the standard dedicated for ARM and SoCs, named ULP-COM. Based on the high-performance OMAP5432 processor from TI, the GK-5432 makes it possible to build more intelligent devices with versatile multimedia support, and provides the path for high-performance upgrades in the future. The OMAP5432 processor inside the ULP COM module GK-5432 offers dual-core ARM Cortex-A15 performance to drive multimedia-rich industrial designs. The processor includes Imagination Technologies POWERVR SGX544-MPx 3D engine for best-in-class graphics, along with dual Cortex-M4 cores for image and vision processing control. It supports up to 20MP cameras, as well as unique camera functionalities such as hardware-enabled, real-time face detection. A HD multimedia accelerator can perform video playback in full HD (1080p60fps or 1080p30fps) and 3D, which is vital for graphics-intense industrial applications.

Benefits

• - Minimized total cost of ownership and product deployment risk by following industry open standard (ULP COM from SGeT industry associate) - Ready-to-use computer module for time to market - Scalable and flexible for system upgrade - High performance yet versatile small form factor computing module for broader industrial or commercial applications

System On Module (SOM) Parameters

Price	N/A due to no price information for OMAP 5
ATCA	NA
Form Factor	82 x 80
Max Memory Supported (MB)	4GB
Max NAND (MB)	8GB
Max NOR (MB)	N/A
Max RAM (MB)	4GB
O/S Support	Windows RT
Connectivity Interfaces	Ethernet WiFi Bluetooth
Commercial Range	Y
Extended Range	NA
Industrial Range	NA
Framework/Middleware

System On Module (SOM) Details

Has the complete system been tested?	NA
Is working hardware available?	No
Is working software available?	No
Trade-off Analysis	- OMAP 5 low power consumption to meet most of industrial mobile devices' requirements
Development Tools	- TI Generic Linux SDK for OMAP processors - TI Android BSP
Component Selection	OMAP5432, TWL603x

Design & Manufacturing Details

Customized Engineering Design Services
Design services that apply to this solution

• Electrical Design
• Software (Application)
• Software (Embedded)
• Mechanical Design
• Thermal
• System Integration
• Certification -  FCC , CE

Manufacturing Services
Manufacturing Services that apply to this solution

• Prototyping
• Low-Volume Or Pilot Runs
• High-Volume Or Mass Production
• Turnkey Product Design/ODM/CDM Services

Supported Business Model

Product Sale

Documentation

A list and links to documentation relevant to the solution, including schematics, board layout suggestions.

• Datasheets - http://www.greenbaseT.com