Genral Computer on module in a new industrial standard ULP COM (System On Module (SOM))

NEXCOM International Co., Ltd.

Description

Documentation

Business Model

Support Information


Solution Description & Supported Functionality

GK-5432 is the world's first ARM Cortex-A15-based computer on module based on the industry new ULP COM standard. Supported by a product longevity program, it can provide up to 10 years supply starting in 2013. The GK-5432 is highest performance computer module in the standard dedicated for ARM and SoCs, named ULP-COM. Based on the high-performance OMAP5432 processor from TI, the GK-5432 makes it possible to build more intelligent devices with versatile multimedia support, and provides the path for high-performance upgrades in the future. The OMAP5432 processor inside the ULP COM module GK-5432 offers dual-core ARM Cortex-A15 performance to drive multimedia-rich industrial designs. The processor includes Imagination Technologies POWERVR SGX544-MPx 3D engine for best-in-class graphics, along with dual Cortex-M4 cores for image and vision processing control. It supports up to 20MP cameras, as well as unique camera functionalities such as hardware-enabled, real-time face detection. A HD multimedia accelerator can perform video playback in full HD (1080p60fps or 1080p30fps) and 3D, which is vital for graphics-intense industrial applications.

Benefits
  • - Minimized total cost of ownership and product deployment risk by following industry open standard (ULP COM from SGeT industry associate) - Ready-to-use computer module for time to market - Scalable and flexible for system upgrade - High performance yet versatile small form factor computing module for broader industrial or commercial applications

System On Module (SOM) Parameters
Price N/A due to no price information for OMAP 5
ATCA NA
Form Factor 82 x 80
Max Memory Supported (MB) 4GB
Max NAND (MB) 8GB
Max NOR (MB) N/A
Max RAM (MB) 4GB
O/S Support Windows RT
Connectivity Interfaces Ethernet WiFi Bluetooth
Commercial Range Y
Extended Range NA
Industrial Range NA
Framework/Middleware
System On Module (SOM) Details

Has the complete system been tested? NA
Is working hardware available? No
Is working software available? No
Trade-off Analysis - OMAP 5 low power consumption to meet most of industrial mobile devices' requirements
Development Tools - TI Generic Linux SDK for OMAP processors - TI Android BSP
Component Selection OMAP5432, TWL603x
Design & Manufacturing Details

Customized Engineering Design Services
Design services that apply to this solution

  • Electrical Design
  • Software (Application)
  • Software (Embedded)
  • Mechanical Design
  • Thermal
  • System Integration
  • Certification -  FCC , CE

Manufacturing Services
Manufacturing Services that apply to this solution

  • Prototyping
  • Low-Volume Or Pilot Runs
  • High-Volume Or Mass Production
  • Turnkey Product Design/ODM/CDM Services
Supported Business Model

Product Sale

Documentation

A list and links to documentation relevant to the solution, including schematics, board layout suggestions.



TI Product Family Used in the Solution
  • Bluetooth technology
  • Mesh and IP Networks
  • OMAP™ 5 Processors
  • OMAP™ Applications Processors
  • OMAP™ Processors
  • Personal Area Networks
  • Wi-Fi (IEEE 802.11 / WLAN)
  • Wireless Connectivity
Support Information

A list and links to documentation relevant to the solution, including schematics, board layout suggestions.

Sales Contact
Kelly  Chang
886-2-82267796-1311
http://www.nexcom.com.tw
kelly.chang@greenbaset.com

Headquarters
15F, No.922, Chung-Cheng Rd., Zonghe Dist.
New Taipei City, Taiwan
886-2-82267786
886-2-82267926


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