SBAS970 October   2019 ADS1235-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Block Diagram
      2.      ADC Conversion Noise
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Noise Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Inputs
        1. 8.3.1.1 ESD Diodes
        2. 8.3.1.2 Input Multiplexer
        3. 8.3.1.3 Temperature Sensor
        4. 8.3.1.4 Inputs Open
        5. 8.3.1.5 Internal VCOM Connection
        6. 8.3.1.6 Alternate Functions
      2. 8.3.2 PGA
        1. 8.3.2.1 Input Voltage Range
        2. 8.3.2.2 PGA Bypass Mode
      3. 8.3.3 PGA Voltage Monitor
      4. 8.3.4 Reference Voltage
        1. 8.3.4.1 External Reference
        2. 8.3.4.2 AVDD – AVSS Reference (Default)
        3. 8.3.4.3 Reference Monitor
      5. 8.3.5 General-Purpose Input/Outputs (GPIOs)
      6. 8.3.6 Modulator
      7. 8.3.7 Digital Filter
        1. 8.3.7.1 Sinc Filter
          1. 8.3.7.1.1 Sinc Filter Frequency Response
        2. 8.3.7.2 FIR Filter
          1. 8.3.7.2.1 FIR Filter Frequency Response
        3. 8.3.7.3 Filter Bandwidth
        4. 8.3.7.4 50-Hz and 60-Hz Normal Mode Rejection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Conversion Control
        1. 8.4.1.1 Continuous-Conversion Mode
        2. 8.4.1.2 Pulse-Conversion Mode
        3. 8.4.1.3 Conversion Latency
        4. 8.4.1.4 Start-Conversion Delay
      2. 8.4.2 Chop Mode
      3. 8.4.3 AC-Bridge Excitation Mode
      4. 8.4.4 ADC Clock Mode
      5. 8.4.5 Power-Down Mode
        1. 8.4.5.1 Hardware Power-Down
        2. 8.4.5.2 Software Power-Down
      6. 8.4.6 Reset
        1. 8.4.6.1 Power-on Reset
        2. 8.4.6.2 Reset by Pin
        3. 8.4.6.3 Reset by Command
      7. 8.4.7 Calibration
        1. 8.4.7.1 Offset and Full-Scale Calibration
          1. 8.4.7.1.1 Offset Calibration Registers
          2. 8.4.7.1.2 Full-Scale Calibration Registers
        2. 8.4.7.2 Offset Self-Calibration (SFOCAL)
        3. 8.4.7.3 Offset System-Calibration (SYOCAL)
        4. 8.4.7.4 Full-Scale Calibration (GANCAL)
        5. 8.4.7.5 Calibration Command Procedure
        6. 8.4.7.6 User Calibration Procedure
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Chip Select (CS)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Data Input (DIN)
        4. 8.5.1.4 Data Output/Data Ready (DOUT/DRDY)
        5. 8.5.1.5 Serial Interface Auto-Reset
      2. 8.5.2 Data Ready (DRDY)
        1. 8.5.2.1 DRDY in Continuous-Conversion Mode
        2. 8.5.2.2 DRDY in Pulse-Conversion Mode
        3. 8.5.2.3 Data Ready by Software Polling
      3. 8.5.3 Conversion Data
        1. 8.5.3.1 Status byte (STATUS)
        2. 8.5.3.2 Conversion Data Format
      4. 8.5.4 CRC
      5. 8.5.5 Commands
        1. 8.5.5.1  NOP Command
        2. 8.5.5.2  RESET Command
        3. 8.5.5.3  START Command
        4. 8.5.5.4  STOP Command
        5. 8.5.5.5  RDATA Command
        6. 8.5.5.6  SYOCAL Command
        7. 8.5.5.7  GANCAL Command
        8. 8.5.5.8  SFOCAL Command
        9. 8.5.5.9  RREG Command
        10. 8.5.5.10 WREG Command
        11. 8.5.5.11 LOCK Command
        12. 8.5.5.12 UNLOCK Command
    6. 8.6 Register Map
      1. 8.6.1  Device Identification (ID) Register (address = 00h) [reset = Cxh]
        1. Table 28. ID Register Field Descriptions
      2. 8.6.2  Device Status (STATUS) Register (address = 01h) [reset = 01h]
        1. Table 29. STATUS Register Field Descriptions
      3. 8.6.3  Mode 0 (MODE0) Register (address = 02h) [reset = 24h]
        1. Table 30. MODE0 Register Field Descriptions
      4. 8.6.4  Mode 1 (MODE1) Register (address = 03h) [reset = 01h]
        1. Table 31. MODE1 Register Field Descriptions
      5. 8.6.5  Mode 2 (MODE2) Register (address = 04h) [reset = 00h]
        1. Table 32. MODE2 Register Field Descriptions
      6. 8.6.6  Mode 3 (MODE3) Register (address = 05h) [reset = 00h]
        1. Table 33. MODE3 Register Field Descriptions
      7. 8.6.7  Reference Configuration (REF) Register (address = 06h) [reset = 05h]
        1. Table 34. REF Register Field Descriptions
      8. 8.6.8  Offset Calibration (OFCALx) Registers (address = 07h, 08h, 09h) [reset = 00h, 00h, 00h]
        1. Table 35. OFCAL0, OFCAL1, OFCAL2 Registers Field Description
      9. 8.6.9  Full-Scale Calibration (FSCALx) Registers (address = 0Ah, 0Bh, 0Ch) [reset = 00h, 00h, 40h]
        1. Table 36. FSCAL0, FSCAL1, FSCAL2 Registers Field Description
      10. 8.6.10 Reserved (RESERVED) Register (address = 0Dh) [reset = FFh]
        1. Table 37. RESERVED Register Field Descriptions
      11. 8.6.11 Reserved (RESERVED) Register (address = 0Eh) [reset = 00h]
        1. Table 38. RESERVED Register Field Descriptions
      12. 8.6.12 Reserved (RESERVED) Register (address = 0Fh) [reset = 00h]
        1. Table 39. RESERVED Register Field Descriptions
      13. 8.6.13 PGA Configuration (PGA) Register (address = 10h) [reset = 00h]
        1. Table 40. PGA Register Field Descriptions
      14. 8.6.14 Input Multiplexer (INPMUX) Register (address = 11h) [reset = FFh]
        1. Table 41. INPMUX Register Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Range
      2. 9.1.2 Input Overload
      3. 9.1.3 Unused Inputs and Outputs
      4. 9.1.4 Multiplexed 2-Bridge Input Example
      5. 9.1.5 AC-Bridge Excitation Example
      6. 9.1.6 Serial Interface and Digital Connections
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Initialization Setup
  10. 10Power Supply Recommendations
    1. 10.1 Power-Supply Decoupling
    2. 10.2 Analog Power-Supply Clamp
    3. 10.3 Power-Supply Sequencing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1.3 Conversion Latency

The digital filter averages data from the modulator in order to produce the conversion result. The stages of the digital filter must have settled data in order to provide fully-settled output data. The order and the decimation ratio of the digital filter determine the amount of data averaged, and in turn, affect the latency of the conversion data. The FIR and sinc1 filter modes are zero latency because the ADC provides the conversion result in one conversion cycle. Latency time is an important consideration for the data throughput rate in multiplexed applications.

Table 6 lists the conversion latency values of the ADC. Conversion latency is defined as the time from the start of the first conversion, by taking the START pin high or sending the START command, to the time when fully settled conversion data are ready. If the input signal is settled, then the ADC provides fully settled data. The conversion latency values listed in the table are with the start-conversion delay parameter = 50 µs, and include the overhead time needed to process the data. After the first conversion completes (in continuous conversion mode), the period of the following conversions are equal to 1/fDATA. The first conversion latency in chop and ac-excitation modes are twice the values listed in the table. Also when operating in these modes, the period of following conversions are equal to the values listed in the table.

Table 6. Conversion Latency

DATA RATE
(SPS)		 CONVERSION LATENCY - t(STDR)(1) (ms)
FIR SINC1 SINC2 SINC3 SINC4
2.5 402.2 400.4 800.4 1,200 1,600
5 202.2 200.4 400.4 600.4 800.4
10 102.2 100.4 200.4 300.4 400.4
16.6 — 60.43 120.4 180.4 240.4
20 52.23 50.43 100.4 150.4 200.4
50 — 20.43 40.43 60.43 80.43
60 — 17.09 33.76 50.43 67.09
100 — 10.43 20.43 30.43 40.43
400 — 2.925 5.425 7.925 10.43
1200 — 1.258 2.091 2.925 3.758
2400 — 0.841 1.258 1.675 2.091
4800 — 0.633 0.841 1.050 1.258
7200 — 0.564 0.702 0.841 0.980
(1) Chop mode off, conversion-start delay = 50 µs (DELAY[3:0] = 0001)

If the input signal changes while free-running conversions, the conversion data are a mix of old and new data, as shown in Figure 58. After an input change, the number of conversion periods required for fully settled data are determined by dividing the conversion latency by the period of the data rate, plus add one conversion period to the result. In chop and ac-bridge excitation modes, use twice the latency values listed in the table.

ADS1235-Q1 ai_freerun_conv_delay_sbas760.gifFigure 58. Input Change During Conversions