SBAS426H August   2008  – March 2016 ADS1246 , ADS1247 , ADS1248

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Timing Requirements
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  ADC Input and Multiplexer
      2. 9.3.2  Low-Noise PGA
        1. 9.3.2.1 PGA Common-Mode Voltage Requirements
        2. 9.3.2.2 PGA Common-Mode Voltage Calculation Example
        3. 9.3.2.3 Analog Input Impedance
      3. 9.3.3  Clock Source
      4. 9.3.4  Modulator
      5. 9.3.5  Digital Filter
      6. 9.3.6  Voltage Reference Input
      7. 9.3.7  Internal Voltage Reference
      8. 9.3.8  Excitation Current Sources
      9. 9.3.9  Sensor Detection
      10. 9.3.10 Bias Voltage Generation
      11. 9.3.11 General-Purpose Digital I/O
      12. 9.3.12 System Monitor
        1. 9.3.12.1 Power-Supply Monitor
        2. 9.3.12.2 External Voltage Reference Monitor
        3. 9.3.12.3 Ambient Temperature Monitor
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power Up
      2. 9.4.2 Reset
      3. 9.4.3 Power-Down Mode
      4. 9.4.4 Conversion Control
        1. 9.4.4.1 Settling Time for Channel Multiplexing
        2. 9.4.4.2 Channel Cycling and Overload Recovery
        3. 9.4.4.3 Single-Cycle Settling
        4. 9.4.4.4 Digital Filter Reset Operation
      5. 9.4.5 Calibration
        1. 9.4.5.1 Offset Calibration Register: OFC[2:0]
        2. 9.4.5.2 Full-Scale Calibration Register: FSC[2:0]
        3. 9.4.5.3 Calibration Commands
          1. 9.4.5.3.1 System Offset and Self Offset Calibration
          2. 9.4.5.3.2 System Gain Calibration
        4. 9.4.5.4 Calibration Timing
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Chip Select (CS)
        2. 9.5.1.2 Serial Clock (SCLK)
        3. 9.5.1.3 Data Input (DIN)
        4. 9.5.1.4 Data Ready (DRDY)
        5. 9.5.1.5 Data Output and Data Ready (DOUT/DRDY)
        6. 9.5.1.6 SPI Reset
        7. 9.5.1.7 SPI Communication During Power-Down Mode
      2. 9.5.2 Data Format
      3. 9.5.3 Commands
        1. 9.5.3.1  WAKEUP (0000 000x)
        2. 9.5.3.2  SLEEP (0000 001x)
        3. 9.5.3.3  SYNC (0000 010x)
        4. 9.5.3.4  RESET (0000 011X)
        5. 9.5.3.5  RDATA (0001 001x)
        6. 9.5.3.6  RDATAC (0001 010x)
        7. 9.5.3.7  SDATAC (0001 011x)
        8. 9.5.3.8  RREG (0010 rrrr, 0000 nnnn)
        9. 9.5.3.9  WREG (0100 rrrr, 0000 nnnn)
        10. 9.5.3.10 SYSOCAL (0110 0000)
        11. 9.5.3.11 SYSGCAL (0110 0001)
        12. 9.5.3.12 SELFOCAL (0110 0010)
        13. 9.5.3.13 NOP (1111 1111)
        14. 9.5.3.14 Restricted Command (1111 0001)
    6. 9.6 Register Maps
      1. 9.6.1 ADS1246 Register Map
      2. 9.6.2 ADS1246 Detailed Register Definitions
        1. 9.6.2.1 BCS—Burn-out Current Source Register (offset = 00h) [reset = 01h]
        2. 9.6.2.2 VBIAS—Bias Voltage Register (offset = 01h) [reset = 00h]
        3. 9.6.2.3 MUX—Multiplexer Control Register (offset = 02h) [reset = x0h]
        4. 9.6.2.4 SYS0—System Control Register 0 (offset = 03h) [reset = 00h]
        5. 9.6.2.5 OFC—Offset Calibration Coefficient Registers (offset = 04h, 05h, 06h) [reset = 00h, 00h, 00h]
        6. 9.6.2.6 FSC—Full-Scale Calibration Coefficient Registers (offset = 07h, 08h, 09h) [reset = PGA dependent]
        7. 9.6.2.7 ID—ID Register (offset = 0Ah) [reset = x0h]
      3. 9.6.3 ADS1247 and ADS1248 Register Map
      4. 9.6.4 ADS1247 and ADS1248 Detailed Register Definitions
        1. 9.6.4.1  MUX0—Multiplexer Control Register 0 (offset = 00h) [reset = 01h]
        2. 9.6.4.2  VBIAS—Bias Voltage Register (offset = 01h) [reset = 00h]
        3. 9.6.4.3  MUX1—Multiplexer Control Register 1 (offset = 02h) [reset = x0h]
        4. 9.6.4.4  SYS0—System Control Register 0 (offset = 03h) [reset = 00h]
        5. 9.6.4.5  OFC—Offset Calibration Coefficient Register (offset = 04h, 05h, 06h) [reset = 00h, 00h, 00h]
        6. 9.6.4.6  FSC—Full-Scale Calibration Coefficient Register (offset = 07h, 08h, 09h) [reset = PGA dependent]
        7. 9.6.4.7  IDAC0—IDAC Control Register 0 (offset = 0Ah) [reset = x0h]
        8. 9.6.4.8  IDAC1—IDAC Control Register 1 (offset = 0Bh) [reset = FFh]
        9. 9.6.4.9  GPIOCFG—GPIO Configuration Register (offset = 0Ch) [reset = 00h]
        10. 9.6.4.10 GPIODIR—GPIO Direction Register (offset = 0Dh) [reset = 00h]
        11. 9.6.4.11 GPIODAT—GPIO Data Register (offset = 0Eh) [reset = 00h]
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Serial Interface Connections
      2. 10.1.2 Analog Input Filtering
      3. 10.1.3 External Reference and Ratiometric Measurements
      4. 10.1.4 Establishing a Proper Common-Mode Input Voltage
      5. 10.1.5 Isolated (or Floating) Sensor Inputs
      6. 10.1.6 Unused Inputs and Outputs
      7. 10.1.7 Pseudo Code Example
      8. 10.1.8 Channel Multiplexing Example
      9. 10.1.9 Power-Down Mode Example
    2. 10.2 Typical Applications
      1. 10.2.1 Ratiometric 3-Wire RTD Measurement System
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Topology
          2. 10.2.1.2.2 RTD Selection
          3. 10.2.1.2.3 Excitation Current
          4. 10.2.1.2.4 Reference Resistor RREF
          5. 10.2.1.2.5 PGA Setting
          6. 10.2.1.2.6 Common-Mode Input Range
          7. 10.2.1.2.7 Input and Reference Low-Pass Filters
          8. 10.2.1.2.8 Register Settings
        3. 10.2.1.3 Application Curves
      2. 10.2.2 K-Type Thermocouple Measurement (-200°C to +1250°C) with Cold-Junction Compensation
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Biasing Resistors
          2. 10.2.2.2.2 Input Filtering
          3. 10.2.2.2.3 PGA Setting
          4. 10.2.2.2.4 Cold-Junction Measurement
          5. 10.2.2.2.5 Calculated Resolution
          6. 10.2.2.2.6 Register Settings
    3. 10.3 Do's and Don'ts
  11. 11Power-Supply Recommendations
    1. 11.1 Power-Supply Sequencing
    2. 11.2 Power-Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

For related documentation see the following:

  • Example Temperature Measurement Applications Using the ADS1247 and ADS1248, SBAA180
  • RTD Ratiometric Measurements and Filtering Using the ADS1148 and ADS1248 Family of Devices, SBAA201
  • 3-Wire RTD Measurement System Reference Design, –200°C to 850°C, SLAU520
  • A Glossary of Analog-to-Digital Specifications and Performance Characteristics, SBAA147

13.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 54. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
ADS1246 Click here Click here Click here Click here Click here
ADS1247 Click here Click here Click here Click here Click here
ADS1248 Click here Click here Click here Click here Click here

13.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.4 Trademarks

E2E is a trademark of Texas Instruments.

SPI is a trademark of Motorola, Inc.

All other trademarks are the property of their respective owners.

13.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

13.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.