SBAS834A April   2017  – April 2017 ADS8584S

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Family Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: CONVST Control
    7. 7.7  Timing Requirements: Data Read Operation
    8. 7.8  Timing Requirements: Parallel Data Read Operation, CS and RD Tied Together
    9. 7.9  Timing Requirements: Parallel Data Read Operation, CS and RD Separate
    10. 7.10 Timing Requirements: Serial Data Read Operation
    11. 7.11 Timing Requirements: Byte Mode Data Read Operation
    12. 7.12 Timing Requirements: Oversampling Mode
    13. 7.13 Timing Requirements: Exit Standby Mode
    14. 7.14 Timing Requirements: Exit Shutdown Mode
    15. 7.15 Switching Characteristics: CONVST Control
    16. 7.16 Switching Characteristics: Parallel Data Read Operation, CS and RD Tied Together
    17. 7.17 Switching Characteristics: Parallel Data Read Operation, CS and RD Separate
    18. 7.18 Switching Characteristics: Serial Data Read Operation
    19. 7.19 Switching Characteristics: Byte Mode Data Read Operation
    20. 7.20 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Inputs
      2. 8.3.2 Analog Input Impedance
      3. 8.3.3 Input Clamp Protection Circuit
      4. 8.3.4 Programmable Gain Amplifier (PGA)
      5. 8.3.5 Third-Order, Low-Pass Filter (LPF)
      6. 8.3.6 ADC Driver
      7. 8.3.7 Digital Filter and Noise
      8. 8.3.8 Reference
        1. 8.3.8.1 Internal Reference
        2. 8.3.8.2 External Reference
        3. 8.3.8.3 Supplying One VREF to Multiple Devices
      9. 8.3.9 ADC Transfer Function
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Interface: Pin Description
        1. 8.4.1.1  REFSEL (Input)
        2. 8.4.1.2  RANGE (Input)
        3. 8.4.1.3  STBY (Input)
        4. 8.4.1.4  PAR/SER/BYTE SEL (Input)
        5. 8.4.1.5  CONVSTA, CONVSTB (Input)
        6. 8.4.1.6  RESET (Input)
        7. 8.4.1.7  RD/SCLK (Input)
        8. 8.4.1.8  CS (Input)
        9. 8.4.1.9  OS[2:0]
        10. 8.4.1.10 BUSY (Output)
        11. 8.4.1.11 FRSTDATA (Output)
        12. 8.4.1.12 DB15/BYTE SEL
        13. 8.4.1.13 DB14/HBEN
        14. 8.4.1.14 DB[13:9]
        15. 8.4.1.15 DB8/DOUTB
        16. 8.4.1.16 DB7/DOUTA
        17. 8.4.1.17 DB[6:0]
      2. 8.4.2 Device Modes of Operation
        1. 8.4.2.1 Power-Down Modes
          1. 8.4.2.1.1 Standby Mode
          2. 8.4.2.1.2 Shutdown Mode
        2. 8.4.2.2 Conversion Control
          1. 8.4.2.2.1 Simultaneous Sampling on All Input Channels
          2. 8.4.2.2.2 Simultaneous Sampling Two Sets of Input Channels
        3. 8.4.2.3 Data Read Operation
          1. 8.4.2.3.1 Parallel Data Read
          2. 8.4.2.3.2 Parallel Byte Data Read
          3. 8.4.2.3.3 Serial Data Read
          4. 8.4.2.3.4 Data Read During Conversion
        4. 8.4.2.4 Oversampling Mode of Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 4-Channel, Data Acquisition System (DAQ) for Power Automation
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation see the following:

12.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.