SLASEQ7E May   2018  – March 2019 AFE7681 , AFE7683 , AFE7684 , AFE7685 , AFE7686

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
  4. 4Device and Documentation Support
    1. 4.1 Device Support
      1. 4.1.1 Third-Party Products Disclaimer
    2. 4.2 Documentation Support
      1. 4.2.1 Related Documentation
    3. 4.3 Related Links
    4. 4.4 Community Resources
    5. 4.5 Trademarks
    6. 4.6 Electrostatic Discharge Caution
    7. 4.7 Export Control Notice
    8. 4.8 Glossary
  5. 5Mechanical, Packaging, and Orderable Information
    1. 5.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.