SPRS657F February   2010  – January 2017 AM1705

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Device Characteristics
    2. 3.2 Device Compatibility
    3. 3.3 ARM Subsystem
      1. 3.3.1 ARM926EJ-S RISC CPU
      2. 3.3.2 CP15
      3. 3.3.3 MMU
      4. 3.3.4 Caches and Write Buffer
      5. 3.3.5 Advanced High-Performance Bus (AHB)
      6. 3.3.6 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)
      7. 3.3.7 ARM Memory Mapping
    4. 3.4 Memory Map Summary
    5. 3.5 Pin Assignments
      1. 3.5.1 Pin Map (Bottom View)
    6. 3.6 Terminal Functions
      1. 3.6.1  Device Reset and JTAG
      2. 3.6.2  High-Frequency Oscillator and PLL
      3. 3.6.3  External Memory Interface A (ASYNC)
      4. 3.6.4  External Memory Interface B (SDRAM only)
      5. 3.6.5  Serial Peripheral Interface Modules (SPI0, SPI1)
      6. 3.6.6  Enhanced Capture/Auxiliary PWM Modules (eCAP0, eCAP1, eCAP2)
      7. 3.6.7  Enhanced Pulse Width Modulators (eHRPWM0, eHRPWM1, eHRPWM2)
      8. 3.6.8  Enhanced Quadrature Encoder Pulse Module (eQEP)
      9. 3.6.9  Boot
      10. 3.6.10 Universal Asynchronous Receiver/Transmitters (UART0, UART1, UART2)
      11. 3.6.11 Inter-Integrated Circuit Modules(I2C0, I2C1)
      12. 3.6.12 Timers
      13. 3.6.13 Multichannel Audio Serial Ports (McASP0, McASP1)
      14. 3.6.14 Universal Serial Bus Modules (USB0)
      15. 3.6.15 Ethernet Media Access Controller (EMAC)
      16. 3.6.16 Multimedia Card/Secure Digital (MMC/SD)
      17. 3.6.17 Reserved and No Connect
      18. 3.6.18 Supply and Ground
      19. 3.6.19 Unused USB0 (USB2.0) Pin Configurations
  4. 4Device Configuration
    1. 4.1 Boot Modes
    2. 4.2 SYSCFG Module
    3. 4.3 Pullup/Pulldown Resistors
  5. 5Device Operating Conditions
    1. 5.1 Absolute Maximum Ratings Over Operating Junction Temperature Range (Unless Otherwise Noted)
    2. 5.2 Handling Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Notes on Recommended Power-On Hours (POH)
    5. 5.5 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Junction Temperature (Unless Otherwise Noted)
  6. 6Peripheral Information and Electrical Specifications
    1. 6.1  Parameter Information
      1. 6.1.1 Parameter Information Device-Specific Information
        1. 6.1.1.1 Signal Transition Levels
    2. 6.2  Recommended Clock and Control Signal Transition Behavior
    3. 6.3  Power Supplies
      1. 6.3.1 Power-on Sequence
      2. 6.3.2 Power-off Sequence
    4. 6.4  Reset
      1. 6.4.1 Power-On Reset (POR)
      2. 6.4.2 Warm Reset
      3. 6.4.3 Reset Electrical Data Timings
    5. 6.5  Crystal Oscillator or External Clock Input
    6. 6.6  Clock PLLs
      1. 6.6.1 PLL Device-Specific Information
      2. 6.6.2 Device Clock Generation
      3. 6.6.3 PLL Controller 0 Registers
    7. 6.7  Interrupts
      1. 6.7.1 ARM CPU Interrupts
        1. 6.7.1.1 ARM Interrupt Controller (AINTC) Interrupt Signal Hierarchy
        2. 6.7.1.2 AINTC Hardware Vector Generation
        3. 6.7.1.3 AINTC Hardware Interrupt Nesting Support
        4. 6.7.1.4 AINTC System Interrupt Assignments on the device
        5. 6.7.1.5 AINTC Memory Map
    8. 6.8  General-Purpose Input/Output (GPIO)
      1. 6.8.1 GPIO Register Description(s)
      2. 6.8.2 GPIO Peripheral Input/Output Electrical Data/Timing
      3. 6.8.3 GPIO Peripheral External Interrupts Electrical Data/Timing
    9. 6.9  EDMA
    10. 6.10 External Memory Interface A (EMIFA)
      1. 6.10.1 EMIFA Asynchronous Memory Support
      2. 6.10.2 EMIFA Connection Examples
      3. 6.10.3 External Memory Interface A (EMIFA) Registers
      4. 6.10.4 EMIFA Electrical Data/Timing
    11. 6.11 External Memory Interface B (EMIFB)
      1. 6.11.1 EMIFB SDRAM Loading Limitations
      2. 6.11.2 Interfacing to SDRAM
      3. 6.11.3 EMIFB Registers
      4. 6.11.4 EMIFB Electrical Data/Timing
    12. 6.12 Memory Protection Units
    13. 6.13 MMC / SD / SDIO (MMCSD)
      1. 6.13.1 MMCSD Peripheral Description
      2. 6.13.2 MMCSD Peripheral Register Description(s)
      3. 6.13.3 MMC/SD Electrical Data/Timing
    14. 6.14 Ethernet Media Access Controller (EMAC)
      1. 6.14.1 EMAC Peripheral Register Description(s)
    15. 6.15 Management Data Input/Output (MDIO)
      1. 6.15.1 MDIO Registers
      2. 6.15.2 Management Data Input/Output (MDIO) Electrical Data/Timing
    16. 6.16 Multichannel Audio Serial Ports (McASP0, McASP1)
      1. 6.16.1 McASP Peripheral Registers Description(s)
      2. 6.16.2 McASP Electrical Data/Timing
        1. 6.16.2.1 Multichannel Audio Serial Port 0 (McASP0) Timing
        2. 6.16.2.2 Multichannel Audio Serial Port 1 (McASP1) Timing
    17. 6.17 Serial Peripheral Interface Ports (SPI0, SPI1)
      1. 6.17.1 SPI Peripheral Registers Description(s)
      2. 6.17.2 SPI Electrical Data/Timing
        1. 6.17.2.1 Serial Peripheral Interface (SPI) Timing
    18. 6.18 Enhanced Capture (eCAP) Peripheral
    19. 6.19 Enhanced Quadrature Encoder (eQEP) Peripheral
    20. 6.20 Enhanced High-Resolution Pulse-Width Modulator (eHRPWM)
      1. 6.20.1 Enhanced Pulse Width Modulator (eHRPWM) Timing
      2. 6.20.2 Trip-Zone Input Timing
    21. 6.21 Timers
      1. 6.21.1 Timer Electrical Data/Timing
    22. 6.22 Inter-Integrated Circuit Serial Ports (I2C0, I2C1)
      1. 6.22.1 I2C Device-Specific Information
      2. 6.22.2 I2C Peripheral Registers Description(s)
      3. 6.22.3 I2C Electrical Data/Timing
        1. 6.22.3.1 Inter-Integrated Circuit (I2C) Timing
    23. 6.23 Universal Asynchronous Receiver/Transmitter (UART)
      1. 6.23.1 UART Peripheral Registers Description(s)
      2. 6.23.2 UART Electrical Data/Timing
    24. 6.24 USB0 OTG (USB2.0 OTG)
      1. 6.24.1 USB2.0 (USB0) Electrical Data/Timing
      2. 6.24.2 USB0 Unused Signal Configuration
    25. 6.25 Power and Sleep Controller (PSC)
      1. 6.25.1 Power Domain and Module Topology
        1. 6.25.1.1 Power Domain States
        2. 6.25.1.2 Module States
    26. 6.26 Programmable Real-Time Unit Subsystem (PRUSS)
      1. 6.26.1 PRUSS Register Descriptions
    27. 6.27 Emulation Logic
      1. 6.27.1 JTAG Port Description
      2. 6.27.2 Scan Chain Configuration Parameters
      3. 6.27.3 Initial Scan Chain Configuration
        1. 6.27.3.1 Adding TAPS to the Scan Chain
      4. 6.27.4 JTAG 1149.1 Boundary Scan Considerations
    28. 6.28 IEEE 1149.1 JTAG
      1. 6.28.1 JTAG Peripheral Register Description(s) - JTAG ID Register (DEVIDR0)
      2. 6.28.2 JTAG Test-Port Electrical Data/Timing
  7. 7Device and Documentation Support
    1. 7.1 Device Nomenclature
    2. 7.2 Tools and Software
    3. 7.3 Documentation Support
    4. 7.4 Community Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Export Control Notice
    8. 7.8 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Thermal Data for PTP
    2. 8.2 Supplementary Information About the 176-pin PTP PowerPAD™ Package
      1. 8.2.1 Standoff Height
      2. 8.2.2 PowerPAD™ PCB Footprint
    3. 8.3 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PTP|176
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Device Overview

1.1 Features

  • 375- and 456-MHz ARM926EJ-S™ RISC Core
    • 32-Bit and 16-Bit (Thumb®) Instructions
    • Single-Cycle MAC
    • ARM Jazelle® Technology
    • Embedded ICE-RT™ for Real-Time Debug
  • ARM9™ Memory Architecture
    • 16KB of Instruction Cache
    • 16KB of Data Cache
    • 8KB of RAM (Vector Table)
    • 64KB of ROM
  • Enhanced Direct Memory Access Controller 3 (EDMA3):
    • 2 Transfer Controllers
    • 32 Independent DMA Channels
    • 8 Quick DMA Channels
    • Programmable Transfer Burst Size
  • 128KB of RAM Memory
  • 3.3-V LVCMOS I/Os (Except for USB Interface)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8-Bit-Wide Data)
      • NAND (8-Bit-Wide Data)
    • EMIFB
      • 16-Bit SDRAM With 128-MB Address Space
  • Three Configurable 16550-Type UART Modules:
    • UART0 With Modem Control Signals
    • 16-Byte FIFO
    • 16x or 13x Oversampling Option
    • Autoflow Control Signals (CTS, RTS) on UART0 Only
  • Two Serial Peripheral Interfaces (SPIs) Each With One Chip Select
  • Programmable Real-Time Unit Subsystem (PRUSS)
    • Two Independent Programmable Real-Time Unit (PRU) Cores
      • 32-Bit Load-Store RISC Architecture
      • 4KB of Instruction RAM per Core
      • 512 Bytes of Data RAM per Core
      • PRUSS can be Disabled Through Software to Save Power
    • Standard Power-Management Mechanism
      • Clock Gating
      • Entire Subsystem Under a Single PSC Clock Gating Domain
    • Dedicated Interrupt Controller
    • Dedicated Switched Central Resource
  • Multimedia Card (MMC)/Secure Digital (SD) Card Interface With Secure Data I/O (SDIO)
  • Two Master and Slave Inter-Integrated Circuit (I2C Bus™)
  • USB 2.0 OTG Port With Integrated PHY (USB0)
    • USB 2.0 Full-Speed Client
    • USB 2.0 Full- and Low-Speed Host
    • End Point 0 (Control)
    • End Points 1, 2, 3, and 4 (Control, Bulk, Interrupt, or ISOC) RX and TX
  • Two Multichannel Audio Serial Ports (McASPs):
    • Six Clock Zones and 28 Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • FIFO Buffers for Transmit and Receive
  • 10/100 Mbps Ethernet MAC (EMAC):
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • RMII Media-Independent Interface
    • Management Data I/O (MDIO) Module
  • One 64-Bit General-Purpose Timer (Configurable as Two 32-Bit Timers)
  • One 64-Bit General-Purpose Watchdog Timer (Configurable as Two 32-Bit General-Purpose Timers)
  • Three Enhanced Pulse Width Modulators (eHRPWMs):
    • Dedicated 16-Bit Time-Base Counter With Period and Frequency Control
    • 6 Single-Edge, 6 Dual-Edge Symmetric, or 3 Dual-Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
  • Three 32-Bit Enhanced Capture (eCAP) Modules:
    • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) Outputs
    • Single-Shot Capture of up to Four Event Timestamps
  • Two 32-Bit Enhanced Quadrature Encoder Pulse (eQEP) Modules
  • 176-Pin PowerPAD™ Plastic Quad Flat Pack [PTP suffix], 0.5-mm Pin Pitch
  • Commercial, Industrial, or Extended Temperature

1.2 Applications

  • Industrial Automation
  • Home Automation
  • Test and Measurement
  • Portable Data Terminals

1.3 Description

The AM1705 is a low-power ARM microprocessor based on an ARM926EJ-S.

The device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices with robust operating systems, rich user interfaces, and high processor performance through the maximum flexibility of a fully integrated, mixed processor solution.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-, 16-, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core has a coprocessor 15 (CP15), protection module, and data and program memory management units (MMUs) with table look-aside buffers. The ARM core has separate 16KB of instruction and 16-KB data caches. Both memory blocks are 4-way associative with virtual index virtual tag (VIVT). The ARM core also has 8KB of RAM (Vector Table) and 64KB of ROM.

The peripheral set includes: a 10/100 Mbps Ethernet MAC (EMAC) with a management data input/output (MDIO) module; two I2C Bus interfaces; three multichannel audio serial ports (McASPs) with serializers and FIFO buffers; two 64-bit general-purpose timers each configurable (one configurable as watchdog); up to 8 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; three UART interfaces (one with both RTS and CTS); three enhanced high-resolution pulse width modulator (eHRPWM) peripherals; three 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; two 32-bit enhanced quadrature encoded pulse (eQEP) peripherals; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed memory interface (EMIFB) for SDRAM.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the device and the network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbps and 100 Mbps in either half- or full-duplex mode. Additionally, an MDIO interface is available for PHY configuration.

The I2C, SPI, and USB2.0 ports allow the device to easily control peripheral devices and/or communicate with host processors.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each peripheral, see the related sections later in this document and the associated peripheral reference guides.

The device has a complete set of development tools for the ARM processor. These tools include C compilers and a Windows® debugger interface for visibility into source code execution.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE
AM1705 HLQFP (176) 24.00 mm × 24.00 mm
(1) For more information on these devices, see Section 8.

1.4 Functional Block Diagram

AM1705 AM1705_FBD.gif Figure 1-1 AM1705 Functional Block Diagram