SWRS188B May   2017  – September 2019 AWR1243

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Power-On Hours (POH)
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Power Supply Specifications
    6. 5.6 Power Consumption Summary
    7. 5.7 RF Specification
    8. 5.8 Thermal Resistance Characteristics for FCBGA Package [ABL0161]
    9. 5.9 Timing and Switching Characteristics
      1. 5.9.1 Power Supply Sequencing and Reset Timing
      2. 5.9.2 Synchronized Frame Triggering
      3. 5.9.3 Input Clocks and Oscillators
        1. 5.9.3.1 Clock Specifications
      4. 5.9.4 Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 5.9.4.1 Peripheral Description
          1. Table 5-8  SPI Timing Conditions
          2. Table 5-9  SPI Slave Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)
          3. Table 5-10 SPI Slave Mode Timing Requirements (SPICLK = input, SPISIMO = input, and SPISOMI = output)
        2. 5.9.4.2 Typical Interface Protocol Diagram (Slave Mode)
      5. 5.9.5 LVDS Interface Configuration
        1. 5.9.5.1 LVDS Interface Timings
      6. 5.9.6 General-Purpose Input/Output
        1. Table 5-12 Switching Characteristics for Output Timing versus Load Capacitance (CL)
      7. 5.9.7 Camera Serial Interface (CSI)
        1. Table 5-13 CSI Switching Characteristics
  6. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Subsystems
      1. 6.3.1 RF and Analog Subsystem
        1. 6.3.1.1 Clock Subsystem
        2. 6.3.1.2 Transmit Subsystem
        3. 6.3.1.3 Receive Subsystem
      2. 6.3.2 Host Interface
    4. 6.4 Other Subsystems
      1. 6.4.1 A2D Data Format Over CSI2 Interface
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 Short-, Medium-, and Long-Range Radar
    3. 7.3 Imaging Radar using Cascade Configuration
    4. 7.4 Reference Schematic
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Stackup Details
  8. 8Device and Documentation Support
    1. 8.1 Device Nomenclature
    2. 8.2 Tools and Software
    3. 8.3 Documentation Support
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ABL|161
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from October 31, 2018 to September 30, 2019 (from A Revision (October 2018) to B Revision)

  • Global: Deleted the Export Control Notice section (was Section 9.7).Go
  • Section 1.2 (Applications): Added links to Applications bulletsGo
  • (Device Information): Updated/Changed the part number from "XA1243PBGABL" to "XA1243FPBGABL".Go
  • Section 1.4 (Functional Block Diagram): Added "internal temperature sensor accuracy" footnote.Go
  • Section 3 (Device Features Comparison): Updated/Changed the Hardware accelerator to "Yes" for AWR1843.Go
  • Section 3.1 (Related Products): Updated/Changed page links for both "mmWave sensors" and "Automotive mmWave sensors".Go
  • Figure 4-1 (Pin Diagram): Updated/Changed image - GPADC not supported on the AWR1243 device.Go
  • Figure 4-3 (Top Right Quadrant): Updated/Changed image - GPADC not supported on the AWR1243 device. Go
  • Figure 4-4 (Bottom Left Quadrant): Updated/Changed image - GPADC not supported on the AWR1243 device. Go
  • Section 4.2 (Signal Descriptions): Added NOTE about IO pins.Go
  • Table 4-1 (Signal Descriptions): Added "(for CSI and LVDS debug interface)" to the DESCRIPTION column of the CSI2 TX pins.Go
  • Table 4-1: Added "(for LVDS debug interface)" to the DESCRIPTION column of the CSI2 TX HS_DEBUG1 and HS_DEBUG2_x pins.Go
  • Table 4-1: Added the "Sense on Power" pin rows.Go
  • Table 4-1 (Signal Descriptions): Updated/Changed RS232 UART pin DESCRIPTIONGo
  • Table 4-1: Deleted associated footnote DESCRIPTIONGo
  • Table 4-1: Updated/Changed Test and Debug pin DESCRIPTIONGo
  • Section 5.3 (Power-On Hours (POH)): Added applicable "default firmware gain tables" footnote.Go
  • Section 5.4 (Recommended Operating Conditions): Updated/Changed MIN value for VIOIN (IO supply (3.3 V) from "3.15" to "3.135" V.Go
  • Section 5.4: Updated/Changed MAX value for VIOIN (IO supply (3.3 V) from "3.45" to "3.465" V.Go
  • Table 5-2 (Ripple Specifications): Changed 137.5 FREQUENCY, 1.0 V RF RAIL value from "744" to "7" µVRMS.Go
  • Table 5-2: Changed 275 FREQUENCY, 1.0 V RF RAIL value from "4" to "5" µVRMS.Go
  • Table 5-3 (Maximum Current Ratings at Power Terminals): Added "specified current values ..." footnote. Go
  • Section 5.7 (RF Specification): Added "(VCO1)" to Clock subsystem, Phase noise at 1-MHz offset: 76 to 77 GHz rangeGo
  • Section 5.7: Added "(VCO2)" to Clock subsystem, Phase noise at 1-MHz offset: 77 to 81 GHz rangeGo
  • Section 5.8(Thermal Resistance Characteristics for FCBGA Package [ABL0161]): Updated/Changed all thermal resistance values for ABL package and changed associated footnote.Go
  • Table 5-9 (SPI Slave Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)): Updated/Changed table.Go
  • Table 5-10 (SPI Slave Mode Timing Requirements (SPICLK = input, SPISIMO = input, and SPISOMI = output)): Updated/Changed table.Go
  • Table 5-10: Deleted associated footnote.Go
  • Figure 5-5 (SPI Slave Mode External Timing): Updated/Changed figure to match updated tables.Go
  • Figure 5-6 (SPI Communication): Updated/Changed figure for MOSI and MISO signals.Go
  • Figure 6-1 (Functional Block Diagram): Added "Multi-chip cascading" footnote. Go
  • Figure 6-1: Added "Internal temperature sensor accuracy" footnote and reference. Go
  • Figure 6-3 (Transmit Subsystem (Per Channel)): Updated/Changed figure.Go
  • Figure 6-4 (Receive Subsystem (Per Channel)): Updated/Changed figure.Go
  • Figure 7-2 (Imaging Radar using Cascade Configuration): Changed the arrow direction of SYNC_OUT.Go
  • Section 8.4 (Support Resources): Updated/Changed the section title and revamped the sectionGo