SLUS968G January   2010  – August 2015

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Device Options
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Dissipation Ratings
    6. 8.6 Electrical Characteristics
    7. 8.7 Typical Characteristics
      1. 8.7.1 Power Up, Power Down, OVP, Disable and Enable Waveforms
      2. 8.7.2 Protection Circuits Waveforms
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Power-Down or Undervoltage Lockout (UVLO)
      2. 9.3.2  UVLO
      3. 9.3.3  Power-Up
      4. 9.3.4  Sleep Mode
      5. 9.3.5  New Charge Cycle
      6. 9.3.6  Overvoltage-Protection (OVP) - Continuously Monitored
      7. 9.3.7  Power Good Indication (PG)
      8. 9.3.8  CHG Pin Indication
      9. 9.3.9  CHG and PG LED Pull-Up Source
      10. 9.3.10 IN-DPM (VIN-DPM or IN-DPM)
      11. 9.3.11 OUT
      12. 9.3.12 ISET
      13. 9.3.13 PRE_TERM - Pre-Charge and Termination Programmable Threshold
      14. 9.3.14 ISET2
      15. 9.3.15 TS
    4. 9.4 Device Functional Modes
      1. 9.4.1 Termination and Timer Disable Mode (TTDM) -TS Pin High
      2. 9.4.2 Timers
      3. 9.4.3 Termination
      4. 9.4.4 Battery Detect Routine
      5. 9.4.5 Refresh Threshold
      6. 9.4.6 Starting a Charge on a Full Battery
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Calculations
          1. 10.2.2.1.1 Program the Fast Charge Current, ISET:
          2. 10.2.2.1.2 Program the Termination Current Threshold, ITERM:
          3. 10.2.2.1.3 TS Function
          4. 10.2.2.1.4 CHG and PG
        2. 10.2.2.2 Selecting IN and OUT Pin Capacitors
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
      1. 12.3.1 Leakage Current Effects on Battery Capacity
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Related Links
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Pin Configuration and Functions

DGQ Package
10 Pins
Top View
bq24091 bq24092 bq24093 bq24095 bq24090 pos_lus968.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
CHG 8 O Low (FET on) indicates charging and Open Drain (FET off) indicates no Charging or Charge complete.
IN 1 I Input power, connected to external DC supply (AC adapter or USB port). Expected range of bypass capacitors 1μF to 10μF, connect from IN to VSS.
ISET 2 I Programs the Fast-charge current setting. External resistor from ISET to VSS defines fast charge current value. Range is 10.8k (50mA) to 540 Ω (1000mA).
ISET2 7 I Programming the Input/Output Current Limit for the USB or Adaptor source:
High = 500mAmax, Low = ISET, FLOAT = 100mA max.
NC 6 NA Do not make a connection to this pin (for internal use) – Do not route through this pin
OUT 10 O Battery Connection. System Load may be connected. Average load should not be excessive, allowing battery to charge within the 10 hour safety timer window. Expected range of bypass capacitors 1μF to 10μF.
PG 5 O Low (FET on) indicates the input voltage is above UVLO and the OUT (battery) voltage.
PRE-TERM 4 I Programs the Current Termination Threshold (5 to 50% of Iout which is set by ISET) and Sets the Pre-Charge Current to twice the Termination Current Level.
Expected range of programming resistor is 1k to 10kΩ (2k: Ipgm/10 for term; Ipgm/5 for precharge)
Thermal PAD and Package There is an internal electrical connection between the exposed thermal pad and the VSS pin of the device. The thermal pad must be connected to the same potential as the VSS pin on the printed circuit board. Do not use the thermal pad as the primary ground input for the device. VSS pin must be connected to ground at all times
TS 9 I Temperature sense pin connected to bq24090/2/5 -10k at 25°C NTC thermistor & bq24091/3 -100k at 25°C NTC thermistor, in the battery pack. Floating TS Pin or pulling High puts part in TTDM “Charger” Mode and disable TS monitoring, Timers and Termination. Pulling pin Low disables the IC. If NTC sensing is not needed, connect this pin to VSS through an external 10 kΩ/100kΩ resistor. A 250kΩ from TS to ground will prevent IC entering TTDM mode when battery with thermistor is removed.
VSS 3 Ground terminal