SLUSAM3A May   2011  – December 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements: AC SPI Data Interface
    7. 6.7 Vertical Communications Bus
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog-to-Digital Conversion (ADC)
        1. 7.3.1.1  General Features
        2. 7.3.1.2  3-to-6 Series Cell Configuration
        3. 7.3.1.3  Cell Voltage Measurements
        4. 7.3.1.4  GPAI or VBAT Measurements
          1. 7.3.1.4.1 Converting GPAI Result to Voltage
          2. 7.3.1.4.2 Converting VBAT Result to Voltage
        5. 7.3.1.5  Temperature Measurement
          1. 7.3.1.5.1 External Temperature Sensor Support (TS1+, TS1-, TS2+, and TS2-)
          2. 7.3.1.5.2 Converting TSn Result to Voltage (Ratio)
        6. 7.3.1.6  ADC Band-Gap Voltage Reference
        7. 7.3.1.7  Conversion Control
          1. 7.3.1.7.1 Convert Start
            1. 7.3.1.7.1.1 Hardware Start
            2. 7.3.1.7.1.2 Firmware Start
          2. 7.3.1.7.2 Data Ready
          3. 7.3.1.7.3 ADC Channel Selection
          4. 7.3.1.7.4 Conversion Time Control
          5. 7.3.1.7.5 Automatic Versus Manual Control
        8. 7.3.1.8  Secondary Protection
          1. 7.3.1.8.1 Protector Functionality
            1. 7.3.1.8.1.1 Using the Protector Functions With 3-5 Cells
        9. 7.3.1.9  Cell Overvoltage Fault Detection (COV)
        10. 7.3.1.10 Cell Undervoltage Fault Detection (CUV)
        11. 7.3.1.11 Overtemperature Detection
          1. 7.3.1.11.1 Ratiometric Sensing
          2. 7.3.1.11.2 Thermistor Power
          3. 7.3.1.11.3 Thermistor Input Conditioning
        12. 7.3.1.12 Fault and Alert Behavior
          1. 7.3.1.12.1 Fault Recovery Procedure
        13. 7.3.1.13 Secondary Protector Built-In Self-Test Features
      2. 7.3.2 Cell Balancing
        1. 7.3.2.1 Cell Balance Control Safety Timer
      3. 7.3.3 Other Features and Functions
        1. 7.3.3.1 Internal Voltage Regulators
          1. 7.3.3.1.1 Internal 5-V Analog Supply
          2. 7.3.3.1.2 Internal 5-V Digital Supply
          3. 7.3.3.1.3 Low-Dropout Regulator (REG50)
          4. 7.3.3.1.4 Auxiliary Power Output (AUX)
        2. 7.3.3.2 Undervoltage Lockout and Power-On Reset
          1. 7.3.3.2.1 UVLO
          2. 7.3.3.2.2 Power-On Reset (POR)
          3. 7.3.3.2.3 Reset Command
        3. 7.3.3.3 Thermal Shutdown (TSD)
        4. 7.3.3.4 GPIO
      4. 7.3.4 Communications
        1. 7.3.4.1 SPI Communications - Device to Host
        2. 7.3.4.2 Device-to-Device Vertical Bus (VBUS) Interface
        3. 7.3.4.3 Packet Formats
          1. 7.3.4.3.1 Data Read Packet
          2. 7.3.4.3.2 Data Write Packet
          3. 7.3.4.3.3 Broadcast Writes
          4. 7.3.4.3.4 Communications Packet Structure
          5. 7.3.4.3.5 CRC Algorithm
          6. 7.3.4.3.6 Data Packet Usage Examples
        4. 7.3.4.4 Device Addressing
    4. 7.4 Device Functional Modes
      1. 7.4.1 SLEEP Functionality
        1. 7.4.1.1 SLEEP State Entry (Bit Set)
        2. 7.4.1.2 SLEEP State Exit (Bit Reset)
    5. 7.5 Programming
      1. 7.5.1 Programming the EPROM Configuration Registers
    6. 7.6 Register Maps
      1. 7.6.1 I/O Register Details
      2. 7.6.2 Register Types
        1. 7.6.2.1 Read-Only (Group 1)
        2. 7.6.2.2 Read / Write (Group 2)
        3. 7.6.2.3 Read / Write, Initialized From EPROM (Group3)
        4. 7.6.2.4 Error Checking and Correcting (ECC) EPROM
      3. 7.6.3 Register Details
        1. 7.6.3.1  DEVICE_STATUS Register (0x00)
        2. 7.6.3.2  GPAI (0x01, 0x02) Register
        3. 7.6.3.3  VCELLn Register (0x03…0x0e)
        4. 7.6.3.4  TEMPERATURE1 Register (0x0f, 0x10)
        5. 7.6.3.5  TEMPERATURE2 Register (0x11, 0x12)
        6. 7.6.3.6  ALERT_STATUS Register (0x20)
        7. 7.6.3.7  FAULT_STATUS Register (0x21)
        8. 7.6.3.8  COV_FAULT Register (0x22)
        9. 7.6.3.9  CUV_FAULT Register (0x23)
        10. 7.6.3.10 PARITY_H Register (0x24) [PRESULT_A (R/O)]
        11. 7.6.3.11 PARITY_H Register (0x25) [PRESULT_B (R/O)]
        12. 7.6.3.12 ADC_CONTROL Register (0x30)
        13. 7.6.3.13 IO_CONTROL Register (0x31)
        14. 7.6.3.14 CB_CTRL Register (0x32)
        15. 7.6.3.15 CB_TIME Register (0x33)
        16. 7.6.3.16 ADC_CONVERT Register (0x34)
        17. 7.6.3.17 SHDW_CTRL Register (0x3a)
        18. 7.6.3.18 ADDRESS_CONTROL Register (0x3b)
        19. 7.6.3.19 RESET Register (0x3c)
        20. 7.6.3.20 TEST_SELECT Register (0x3d)
        21. 7.6.3.21 E_EN Register (0x3f)
        22. 7.6.3.22 FUNCTION_CONFIG Register (0x40)
        23. 7.6.3.23 IO_CONFIG Register (0x41)
        24. 7.6.3.24 CONFIG_COV Register (0x42)
        25. 7.6.3.25 CONFIG_COVT Register (0x43)
        26. 7.6.3.26 CONFIG_UV Register (0x44)
        27. 7.6.3.27 CONFIG_CUVT Register (0x45)
        28. 7.6.3.28 CONFIG_OT Register (0x46)
        29. 7.6.3.29 CONFIG_OTT Register (0x47)
        30. 7.6.3.30 USERx Register (0x48-0x4b) (USER1-4)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Anti-Aliasing Filter
      2. 8.1.2 Host SPI Interface Pin States
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Decoupling
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 2: –40°C to +105°C Ambient Operating Temperature Range
    • Device HBM Classification Level 2
    • Device CDM Classification Level C4B
  • 3-to-6 Series Cell Support, All Chemistries
  • Hot-Pluggable
  • High-Speed Serial Peripheral Interface (SPI) for Data Communications
  • Stackable Vertical Interface
  • Isolation Components Not Required Between Devices
  • High-Accuracy Analog-to-Digital Converter (ADC):
    • ±1 mV Typical Accuracy
    • 14-Bit Resolution, 6-µs Conversion Time
    • Nine ADC Inputs
    • Dedicated Pins for Synchronizing Measurements
  • Configuration Data Stored in Error Check/Correct (ECC)-One-Time-Programmable (OTP) Registers
  • Built-In Comparators (Secondary Protector) for:
    • Overvoltage and Undervoltage Protection
    • Overtemperature Protection
    • Programmable Thresholds and Delay Times
    • Dedicated Fault Signals
  • Cell Balancing Control Outputs With Safety Timeout
    • Balance Current Set by External Components
  • Supply Voltage Range from 7.2 V to 27 V Continuous and 36-V Peak
  • Low Power:
    • Typical 12-µA Sleep, 45-µA Idle
  • Integrated Precision 5-V, 3-mA LDO

2 Applications

  • Electric and Hybrid Electric Vehicles
  • Uninterruptible Power Systems (UPS)
  • E-Bike and E-Scooter
  • Large-Format Battery Systems

3 Description

The bq76PL536A-Q1 device is a stackable battery monitor and protector for three-to-six lithium-ion cells in series. The bq76PL536A-Q1 integrates an analog front end (AFE) along with a precision analog-to-digital converter (ADC), used to precisely measure battery cell voltages. A separate ADC is used to measure temperature.

In addition to temperature measurement, overvoltage and undervoltage are monitored per channel for protection. Non-volatile memory stores the user-programmable protection thresholds and delay times. A FAULT output signals whenever one of these thresholds is exceeded.

Cell stacks of 192 cells can be supported by stacked bq76PL536A-Q1 devices. A high-speed SPI interface connects all devices.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
bq76PL536A-Q1 HTQFP (64) 10.00 mm x 10.00 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Simplified System Connection

bq76PL536A-Q1 sys_conn_LUSAM3.gif

4 Revision History

Changes from * Revision (May 2011) to A Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed Supply voltage range from "6 V to 30 V" to "7.2 V to 27 V" in Features Go
  • Changed description to be more concise Go
  • Changed graphic pin 54 alignment and part number Go
  • Changed AUX description Go
  • Listed values and removed VCn to VCn-1 row and updated Input Voltage Range and Output Voltage Range informationGo
  • Changed "VBAT = 20 V" to "VBAT = 22 V" throughout data sheetGo
  • Changed value to 27 VGo
  • Combined Electrical Characteristics tables into one table Go
  • Changed lower range to 7.2 Go
  • Changed format of bottom two rows and added notes Go
  • Deleted MAX value for VIHGo
  • Deleted MIN value for VILGo
  • Changed 120 to 125Go
  • Changed test conditionGo
  • Deleted note Go
  • Added error range Go
  • Changed table values and format Go
  • Changed min valueGo
  • Changed test conditions, Min and Nom values, and added note 4 Go
  • Changed the section to be switching characteristics Go
  • Changed units in equations to match unit in corresponding row Go
  • Moved figure after timing requirements Go
  • Changed name from VC0 to VSS Go
  • Added TNOM table note Go
  • Changed note wording for LDODxGo
  • Changed warning to cautionGo
  • Changed text to a warningGo
  • Changed text to a caution and added SLEEP State in textGo
  • Changed TS1(2) to TS1:TS2 throughout documentGo
  • Changed SHADOW_LOAD to REFRESH Go
  • Changed paragraph text and added cross-reference to section Go
  • Changed definition of 1 value Go
  • Changed text to Caution format.Go
  • Changed anti-aliasing VCn input to VC6-VC1Go
  • Changed "SN76PL536-Q1" to "bq76PL536A-Q1" in Power Supply DecouplingGo
  • Changed note wording for LDODxGo