SWRS172A July   2014  – November 2015 CC2540T

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Attributes
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Electrical Characteristics
    5. 4.5  Thermal Resistance Characteristics for RHA Package
    6. 4.6  General Characteristics
    7. 4.7  RF Receive Section
    8. 4.8  RF Transmit Section
    9. 4.9  Current Consumption With TPS62730
    10. 4.10 32-MHz Crystal Oscillator
    11. 4.11 32.768-kHz Crystal Oscillator
    12. 4.12 32-kHz RC Oscillator
    13. 4.13 16-MHz RC Oscillator
    14. 4.14 RSSI Characteristics
    15. 4.15 Frequency Synthesizer Characteristics
    16. 4.16 Analog Temperature Sensor
    17. 4.17 Comparator Characteristics
    18. 4.18 ADC Characteristics
    19. 4.19 Control Input AC Characteristics
    20. 4.20 SPI AC Characteristics
    21. 4.21 Debug Interface AC Characteristics
    22. 4.22 Timer Inputs AC Characteristics
    23. 4.23 DC Characteristics
    24. 4.24 Typical Characteristics
    25. 4.25 Typical Current Savings
  5. 5Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Block Descriptions
      1. 5.3.1 CPU and Memory
      2. 5.3.2 Peripherals
  6. 6Applications, Implementation, and Layout
    1. 6.1 Application Information
    2. 6.2 Input/Output Matching
    3. 6.3 Crystal
    4. 6.4 On-Chip 1.8-V Voltage Regulator Decoupling
    5. 6.5 Power-Supply Decoupling and Filtering
    6. 6.6 Reference Design
  7. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
      2. 7.1.2 Community Resources
    2. 7.2 Texas Instruments Low-Power RF Website
    3. 7.3 Texas Instruments Low-Power RF Developer Network
    4. 7.4 Low-Power RF eNewsletter
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Export Control Notice
    8. 7.8 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Device Overview

1.1 Features

  • True Single-Chip BLE Solution: CC2540T Can Run Both Application and BLE Protocol Stack, Includes Peripherals to Interface With Wide Range of Sensors, and so forth
  • Operating Temperature up to 125°C
  • 6-mm × 6-mm Package
  • RF
    • Bluetooth® Low Energy Technology Compatible
    • Excellent Link Budget (up to 97 dB), Enabling Long-Range Applications Without External Front End
    • Accurate Digital Received Signal-Strength Indicator (RSSI)
    • Suitable for Systems Targeting Compliance With Worldwide Radio Frequency Regulations:
      • ETSI EN 300 328 and EN 300 440 Class 2 (Europe)
      • FCC CFR47 Part 15 (US)
      • ARIB STD-T66 (Japan)
  • Layout
    • Few External Components
    • Reference Design Provided
    • 6-mm × 6-mm VQFN40 Package
  • Low Power
    • Active Mode RX Down to 19.6 mA
    • Active Mode TX (–6 dBm): 24 mA
    • Power Mode 1 (3-μs Wake Up): 235 μA
    • Power Mode 2 (Sleep Timer On): 0.9 μA
    • Power Mode 3 (External Interrupts): 0.4 μA
    • Wide Supply Voltage Range (2 V–3.6 V)
    • Full RAM and Register Retention in All Power Modes
  • TPS62730 Compatible,
    Low Power in Active Mode
    • RX Down to 15.8 mA (3-V Supply)
    • TX (–6 dBm): 18.6 mA (3-V Supply)
  • Microcontroller
    • High-Performance and Low-Power 8051 Microcontroller Core
    • 256KB of In-System-Programmable Flash
    • 8KB of SRAM
  • Peripherals
    • 12-Bit ADC With Eight Channels and Configurable Resolution
    • Integrated Ultralow-Power Comparator
    • General-Purpose Timers (One 16-Bit, Two 8-Bit)
    • 21 General-Purpose I/O (GPIO) Pins
      (19 × 4 mA, 2 × 20 mA)
    • 32-kHz Sleep Timer With Capture
    • Two Powerful USARTs With Support for Several Serial Protocols
    • Full-Speed USB Interface
    • IR Generation Circuitry
    • Powerful Five-Channel DMA
    • AES Security Coprocessor
    • Battery Monitor and Temperature Sensor
    • Each CC2540T Contains a Unique 48-Bit IEEE Address
  • Bluetooth v4.0 Compliant Protocol Stack for Single-Mode BLE Solution
    • Complete Power-Optimized Stack, Including Controller and Host
      • GAP: Central, Peripheral, Observer, or Broadcaster (Including Combination Roles)
      • ATT and GATT: Client and Server
      • SMP: AES-128 Encryption and Decryption
      • L2CAP
    • Sample Applications and Profiles
      • Generic Applications for GAP Central and Peripheral Roles
      • Proximity, Accelerometer, Simple Keys, and Battery GATT Services
    • Multiple Configuration Options
      • Single-Chip Configuration, Allowing Application to Run on CC2540T
      • Network Processor Interface for Applications Running on an External Microcontroller
    • BTool: Windows PC Application for Evaluation, Development, and Test
  • Development Tools
    • CC2540T Mini Development Kit
    • SmartRF™ Software
    • Supported by IAR Embedded Workbench™ Software for 8051

1.2 Applications

  • 2.4-GHz Bluetooth Low Energy Systems
  • Lighting
  • Motor Monitoring
  • Proximity Sensing
  • Cable Replacement
  • Power Tools
  • Maintenance
  • Wireless HMI and Remote Display
  • USB Dongles
  • Smart Phone Connectivity

1.3 Description

The CC2540T device is a cost-effective, low-power, true wireless MCU for Bluetooth low energy applications. The CC2540T enables robust BLE master or slave nodes to be built with very low total bill-of-material costs, and it can operate up to 125°C. The CC2540T combines an excellent RF transceiver with an industry-standard enhanced 8051 MCU, in-system programmable flash memory, 8KB of RAM, and many other powerful supporting features and peripherals. The CC2540T is suitable for systems where very low power consumption is required. Very low-power sleep modes are available. Short transition times between operating modes further enable low power consumption.

Combined with the Bluetooth low energy protocol stack from Texas Instruments, the CC2540TF256 forms the market’s most flexible and cost-effective single-mode Bluetooth low energy solution.

Table 1-1 Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
CC2540TF256RHAR VQFN (40) 6.00 mm × 6.00 mm
CC2540TF256RHAT VQFN (40) 6.00 mm × 6.00 mm
(1) For more information, see Section 8, Mechanical Packaging and Orderable Information.

1.4 Functional Block Diagram

Figure 1-1 shows the functional block diagram of the CC2540T device.

CC2540T B0301-05_WRS084.gif Figure 1-1 Functional Block Diagram