SWRS161 December 2014 CC3100MOD
Refer to the PDF data sheet for device specific package drawings
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.
Figure 6-1 shows the reference schematic for the CC3100MOD module.
|QUANTITY||PART REFERENCE||VALUE||MANUFACTURER||PART NUMBER||DESCRIPTION|
|1||U1||CC3100MOD||Texas Instruments||CC3100MODR11MAMOB||SimpleLink Wi-Fi MCU Module|
|1||E1||2.45-GHz Ant||Taiyo Yuden||AH316M245001-T||ANT Bluetooth WLAN ZigBee® WIMAX|
|1||C2||1.0 pF||Murata Electronics North America||GJM1555C1H1R0BB01D||CAP CER 1 pF 50 V NP0 0402|
|1||L1||3.6 nH||Murata Electronics North America||LQP15MN3N6B02D||INDUCTOR 3.6 NH
0.1 NH 0402
Being wireless device, the RF section gets the top priority in terms of layout. It is very important for the RF section to be laid out correctly to get the optimum performance from the device. A poor layout can cause low output power, EVM degradation, sensitivity degradation and mask violations.
The antenna is the element used to convert the guided waves on the PCB traces to the free space electromagnetic radiation. The placement and layout of the antenna is the key to increased range and data rates.
The following points need to be observed for the antenna.
|1||Place the antenna on an edge or corner of the PCB|
|2||Make sure that no signals are routed across the antenna elements on all the layers of the PCB|
|3||Most antennas, including the chip antenna used on the booster pack require ground clearance on all the layers of the PCB. Ensure that the ground is cleared on inner layers as well.|
|4||Ensure that there is provision to place matching components for the antenna. These need to be tuned for best return loss once the complete board is assembled. Any plastics or casing should also be mounted while tuning the antenna as this can impact the impedance.|
|5||Ensure that the antenna impedance is 50 Ω as the device is rated to work only with a
|6||In case of printed antenna, ensure that the simulation is performed with the solder mask in consideration.|
|7||Ensure that the antenna has a near omni-directional pattern.|
|8||The feed point of the antenna is required to be grounded|
|9||To use the FCC certification of the Booster pack board, the antenna used should be of the same gain or lesser. In addition, the Antenna design should be exactly copied including the Antenna traces.|
|1||AH316M245001-T||Taiyo Yuden||Can be placed on edge of the PCB and uses very less PCB space|
|2||RFANT5220110A2T||Walsim||Need to place on the corner of PCB|
The RF signal from the device is routed to the antenna using a CPW-G (Coplanar Waveguide with ground) structure. This structure offers the maximum isolation across filter gap and the best possible shielding to the RF lines. In addition to the ground on the L1 layer, placing GND vias along the line also provides additional shielding
|Er (FR-4 substrate)||4|
|Er (FR-4 substrate)||3.9|