SWRS161 December 2014 CC3100MOD
Refer to the PDF data sheet for device specific package drawings
The PCB bending specification shall maintain planeness at a thickness of less than 0.1 mm.
The product is mounted with motherboard through land grid array (LGA). To prevent poor soldering, do not touch the LGA portion by hand.
The mounted components will be damaged if the product falls or is dropped. Such damage may cause the product malfunction.
A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH. The calculated shelf life for the dry-packed product shall be a 12 months from the date the bag is sealed.
Humidity indicator cards must be blue, < 30%.
Products require baking before mounting if:
Baking condition: 90°C, 12–24 hours
Baking times: 1 time