SWRS161 December   2014 CC3100MOD

PRODUCTION DATA.  

  1. 1Module Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 CC3100MOD Pin Diagram
    2. 3.2 Pin Attributes
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Handling Ratings
    3. 4.3  Power-On Hours
    4. 4.4  Recommended Operating Conditions
    5. 4.5  Brown-Out and Black-Outbrown-out and black-out section
    6. 4.6  Electrical Characteristics (3.3 V, 25°C)
    7. 4.7  Thermal Resistance Characteristics for MOB Package
    8. 4.8  Reset Requirement
    9. 4.9  Current Consumption
    10. 4.10 WLAN RF Characteristics
      1. 4.10.1 WLAN Transmitter Characteristics
    11. 4.11 Timing Characteristics
      1. 4.11.1 SPI Host Interface Timings
      2. 4.11.2 Wake-Up Sequence
      3. 4.11.3 Wakeup from Hibernatewakeup from hibernate table
      4. 4.11.4 Interfaces
        1. 4.11.4.1 Host SPI Interface Timing
        2. 4.11.4.2 SPI Host Interface
        3. 4.11.4.3 Host UART
          1. 4.11.4.3.1 5-Wire UART Topology
          2. 4.11.4.3.2 4-Wire UART Topology
          3. 4.11.4.3.3 3-Wire UART Topology
  5. 5Detailed Description
    1. 5.1 Overview
      1. 5.1.1 Module Features
        1. 5.1.1.1 WLAN
        2. 5.1.1.2 Network Stack
        3. 5.1.1.3 Host Interface and Driver
        4. 5.1.1.4 System
    2. 5.2 Functional Block Diagram
    3. 5.3 Wi-Fi Network Processor Subsystem
    4. 5.4 Power-Management Subsystem
      1. 5.4.1 VBAT Wide-Voltage Connection
    5. 5.5 Low-Power Operating Modes
      1. 5.5.1 Low-Power Deep Sleep
      2. 5.5.2 Hibernate
  6. 6Applications, Implementation, and Layout
    1. 6.1 Reference Schematics
    2. 6.2 Bill of Materialsbill of materials
    3. 6.3 Layout Recommendations
      1. 6.3.1 RF Section (Placement and Routing)
      2. 6.3.2 Antenna Placement and Routing
      3. 6.3.3 Transmission Line
      4. 6.3.4 General Layout Recommendation
  7. 7Environmental Requirements and Specifications
    1. 7.1 Temperature
      1. 7.1.1 PCB Bending
    2. 7.2 Handling Environment
      1. 7.2.1 Terminals
      2. 7.2.2 Falling
    3. 7.3 Storage Condition
      1. 7.3.1 Moisture Barrier Bag Before Opened
      2. 7.3.2 Moisture Barrier Bag Open
    4. 7.4 Baking Conditions
    5. 7.5 Soldering and Reflow Condition
  8. 8Product and Documentation Support
    1. 8.1 Development Support
      1. 8.1.1 Firmware Updates
    2. 8.2 Device Nomenclature
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Export Control Notice
    7. 8.7 Glossary
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Mechanical Drawing
    2. 9.2 Package Option
      1. 9.2.1 Packaging Information
        1. 9.2.2 Tape and Reel Information
      2. 9.2.2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOB|63
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Environmental Requirements and Specifications

7.1 Temperature

7.1.1 PCB Bending

The PCB bending specification shall maintain planeness at a thickness of less than 0.1 mm.

7.2 Handling Environment

7.2.1 Terminals

The product is mounted with motherboard through land grid array (LGA). To prevent poor soldering, do not touch the LGA portion by hand.

7.2.2 Falling

The mounted components will be damaged if the product falls or is dropped. Such damage may cause the product malfunction.

7.3 Storage Condition

7.3.1 Moisture Barrier Bag Before Opened

A moisture barrier bag must be stored in a temperature of less than 30°C with humidity under 85% RH. The calculated shelf life for the dry-packed product shall be a 12 months from the date the bag is sealed.

7.3.2 Moisture Barrier Bag Open

Humidity indicator cards must be blue, < 30%.

7.4 Baking Conditions

Products require baking before mounting if:

  • Humidity indicator cards read > 30%
  • Temp < 30°C, humidity < 70% RH, over 96 hours

Baking condition: 90°C, 12–24 hours

Baking times: 1 time

7.5 Soldering and Reflow Condition

  1. Heating method: Conventional Convection or IR/convection
  2. Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering portion or equivalent method.
  3. Solder paste composition: Sn/3.0 Ag/0.5 Cu
  4. Allowable reflow soldering times: 2 times based on the following reflow soldering profile
    (see Figure 7-1).
  5. Temperature profile: Reflow soldering shall be done according to the following temperature profile (see Figure 7-1).
  6. Peak temp: 245°C
temp_prof.pngFigure 7-1 Temperature Profile for Evaluation of Solder Heat Resistance of a Component
(at Solder Joint)