SWRS161 December   2014 CC3100MOD


  1. 1Module Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 CC3100MOD Pin Diagram
    2. 3.2 Pin Attributes
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Handling Ratings
    3. 4.3  Power-On Hours
    4. 4.4  Recommended Operating Conditions
    5. 4.5  Brown-Out and Black-Outbrown-out and black-out section
    6. 4.6  Electrical Characteristics (3.3 V, 25°C)
    7. 4.7  Thermal Resistance Characteristics for MOB Package
    8. 4.8  Reset Requirement
    9. 4.9  Current Consumption
    10. 4.10 WLAN RF Characteristics
      1. 4.10.1 WLAN Transmitter Characteristics
    11. 4.11 Timing Characteristics
      1. 4.11.1 SPI Host Interface Timings
      2. 4.11.2 Wake-Up Sequence
      3. 4.11.3 Wakeup from Hibernatewakeup from hibernate table
      4. 4.11.4 Interfaces
        1. Host SPI Interface Timing
        2. SPI Host Interface
        3. Host UART
          1. 5-Wire UART Topology
          2. 4-Wire UART Topology
          3. 3-Wire UART Topology
  5. 5Detailed Description
    1. 5.1 Overview
      1. 5.1.1 Module Features
        1. WLAN
        2. Network Stack
        3. Host Interface and Driver
        4. System
    2. 5.2 Functional Block Diagram
    3. 5.3 Wi-Fi Network Processor Subsystem
    4. 5.4 Power-Management Subsystem
      1. 5.4.1 VBAT Wide-Voltage Connection
    5. 5.5 Low-Power Operating Modes
      1. 5.5.1 Low-Power Deep Sleep
      2. 5.5.2 Hibernate
  6. 6Applications, Implementation, and Layout
    1. 6.1 Reference Schematics
    2. 6.2 Bill of Materialsbill of materials
    3. 6.3 Layout Recommendations
      1. 6.3.1 RF Section (Placement and Routing)
      2. 6.3.2 Antenna Placement and Routing
      3. 6.3.3 Transmission Line
      4. 6.3.4 General Layout Recommendation
  7. 7Environmental Requirements and Specifications
    1. 7.1 Temperature
      1. 7.1.1 PCB Bending
    2. 7.2 Handling Environment
      1. 7.2.1 Terminals
      2. 7.2.2 Falling
    3. 7.3 Storage Condition
      1. 7.3.1 Moisture Barrier Bag Before Opened
      2. 7.3.2 Moisture Barrier Bag Open
    4. 7.4 Baking Conditions
    5. 7.5 Soldering and Reflow Condition
  8. 8Product and Documentation Support
    1. 8.1 Development Support
      1. 8.1.1 Firmware Updates
    2. 8.2 Device Nomenclature
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Export Control Notice
    7. 8.7 Glossary
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Mechanical Drawing
    2. 9.2 Package Option
      1. 9.2.1 Packaging Information
        1. 9.2.2 Tape and Reel Information
      2. 9.2.2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOB|63
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Mechanical Packaging and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document.

Figure 9-1 shows the CC3100MOD module.

9.1 Mechanical Drawing

pkg02_swrs161.pngFigure 9-1 Mechanical Drawing

9.2 Package Option

We offer 2 reel size options for flexibility: a 1000-unit reel and a 250-unit reel.

9.2.1 Packaging Information

Orderable Device Status (1) Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL, Peak Temp (3) Op Temp (°C) Device Marking(4)(5)
CC3100MODR11MAMOBR ACTIVE MOB 63 1000 RoHS Exempt Ni Au 3, 250°C –20 to 70 CC3100MODR11MAMOB
CC3100MODR11MAMOBT ACTIVE MOB 63 250 RoHS Exempt Ni Au 3, 250°C –20 to 70 CC3100MODR11MAMOB
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
(5) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

9.2.2 Tape and Reel Information

Device Package Drawing Pins SPQ Reel
Diameter (mm)
Width W1 (mm)
CC3100MODR11MAMOBR MOB 63 1000 330.0±2.0 44.0 17.85±0.10 20.85±0.10 2.50±0.10 24.00±0.10 44.00±0.30 Q3
CC3100MODR11MAMOBT MOB 63 250 330.0±2.0 44.0 17.85±0.10 20.85±0.10 2.50±0.10 24.00±0.10 44.00±0.30 Q3
Device Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CC3100MODR11MAMOBR MOB 63 1000 354.0 354.0 55.0
CC3100MODR11MAMOBT MOB 63 250 354.0 354.0 55.0