SWRS161 December   2014 CC3100MOD

PRODUCTION DATA.  

  1. 1Module Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 CC3100MOD Pin Diagram
    2. 3.2 Pin Attributes
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Handling Ratings
    3. 4.3  Power-On Hours
    4. 4.4  Recommended Operating Conditions
    5. 4.5  Brown-Out and Black-Outbrown-out and black-out section
    6. 4.6  Electrical Characteristics (3.3 V, 25°C)
    7. 4.7  Thermal Resistance Characteristics for MOB Package
    8. 4.8  Reset Requirement
    9. 4.9  Current Consumption
    10. 4.10 WLAN RF Characteristics
      1. 4.10.1 WLAN Transmitter Characteristics
    11. 4.11 Timing Characteristics
      1. 4.11.1 SPI Host Interface Timings
      2. 4.11.2 Wake-Up Sequence
      3. 4.11.3 Wakeup from Hibernatewakeup from hibernate table
      4. 4.11.4 Interfaces
        1. 4.11.4.1 Host SPI Interface Timing
        2. 4.11.4.2 SPI Host Interface
        3. 4.11.4.3 Host UART
          1. 4.11.4.3.1 5-Wire UART Topology
          2. 4.11.4.3.2 4-Wire UART Topology
          3. 4.11.4.3.3 3-Wire UART Topology
  5. 5Detailed Description
    1. 5.1 Overview
      1. 5.1.1 Module Features
        1. 5.1.1.1 WLAN
        2. 5.1.1.2 Network Stack
        3. 5.1.1.3 Host Interface and Driver
        4. 5.1.1.4 System
    2. 5.2 Functional Block Diagram
    3. 5.3 Wi-Fi Network Processor Subsystem
    4. 5.4 Power-Management Subsystem
      1. 5.4.1 VBAT Wide-Voltage Connection
    5. 5.5 Low-Power Operating Modes
      1. 5.5.1 Low-Power Deep Sleep
      2. 5.5.2 Hibernate
  6. 6Applications, Implementation, and Layout
    1. 6.1 Reference Schematics
    2. 6.2 Bill of Materialsbill of materials
    3. 6.3 Layout Recommendations
      1. 6.3.1 RF Section (Placement and Routing)
      2. 6.3.2 Antenna Placement and Routing
      3. 6.3.3 Transmission Line
      4. 6.3.4 General Layout Recommendation
  7. 7Environmental Requirements and Specifications
    1. 7.1 Temperature
      1. 7.1.1 PCB Bending
    2. 7.2 Handling Environment
      1. 7.2.1 Terminals
      2. 7.2.2 Falling
    3. 7.3 Storage Condition
      1. 7.3.1 Moisture Barrier Bag Before Opened
      2. 7.3.2 Moisture Barrier Bag Open
    4. 7.4 Baking Conditions
    5. 7.5 Soldering and Reflow Condition
  8. 8Product and Documentation Support
    1. 8.1 Development Support
      1. 8.1.1 Firmware Updates
    2. 8.2 Device Nomenclature
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Export Control Notice
    7. 8.7 Glossary
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Mechanical Drawing
    2. 9.2 Package Option
      1. 9.2.1 Packaging Information
        1. 9.2.2 Tape and Reel Information
      2. 9.2.2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MOB|63
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Terminal Configuration and Functions

3.1 CC3100MOD Pin Diagram

Figure 3-1 shows the pin diagram for the CC3100MOD.

CC3100MOD_Pin_Diagram.gifFigure 3-1 CC3100MOD Pin Diagram (Bottom View)

NOTE

Figure 3-1 shows the approximate location of pins on the module. For the actual mechanical diagram refer to Section 9.

3.2 Pin Attributes

Table 3-1 lists the pin descriptions of the CC3100MOD module.

NOTE

If an external device drives a positive voltage to signal pads when the CC3100MOD is not powered, DC current is drawn from the other device. If the drive strength of the external device is adequate, an unintentional wakeup and boot of the CC3100MOD can occur. To prevent current draw, TI recommends one of the following:

  • All devices interfaced to the CC3100MOD must be powered from the same power rail as the CC3100MOD.
  • Use level-shifters between the CC3100MOD and any external devices fed from other independent rails.
  • The nRESET pin of the CC3100MOD must be held low until the VBAT supply to the device is driven and stable.

Table 3-1 Pin Attributes

MODULE PIN NO. MODULE PIN NAME TYPE MODULE PIN DESCRIPTION
1 GND - Ground
2 GND - Ground
3 NC - Reserved. Do not connect
4 nHIB I Hibernate signal, active low. Refer to Figure 4-8.
5 HOST_SPI_CLK I Host interface SPI clock
6 HOST_SPI_DIN I Host interface SPI data input
7 HOST_SPI_DOUT O Host interface SPI data output
8 HOST_SPI_nCS I Host interface SPI chip select (active low)
9 NC - Reserved. Do not connect
10 FORCE_AP - For forced AP mode, pull to high on the board using a 100-kΩ resistor. Otherwise, pull down to ground using a 100-kΩ resistor.(1)
11 HOSTINTR O Interrupt output
12 NC - Reserved. Do not connect
13 NC - Reserved. Do not connect
14 NC - Reserved. Do not connect
15 NC - Reserved. Do not connect
16 GND - Ground
17 NC - Reserved. Do not connect
18 NC - Reserved. Do not connect
19 RESERVED - Reserved. Do not connect
20 NC - Unused. Do not connect.
21 RESERVED - Add 100-kΩ external pulldown resistor
22 NC - Reserved. Do not connect
23 SOP2 - Add 10k pulldown to ground
24 SOP1 - Reserved. Do not connect.
25 NC - Reserved. Do not connect
26 NC - Reserved. Do not connect
27 GND - Ground
28 GND - Ground
29 NC - Reserved. Do not connect
30 GND - Ground. Reference for RF signal
31 RF_BG I/O 2.4-GHz RF input/output
32 GND - Ground. Reference for RF signal
33 NC - Reserved. Do not connect
34 SOP0 - Reserved. Do not connect.
35 nRESET I Power on reset. Does not require external RC circuit
36 VBAT_DCDC_ANA - Power supply for the module, can be connected to battery (2.3 V to 3.6 V)
37 VBAT_DCDC_PA - Power supply for the module, can be connected to battery (2.3 V to 3.6 V)
38 GND - Ground
39 VDD_ANA2 - To be left unconnected. Used for prototype samples only.
40 VBAT_DCDC_DIG_IO - Power supply for the module, can be connected to battery (2.3 V to 3.6 V)
41 NC - Reserved. Do not connect
42 NC - Reserved. Do not connect
43 GND - Ground
44 UART1_nRTS O UART request to send, connect to external test point. Used for on-module flash reprogramming
45 NC - Reserved. Do not connect
46 UART1_TX O UART transmit, connect to external test point. Used for on-module flash reprogramming
47 UART1_RX I UART receive, connect to external test point. Used for on-module flash reprogramming
48 TEST_58 O Connect to external test point
49 TEST_59 I Connect to external test point
50 TEST_60 O Connect to external test point
51 UART1_nCTS I UART clear to send, connect to external test point. Used for on-module flash reprogramming
52 TEST_62 O Connect to external test point
53 NC - Reserved. Do not connect
54 NC - Reserved. Do not connect
55 GND - Thermal Ground
56 GND - Thermal Ground
57 GND - Thermal Ground
58 GND - Thermal Ground
59 GND - Thermal Ground
60 GND - Thermal Ground
61 GND - Thermal Ground
62 GND - Thermal Ground
63 GND - Thermal Ground
(1) Using a configuration file stored on flash, the vendor can optionally block any possibility of bringing up AP using the FORCE_AP pin.