SWRS206C March   2017  – December 2018 CC3220MOD , CC3220MODA

PRODUCTION DATA.  

  1. Module Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagrams
  2. Revision History
  3. Device Comparison
    1. 3.1 Related Products
  4. Terminal Configuration and Functions
    1. 4.1 CC3220MODx and CC3220MODAx Pin Diagram
    2. 4.2 Pin Attributes
      1. Table 4-1 Module Pin Attributes
    3. 4.3 Connections for Unused Pins
    4. 4.4 Pin Attributes and Pin Multiplexing
    5. 4.5 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    6. 4.6 Pad State After Application of Power to Chip, but Before Reset Release
  5. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Current Consumption (CC3220MODS and CC3220MODAS)
    5. 5.5  Current Consumption (CC3220MODSF and CC3220MODASF)
    6. 5.6  TX Power and IBAT Versus TX Power Level Settings
    7. 5.7  Brownout and Blackout Conditions
    8. 5.8  Electrical Characteristics
    9. 5.9  CC3220MODAx Antenna Characteristics
    10. 5.10 WLAN Receiver Characteristics
    11. 5.11 WLAN Transmitter Characteristics
    12. 5.12 Reset Requirement
    13. 5.13 Thermal Resistance Characteristics for MOB and MON Packages
    14. 5.14 Timing and Switching Characteristics
      1. 5.14.1 Power-Up Sequencing
      2. 5.14.2 Power-Down Sequencing
      3. 5.14.3 Device Reset
      4. 5.14.4 Wake Up From Hibernate Timing
      5. 5.14.5 Peripherals Timing
        1. 5.14.5.1  SPI
          1. 5.14.5.1.1 SPI Master
          2. 5.14.5.1.2 SPI Slave
        2. 5.14.5.2  I2S
          1. 5.14.5.2.1 I2S Transmit Mode
          2. 5.14.5.2.2 I2S Receive Mode
        3. 5.14.5.3  GPIOs
          1. 5.14.5.3.1 GPIO Input Transition Time Parameters
        4. 5.14.5.4  I2C
        5. 5.14.5.5  IEEE 1149.1 JTAG
        6. 5.14.5.6  ADC
        7. 5.14.5.7  Camera Parallel Port
        8. 5.14.5.8  UART
        9. 5.14.5.9  External Flash Interface
        10. 5.14.5.10 SD Host
        11. 5.14.5.11 Timers
  6. Detailed Description
    1. 6.1  Overview
    2. 6.2  Arm® Cortex®-M4 Processor Core Subsystem
    3. 6.3  Wi-Fi® Network Processor Subsystem
      1. 6.3.1 WLAN
      2. 6.3.2 Network Stack
    4. 6.4  Security
    5. 6.5  Power-Management Subsystem
      1. 6.5.1 VBAT Wide-Voltage Connection
    6. 6.6  Low-Power Operating Mode
    7. 6.7  Memory
      1. 6.7.1 Internal Memory
        1. 6.7.1.1 SRAM
        2. 6.7.1.2 ROM
        3. 6.7.1.3 Flash Memory
        4. 6.7.1.4 Memory Map
    8. 6.8  Restoring Factory Default Configuration
    9. 6.9  Boot Modes
      1. 6.9.1 Boot Mode List
    10. 6.10 Device Certification and Qualification
      1. 6.10.1 FCC Certification and Statement
      2. 6.10.2 Industry Canada (IC) Certification and Statement
      3. 6.10.3 ETSI/CE Certification
      4. 6.10.4 MIC Certification
      5. 6.10.5 SRRC Certification and Statement
    11. 6.11 Module Markings
    12. 6.12 End Product Labeling
    13. 6.13 Manual Information to the End User
  7. Applications, Implementation, and Layout
    1. 7.1 Typical Application
    2. 7.2 Device Connection and Layout Fundamentals
      1. 7.2.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.2.2 Reset
      3. 7.2.3 Unused Pins
    3. 7.3 PCB Layout Guidelines
      1. 7.3.1 General Layout Recommendations
      2. 7.3.2 CC3220MODx RF Layout Recommendations
        1. 7.3.2.1 Antenna Placement and Routing
        2. 7.3.2.2 Transmission Line Considerations
      3. 7.3.3 CC3220MODAx RF Layout Recommendations
  8. Environmental Requirements and Specifications
    1. 8.1 PCB Bending
    2. 8.2 Handling Environment
      1. 8.2.1 Terminals
      2. 8.2.2 Falling
    3. 8.3 Storage Condition
      1. 8.3.1 Moisture Barrier Bag Before Opened
      2. 8.3.2 Moisture Barrier Bag Open
    4. 8.4 Baking Conditions
    5. 8.5 Soldering and Reflow Condition
  9. Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Development Tools and Software
    3. 9.3 Firmware Updates
    4. 9.4 Device Nomenclature
    5. 9.5 Documentation Support
      1. 9.5.1 Community Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Export Control Notice
    9. 9.9 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical, Land, and Solder Paste Drawings
    2. 10.2 Package Option Addendum
      1. 10.2.1 Packaging Information
      2. 10.2.2 Tape and Reel Information
        1. 10.2.2.1 CC3220MODx Tape Specifications
        2. 10.2.2.2 CC3220MODAx Tape Specifications
          1. 10.2.2.1 CC3220MODx Tape Specifications
          2. 10.2.2.2 CC3220MODAx Tape Specifications

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MON|63
Thermal pad, mechanical data (Package|Pins)

Brownout and Blackout Conditions

The module enters a brownout condition whenever the input voltage dips below VBROWNOUT (see Figure 5-4 and Figure 5-5). This condition must be considered during design of the power supply routing, especially if operating from a battery. High-current operations, such as a TX packet or any external activity (not necessarily related directly to networking) can cause a drop in the supply voltage, potentially triggering a brownout. The resistance includes the internal resistance of the battery, contact resistance of the battery holder (four contacts for a 2× AA battery), and the wiring and PCB routing resistance.

NOTE

When the module is in HIBERNATE state, brownout is not detected. Only blackout is in effect during HIBERNATE state.

CC3220MOD CC3220MODA Black_Brownout_Levels1_swas031.gifFigure 5-4 Brownout and Blackout Levels (1 of 2)
CC3220MOD CC3220MODA Black_Brownout_Levels2_swas031.gifFigure 5-5 Brownout and Blackout Levels (2 of 2)

In the brownout condition, all sections of the device shut down within the module except for the Hibernate block (including the 32-kHz RTC clock), which remains on. The current in this state can reach approximately 400 µA. The blackout condition is equivalent to a hardware reset event in which all states within the module are lost. Vbrownout = 2.1 V and Vblackout = 1.67 V

Table 5-1 lists the brownout and blackout voltage levels.

Table 5-1 Brownout and Blackout Voltage Levels

CONDITION VOLTAGE LEVEL UNIT
Vbrownout 2.1 V
Vblackout 1.67 V