SWRS206C March   2017  – December 2018 CC3220MOD , CC3220MODA

PRODUCTION DATA.  

  1. Module Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagrams
  2. Revision History
  3. Device Comparison
    1. 3.1 Related Products
  4. Terminal Configuration and Functions
    1. 4.1 CC3220MODx and CC3220MODAx Pin Diagram
    2. 4.2 Pin Attributes
      1. Table 4-1 Module Pin Attributes
    3. 4.3 Connections for Unused Pins
    4. 4.4 Pin Attributes and Pin Multiplexing
    5. 4.5 Drive Strength and Reset States for Analog-Digital Multiplexed Pins
    6. 4.6 Pad State After Application of Power to Chip, but Before Reset Release
  5. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Current Consumption (CC3220MODS and CC3220MODAS)
    5. 5.5  Current Consumption (CC3220MODSF and CC3220MODASF)
    6. 5.6  TX Power and IBAT Versus TX Power Level Settings
    7. 5.7  Brownout and Blackout Conditions
    8. 5.8  Electrical Characteristics
    9. 5.9  CC3220MODAx Antenna Characteristics
    10. 5.10 WLAN Receiver Characteristics
    11. 5.11 WLAN Transmitter Characteristics
    12. 5.12 Reset Requirement
    13. 5.13 Thermal Resistance Characteristics for MOB and MON Packages
    14. 5.14 Timing and Switching Characteristics
      1. 5.14.1 Power-Up Sequencing
      2. 5.14.2 Power-Down Sequencing
      3. 5.14.3 Device Reset
      4. 5.14.4 Wake Up From Hibernate Timing
      5. 5.14.5 Peripherals Timing
        1. 5.14.5.1  SPI
          1. 5.14.5.1.1 SPI Master
          2. 5.14.5.1.2 SPI Slave
        2. 5.14.5.2  I2S
          1. 5.14.5.2.1 I2S Transmit Mode
          2. 5.14.5.2.2 I2S Receive Mode
        3. 5.14.5.3  GPIOs
          1. 5.14.5.3.1 GPIO Input Transition Time Parameters
        4. 5.14.5.4  I2C
        5. 5.14.5.5  IEEE 1149.1 JTAG
        6. 5.14.5.6  ADC
        7. 5.14.5.7  Camera Parallel Port
        8. 5.14.5.8  UART
        9. 5.14.5.9  External Flash Interface
        10. 5.14.5.10 SD Host
        11. 5.14.5.11 Timers
  6. Detailed Description
    1. 6.1  Overview
    2. 6.2  Arm® Cortex®-M4 Processor Core Subsystem
    3. 6.3  Wi-Fi® Network Processor Subsystem
      1. 6.3.1 WLAN
      2. 6.3.2 Network Stack
    4. 6.4  Security
    5. 6.5  Power-Management Subsystem
      1. 6.5.1 VBAT Wide-Voltage Connection
    6. 6.6  Low-Power Operating Mode
    7. 6.7  Memory
      1. 6.7.1 Internal Memory
        1. 6.7.1.1 SRAM
        2. 6.7.1.2 ROM
        3. 6.7.1.3 Flash Memory
        4. 6.7.1.4 Memory Map
    8. 6.8  Restoring Factory Default Configuration
    9. 6.9  Boot Modes
      1. 6.9.1 Boot Mode List
    10. 6.10 Device Certification and Qualification
      1. 6.10.1 FCC Certification and Statement
      2. 6.10.2 Industry Canada (IC) Certification and Statement
      3. 6.10.3 ETSI/CE Certification
      4. 6.10.4 MIC Certification
      5. 6.10.5 SRRC Certification and Statement
    11. 6.11 Module Markings
    12. 6.12 End Product Labeling
    13. 6.13 Manual Information to the End User
  7. Applications, Implementation, and Layout
    1. 7.1 Typical Application
    2. 7.2 Device Connection and Layout Fundamentals
      1. 7.2.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.2.2 Reset
      3. 7.2.3 Unused Pins
    3. 7.3 PCB Layout Guidelines
      1. 7.3.1 General Layout Recommendations
      2. 7.3.2 CC3220MODx RF Layout Recommendations
        1. 7.3.2.1 Antenna Placement and Routing
        2. 7.3.2.2 Transmission Line Considerations
      3. 7.3.3 CC3220MODAx RF Layout Recommendations
  8. Environmental Requirements and Specifications
    1. 8.1 PCB Bending
    2. 8.2 Handling Environment
      1. 8.2.1 Terminals
      2. 8.2.2 Falling
    3. 8.3 Storage Condition
      1. 8.3.1 Moisture Barrier Bag Before Opened
      2. 8.3.2 Moisture Barrier Bag Open
    4. 8.4 Baking Conditions
    5. 8.5 Soldering and Reflow Condition
  9. Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Development Tools and Software
    3. 9.3 Firmware Updates
    4. 9.4 Device Nomenclature
    5. 9.5 Documentation Support
      1. 9.5.1 Community Resources
    6. 9.6 Trademarks
    7. 9.7 Electrostatic Discharge Caution
    8. 9.8 Export Control Notice
    9. 9.9 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical, Land, and Solder Paste Drawings
    2. 10.2 Package Option Addendum
      1. 10.2.1 Packaging Information
      2. 10.2.2 Tape and Reel Information
        1. 10.2.2.1 CC3220MODx Tape Specifications
        2. 10.2.2.2 CC3220MODAx Tape Specifications
          1. 10.2.2.1 CC3220MODx Tape Specifications
          2. 10.2.2.2 CC3220MODAx Tape Specifications

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • MON|63
Thermal pad, mechanical data (Package|Pins)

Packaging Information

Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL, Peak Temp (3) Op Temp (°C) Device Marking(4)(5)
CC3220MODSM2MOBR ACTIVE QFM MOB 63 1000 Green (RoHS and no Sb/Br) Ni, AU 3, 250°C –40 to 85 CC3220MODSM2MOB
CC3220MODSF12MOBR ACTIVE QFM MOB 63 1000 Green (RoHS and no Sb/Br) Ni, AU 3, 250°C –40 to 85 CC3220MODSF12MOB
CC3220MODASM2MONR ACTIVE QFM MON 63 800 Green (RoHS and no Sb/Br) Ni, AU 3, 250°C –40 to 85 CC3220MODASM2MON
CC3220MODASF12MONR ACTIVE QFM MON 63 800 Green (RoHS and no Sb/Br) Ni, AU 3, 250°C –40 to 85 CC3220MODASF12MON
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
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Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
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MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
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Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
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