SWAS035B September   2016  – November 2018 CC3220R , CC3220S , CC3220SF

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4.     Device Images
    5. 1.4 Functional Block Diagrams
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Pin Attributes and Pin Multiplexing
      1. Table 4-1 Pin Descriptions
    3. 4.3 Signal Descriptions
      1. Table 4-3 Signal Descriptions
    4. 4.4 Pin Multiplexing
    5. 4.5 Drive Strength and Reset States for Analog and Digital Multiplexed Pins
    6. 4.6 Pad State After Application of Power to Chip But Before Reset Release
    7. 4.7 Connections for Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Timing and Switching Characteristics
    3. 5.3  ESD Ratings
    4. 5.4  Power-On Hours (POH)
    5. 5.5  Recommended Operating Conditions
    6. 5.6  Current Consumption Summary (CC3220R, CC3220S)
    7. 5.7  Current Consumption Summary (CC3220SF)
    8. 5.8  TX Power and IBAT versus TX Power Level Settings
    9. 5.9  Brownout and Blackout Conditions
    10. 5.10 Electrical Characteristics (3.3 V, 25°C)
    11. 5.11 WLAN Receiver Characteristics
    12. 5.12 WLAN Transmitter Characteristics
    13. 5.13 WLAN Filter Requirements
      1. Table 5-2 WLAN Filter Requirements
    14. 5.14 Thermal Resistance Characteristics
      1. 5.14.1 Thermal Resistance Characteristics for RGK Package
    15. 5.15 Power Supply Sequencing
    16. 5.16 Device Reset
    17. 5.17 Reset Timing
      1. 5.17.1    nRESET (32-kHz Crystal)
      2. Table 5-3 First-Time Power-Up and Reset Removal Timing Requirements (32-kHz Crystal)
      3. 5.17.2    nRESET (External 32-kHz)
        1. Table 5-4 First-Time Power-Up and Reset Removal Timing Requirements (External 32-kHz)
    18. 5.18 Wakeup From HIBERNATE Mode
    19. 5.19 Clock Specifications
      1. 5.19.1 Slow Clock Using Internal Oscillator
        1. Table 5-5 RTC Crystal Requirements
      2. 5.19.2 Slow Clock Using an External Clock
        1. Table 5-6 External RTC Digital Clock Requirements
      3. 5.19.3 Fast Clock (Fref) Using an External Crystal
        1. Table 5-7 WLAN Fast-Clock Crystal Requirements
      4. 5.19.4 Fast Clock (Fref) Using an External Oscillator
        1. Table 5-8 External Fref Clock Requirements (–40°C to +85°C)
    20. 5.20 Peripherals Timing
      1. 5.20.1  SPI
        1. 5.20.1.1 SPI Master
          1. Table 5-9 SPI Master Timing Parameters
        2. 5.20.1.2 SPI Slave
          1. Table 5-10 SPI Slave Timing Parameters
      2. 5.20.2  I2S
        1. 5.20.2.1 I2S Transmit Mode
          1. Table 5-11 I2S Transmit Mode Timing Parameters
        2. 5.20.2.2 I2S Receive Mode
          1. Table 5-12 I2S Receive Mode Timing Parameters
      3. 5.20.3  GPIOs
        1. 5.20.3.1 GPIO Output Transition Time Parameters (Vsupply = 3.3 V)
          1. Table 5-13 GPIO Output Transition Times (Vsupply = 3.3 V)
        2. 5.20.3.2 GPIO Output Transition Time Parameters (Vsupply = 1.85 V)
          1. Table 5-14 GPIO Output Transition Times (Vsupply = 1.85 V)
        3. 5.20.3.3 GPIO Input Transition Time Parameters
          1. Table 5-15 GPIO Input Transition Time Parameters'
      4. 5.20.4  I2C
        1. Table 5-16 I2C Timing Parameters
      5. 5.20.5  IEEE 1149.1 JTAG
        1. Table 5-17 JTAG Timing Parameters
      6. 5.20.6  ADC
        1. Table 5-18 ADC Electrical Specifications
      7. 5.20.7  Camera Parallel Port
        1. Table 5-19 Camera Parallel Port Timing Parameters
      8. 5.20.8  UART
      9. 5.20.9  SD Host
      10. 5.20.10 Timers
  6. 6Detailed Description
    1. 6.1 Arm® Cortex®-M4 Processor Core Subsystem
    2. 6.2 Wi-Fi Network Processor Subsystem
      1. 6.2.1 WLAN
      2. 6.2.2 Network Stack
    3. 6.3 Security
    4. 6.4 Power-Management Subsystem
      1. 6.4.1 VBAT Wide-Voltage Connection
      2. 6.4.2 Preregulated 1.85-V Connection
    5. 6.5 Low-Power Operating Mode
    6. 6.6 Memory
      1. 6.6.1 External Memory Requirements
      2. 6.6.2 Internal Memory
        1. 6.6.2.1 SRAM
        2. 6.6.2.2 ROM
        3. 6.6.2.3 Flash Memory
        4. 6.6.2.4 Memory Map
    7. 6.7 Restoring Factory Default Configuration
    8. 6.8 Boot Modes
      1. 6.8.1 Boot Mode List
  7. 7Applications, Implementation, and Layout
    1. 7.1 Application Information
      1. 7.1.1 Typical Application—CC3220x Wide-Voltage Mode
      2. 7.1.2 Typical Application Schematic—CC3220x Preregulated, 1.85-V Mode
    2. 7.2 PCB Layout Guidelines
      1. 7.2.1 General PCB Guidelines
      2. 7.2.2 Power Layout and Routing
        1. 7.2.2.1 Design Considerations
      3. 7.2.3 Clock Interfaces
      4. 7.2.4 Digital Input and Output
      5. 7.2.5 RF Interface
  8. 8Device and Documentation Support
    1. 8.1  Development Tools and Software
    2. 8.2  Firmware Updates
    3. 8.3  Device Nomenclature
    4. 8.4  Documentation Support
    5. 8.5  Related Links
    6. 8.6  Community Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device Overview