SLPS313A September   2013  – January 2018 CSD13202Q2

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Device Images
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Characteristics
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q2 Package Dimensions
      1. 7.1.1 Recommended PCB Pattern
      2. 7.1.2 Recommended Stencil Pattern
    2. 7.2 Q2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQK|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 Thermal Characteristics

TA = 25°C unless otherwise stated
PARAMETERMINTYPMAXUNIT
RθJC Thermal resistance junction-to-case(1) 6.4 °C/W
RθJA Thermal resistance junction-to-ambient(1)(2) 60 °C/W
(1) RθJC is determined with the device mounted on a 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu pad on a 1.5-in × 1.5-in (3.81-cm × 3.81-cm), 0.06-in (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-in2 (6.45-cm2), 2-oz (0.071-mm) thick Cu.

CSD13202Q2 M0164-01_LPS235.gif
 Max RθJA = 60 when mounted on 1 in2 (6.45 cm2) of 2-oz (0.071-mm) thick Cu.
CSD13202Q2 M0164-02_LPS235.gif
 Max RθJA = 210 when mounted on minimum pad area of 2-oz (0.071-mm) thick Cu.