SLPS593 October   2016 CSD13380F3

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Mechanical Dimensions
    2. 7.2 Recommended Minimum PCB Layout
    3. 7.3 Recommended Stencil Pattern

Package Options

Mechanical Data (Package|Pins)
  • YJM|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Mechanical Dimensions

CSD13380F3 Mechanical_Dim.png
All linear dimensions are in millimeters (dimensions and tolerancing per AME T14.5M-1994).
This drawing is subject to change without notice.
This package is a PB-free solder land design.

Table 1. Pin Configuration

POSITION DESIGNATION
Pin 1 Gate
Pin 2 Source
Pin 3 Drain

Recommended Minimum PCB Layout

CSD13380F3 PCB_YJM.png
All dimensions are in millimeters.

Recommended Stencil Pattern

CSD13380F3 Stencil_YJM.png
All dimensions are in millimeters.