SLPS224C August   2009  – November 2016 CSD16323Q3

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q3 Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Opening
    4. 7.4 Q3 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

7.1 Q3 Package Dimensions

CSD16323Q3 MechanicalDrawing2.png
DIM MILLIMETERS INCHES
MIN NOM MAX MIN NOM MAX
A 0.950 1.000 1.100 0.037 0.039 0.043
A1 0.000 0.000 0.050 0.000 0.000 0.002
b 0.280 0.340 0.400 0.011 0.013 0.016
b1 0.310 NOM 0.012 NOM
c 0.150 0.200 0.250 0.006 0.008 0.010
D 3.200 3.300 3.400 0.126 0.130 0.134
D2 1.650 1.750 1.800 0.065 0.069 0.071
d 0.150 0.200 0.250 0.006 0.008 0.010
d1 0.300 0.350 0.400 0.012 0.014 0.016
E 3.200 3.300 3.400 0.126 0.130 0.134
E2 2.350 2.450 2.550 0.093 0.096 0.100
e 0.650 TYP 0.026 TYP
H 0.35 0.450 0.550 0.014 0.018 0.022
K 0.650 TYP 0.026 TYP
L 0.35 0.450 0.550 0.014 0.018 0.022
L1 0 — 0 0 — 0
θ 0 — 0 0 — 0

7.2 Recommended PCB Pattern

CSD16323Q3 Recommended_PCB_Land_Pattern_2.png

For recommended circuit layout for PCB designs, see Reducing Ringing Through PCB Layout Techniques (SLPA005).

7.3 Recommended Stencil Opening

CSD16323Q3 Recommended_Stencil_Opening_2.png

All dimensions are in mm, unless otherwise specified.

7.4 Q3 Tape and Reel Information

CSD16323Q3 m0144-01_lps202.gif

Notes:

  1. 10 sprocket hole pitch cumulative tolerance ±0.2.
  2. Camber not to exceed 1 mm in 100 mm, noncumulative over 250 mm.
  3. Material: black static dissipative polystyrene.
  4. All dimensions are in mm (unless otherwise specified).
  5. Thickness: 0.30 ±0.05 mm.
  6. MSL1 260°C (IR and Convection) PbF-Reflow Compatible.