SLPS471D February   2014  – May 2017 CSD17570Q5B

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q5B Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Pattern
    4. 7.4 Q5B Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DNK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (January 2015) to D Revision

  • Added the Receiving Notification of Documentation Updates and Community Resources sections to Device and Documentation Support. Go
  • Changed the dimension between pads 3 and 4 from 0.028 inches: to 0.050 inches in the Recommended PCB Pattern section diagram Go

Changes from B Revision (August 2014) to C Revision

  • Corrected Pulsed Drain Current to read 400 A. Go

Changes from A Revision (May 2014) to B Revision

Changes from * Revision (February 2014) to A Revision

  • Updated the mechanical drawing. Go