SLPS463C April   2014  – March 2017 CSD95378BQ5MC

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Pin Configuration and Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
  7. 7Application Schematic
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Community Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Mechanical Drawing
    2. 9.2 Recommended PCB Land Pattern
    3. 9.3 Recommended Stencil Opening

Package Options

Mechanical Data (Package|Pins)
  • DMC|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • 60-A Continuous Operating Current Capability
  • 93.4% System Efficiency at 30 A
  • Low-Power Loss of 2.8 W at 30 A
  • High-Frequency Operation (up to 1.25 MHz)
  • Diode Emulation Mode With FCCM
  • Temperature Compensated Bidirectional Current Sense
  • Analog Temperature Output (400 mV at 0°C)
  • Fault Monitoring
    • High-Side Short, Overcurrent, and Overtemperature Protection
  • 3.3-V and 5-V PWM Signal Compatible
  • Tri-State PWM Input
  • Integrated Bootstrap Diode
  • Optimized Dead Time for Shoot-Through Protection
  • High-Density SON 5-mm × 6-mm Footprint
  • Ultra-Low-Inductance Package
  • System-Optimized PCB Footprint
  • DualCool™ Packaging
  • RoHS Compliant – Lead-Free Terminal Plating
  • Halogen-Free

2 Applications

  • Multiphase Synchronous Buck Converters
    • High-Frequency Applications
    • High-Current, Low-Duty-Cycle Applications
  • POL DC-DC Converters
  • Memory and Graphic Cards
  • Desktop and Server VR11.x / VR12.x V-core and Memory Synchronous Converters

3 Description

The CSD95378BQ5MC NexFET™ smart power stage is a highly-optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

Device Information(1)

DEVICE MEDIA QTY PACKAGE SHIP
CSD95378BQ5MC 13-Inch Reel 2500 SON
5.00-mm × 6.00-mm
DualCool Package		 Tape and Reel
CSD95378BQ5MCT 7-Inch Reel 250
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Application Diagram

CSD95378BQ5MC Front_Page_Application.gif

Typical Power Stage Efficiency and Power Loss

CSD95378BQ5MC front_page_SLPS417A.png