SLASEL0B October   2019  – June 2020 DAC11001A , DAC81001 , DAC91001

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Functional Block Diagram
      2.      High-Precision, Control-Loop Circuit
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1      Absolute Maximum Ratings
    2. 7.2      ESD Ratings
    3. 7.3      Recommended Operating Conditions
    4. 7.4      Thermal Information Package
    5. 7.5      Electrical Characteristics
    6. Table 1. Timing Requirements: Write, 4.5 V ≤ DVDD ≤ 5.5 V
    7. Table 2. Timing Requirements: Write, 2.7 V ≤ DVDD < 4.5 V
    8. Table 3. Timing Requirements: Read and Daisy-Chain Write, 4.5 V ≤ DVDD ≤ 5.5 V
    9. Table 4. Timing Requirements: Read and Daisy-Chain Write, 2.7 V ≤ DVDD < 4.5 V
    10. 7.6      Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital-to-Analog Converter Architecture
      2. 8.3.2 External Reference
      3. 8.3.3 Output Buffers
      4. 8.3.4 Internal Power-On Reset (POR)
      5. 8.3.5 Temperature Drift and Calibration
      6. 8.3.6 DAC Output Deglitch Circuit
    4. 8.4 Device Functional Modes
      1. 8.4.1 Fast-Settling Mode and THD
      2. 8.4.2 DAC Update Rate Mode
    5. 8.5 Programming
      1. 8.5.1 Daisy-Chain Operation
      2. 8.5.2 CLR Pin Functionality and Software Clear
      3. 8.5.3 Output Update (Synchronous and Asynchronous)
        1. 8.5.3.1 Synchronous Update
        2. 8.5.3.2 Asynchronous Update
      4. 8.5.4 Software Reset Mode
    6. 8.6 Register Map
      1. 8.6.1 NOP Register (address = 00h) [reset = 0x000000h]
        1. Table 9. NOP Register Field Descriptions
      2. 8.6.2 DAC-DATA Register (address = 01h) [reset = 0x000000h]
        1. Table 10. DAC-DATA Register Field Descriptions
      3. 8.6.3 CONFIG1 Register (address = 02h) [reset = 004C80h for bits [23:0]]
        1. Table 11. CONFIG1 Register Field Descriptions
      4. 8.6.4 DAC-CLEAR-DATA Register (address = 03h) [reset = 000000h for bits [23:0]]
        1. Table 12. DAC-CLEAR-DATA Register Field Descriptions
      5. 8.6.5 TRIGGER Register (address = 04h) [reset = 000000h for bits [23:0]]
        1. Table 13. TRIGGER Register Field Descriptions
      6. 8.6.6 STATUS Register (address = 05h) [reset = 000000h for bits [23:0]]
        1. Table 14. STATUS Register Field Descriptions
      7. 8.6.7 CONFIG2 Register (address = 06h) [reset = 000040h for bits [23:0]]
        1. Table 15. CONFIG2 Register Field Descriptions
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Source Measure Unit (SMU)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Battery Test Equipment (BTE)
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 High-Precision Control Loop
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
      4. 9.2.4 Arbitrary Waveform Generation (AWG)
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
        3. 9.2.4.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Interfacing to a Processor
      2. 9.3.2 Interfacing to a Low-Jitter LDAC Source
      3. 9.3.3 Embedded Resistor Configurations
        1. 9.3.3.1 Minimizing Bias Current Mismatch
        2. 9.3.3.2 2x Gain configuration
        3. 9.3.3.3 Generating Negative Reference
    4. 9.4 What to Do and What Not to Do
      1. 9.4.1 What to Do
      2. 9.4.2 What Not to Do
    5. 9.5 Initialization Set Up
  10. 10Power Supply Recommendations
    1. 10.1 Power-Supply Sequencing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Support Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

PFB Package
48-Pin TQFP
Top View

Pin Functions

PIN TYPE DESCRIPTION
NAME NO.
AGND 2, 35, 38, 40, 42, 43, 46, 47 Analog ground Connect to 0 V.
AGND-OUT 8 Analog ground Connect to 0 V. Measure DAC output voltage with respect to this node.
AGND-TnH 14 Analog ground Connect to 0 V. Integrated deglitcher clock ground..
ALARM 19 Output Alarm output
AVDD 39, 41 Power Positive low voltage analog power supply
CLR 30 Input DAC registers clear pin, active low
DGND 16, 17, 20, 21, 22, 23, 26 Digital ground Connect to 0 V.
DVDD 27 Power Digital power supply pin
RFB 9 Input Integrated precision resistor feedback node
IOVDD 28 Power Interface power supply pin
LDAC 18 Input Load DAC pin, active low
NC 1, 12, 13, 15, 24, 25, 29, 36, 37, 48 No connection, leave floating
OUT 7 Output Unbuffered voltage output
RCM 11 Input Integrated precision resistor common-mode node
REFNF 5 Input External negative reference input. Connect to 0 V for unipolar DAC output.
REFNS 6 Input External negative reference sense node
REFPF 3 Input External positive reference input
REFPS 4 Input External positive reference sense node
ROFS 10 Input Integrated precision resistor offset node
SCLK 31 Input Serial clock input of serial peripheral interface (SPI). Schmitt-trigger logic input.
Data are transferred at rates of up to 50 MHz.
SDIN 32 Input Serial data input. Schmitt-trigger logic input.
Data are clocked into the input shift register on the falling edge of the serial clock input.
SDO 34 Output Serial data output. Data are valid on the falling edge of SCLK.
SYNC 33 Input SPI bus chip select input (active low). Data bits are not clocked into the serial shift register unless SYNC is low. When SYNC is high, the SDO pin is in high-impedance status.
VCC 45 Power Analog positive power supply
VSS 44 Power Analog negative power supply