SLAS837B April   2013  – January 2017 DAC3174

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: DC Specifications
    6. 6.6 Electrical Characteristics: AC Specifications
    7. 6.7 Electrical Characteristics: Digital Specifications
    8. 6.8 Timing Requirements
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Alarm Monitoring
    4. 7.4 Device Functional Modes
      1. 7.4.1 Data Input Formats
      2. 7.4.2 Synchronization Modes
    5. 7.5 Programming
      1. 7.5.1 Initialization
      2. 7.5.2 Serial Interface Description
    6. 7.6 Register Maps
      1. 7.6.1  config0 Register (address = 0x00) [reset = 0x44FC]
      2. 7.6.2  config 1 Register (address = 0x01) [reset = 0x600E]
      3. 7.6.3  config2 Register (address = 0x02) [reset = 0x3FFF]
      4. 7.6.4  config3 Register (address = 0x03) [reset = 0x0000]
      5. 7.6.5  config4 Register (address = 0x04) [reset = 0x0000]
      6. 7.6.6  config5 Register (address = 0x05) [reset = 0x0000]
      7. 7.6.7  config6 Register (address = 0x06) [reset = 0x0000]
      8. 7.6.8  config7 Register (address = 0x07) [reset = 0xFFFF]
      9. 7.6.9  config8 Register (address = 0x08) [reset = 0x4000]
      10. 7.6.10 config9 Register (address = 0x09) [reset = 0x8000]
      11. 7.6.11 config10 Register (address = 0x0A) [reset = 0xF080]
      12. 7.6.12 config11 Register (address = 0x0B) [reset = 0x1111]
      13. 7.6.13 config12 Register (address = 0x0C) [reset = 0x3A7A]
      14. 7.6.14 config13 Register (address = 0x0D) [reset = 0x36B6]
      15. 7.6.15 config14 Register (address = 0x0E) [reset = 0x2AEA]
      16. 7.6.16 config15 Register (address = 0x0F) [reset = 0x0545]
      17. 7.6.17 config16 Register (address = 0x10) [reset = 0x0585]
      18. 7.6.18 config17 Register (address = 0x11) [reset = 0x0949]
      19. 7.6.19 config18 Register (address = 0x12) [reset = 0x1515]
      20. 7.6.20 config19 Register (address = 0x13) [reset = 0x3ABA]
      21. 7.6.21 config20 Register (address = 0x14) [reset = 0x0000]
      22. 7.6.22 config21 Register (address = 0x15) [reset = 0xFFFF]
      23. 7.6.23 config22 Register (address = 0x16) [reset = N/A]
      24. 7.6.24 config23 Register (address = 0x17) [reset = N/A]
      25. 7.6.25 config24 Register (address = 0x18) [reset = N/A]
      26. 7.6.26 config25 Register (address = 0x19) [reset = N/A]
      27. 7.6.27 config127 Register (address = 0x7F) [reset = 0x0045]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Device Nomenclature

Adjacent Carrier Leakage Ratio (ACLR): Defined as the ratio in decibels relative to the carrier (dBc) between the measured power within a channel and that of its adjacent channel.

Analog and Digital Power Supply Rejection Ratio (APSSR, DPSSR): Defined as the percentage error in the ratio of the delta IOUT and delta supply voltage normalized with respect to the ideal IOUT current.

Differential Nonlinearity (DNL): Defined as the variation in analog output associated with an ideal 1 LSB change in the digital input code.

Gain Drift: Defined as the maximum change in gain, in terms of ppm of full-scale range (FSR) per °C, from the value at ambient (25°C) to values over the full operating temperature range.

Gain Error: Defined as the percentage error (in FSR%) for the ratio between the measured full-scale output current and the ideal full-scale output current.

Integral Nonlinearity (INL): Defined as the maximum deviation of the actual analog output from the ideal output, determined by a straight line drawn from zero scale to full scale.

Intermodulation Distortion (IMD3): The two-tone IMD3 is defined as the ratio (in dBc) of the 3rd-order intermodulation distortion product to either fundamental output tone.

Offset Drift: Defined as the maximum change in DC offset, in terms of ppm of full-scale range (FSR) per °C, from the value at ambient (25°C) to values over the full operating temperature range.

Offset Error: Defined as the percentage error (in FSR%) for the ratio between the measured mid-scale output current and the ideal mid-scale output current.

Output Compliance Range: Defined as the minimum and maximum allowable voltage at the output of the current-output DAC. Exceeding this limit may result reduced reliability of the device or adversely affecting distortion performance.

Reference Voltage Drift: Defined as the maximum change of the reference voltage in ppm per degree Celsius from value at ambient (25°C) to values over the full operating temperature range.

Spurious Free Dynamic Range (SFDR): Defined as the difference (in dBc) between the peak amplitude of the output signal and the peak spurious signal.

Signal to Noise Ratio (SNR): Defined as the ratio of the RMS value of the fundamental output signal to the RMS sum of all other spectral components below the Nyquist frequency, including noise, but excluding the first six harmonics and dc.

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.