SLAS646C December   2009  – May 2015 DAC3282

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - DC Specifications
    6. 6.6 Electrical Characteristics - AC Specifications
    7. 6.7 Electrical Characteristics - Digital Specifications
    8. 6.8 Timing Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input FIFO
      2. 7.3.2  FIFO Alarms
      3. 7.3.3  FIFO Modes of Operation
      4. 7.3.4  Dual Sync Sources Mode
      5. 7.3.5  Single Sync Source Mode
      6. 7.3.6  Bypass Mode
      7. 7.3.7  Data Pattern Checker
      8. 7.3.8  FIR Filters
      9. 7.3.9  Coarse Mixer
      10. 7.3.10 Digital Offset Control
      11. 7.3.11 Temperature Sensor
      12. 7.3.12 Sleep Modes
      13. 7.3.13 Reference Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Data Interface
      2. 7.4.2 LVPECL Inputs
      3. 7.4.3 LVDS Inputs
      4. 7.4.4 CMOS Digital Inputs
      5. 7.4.5 DAC Transfer Function
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
    6. 7.6 Register Maps
      1. 7.6.1  CONFIG0 (address = 0x00) [reset = 0x70]
      2. 7.6.2  CONFIG1 (address = 0x01) [reset = 0x11]
      3. 7.6.3  CONFIG2 (address = 0x02) [reset = 0x00]
      4. 7.6.4  CONFIG3 (address = 0x03) [reset = 0x10]
      5. 7.6.5  CONFIG4 (address = 0x04) [reset = 0xFF]
      6. 7.6.6  CONFIG5 (address = 0x05) READ ONLY
      7. 7.6.7  CONFIG6 (address =0x06) [reset = 0x00]
      8. 7.6.8  CONFIG7 (address = 0x07) [reset = 0x00] (WRITE TO CLEAR)
      9. 7.6.9  CONFIG8 (address = 0x08) [reset = 0x00] (WRITE TO CLEAR)
      10. 7.6.10 CONFIG9 (address = 0x09) [reset = 0x7A]
      11. 7.6.11 CONFIG10 (address = 0x0A) [reset = 0xB6]
      12. 7.6.12 CONFIG11 (address = 0x0B) [reset = 0xEA]
      13. 7.6.13 CONFIG12 (address =0x0C) [reset = 0x45]
      14. 7.6.14 CONFIG13 (address =0x0D) [reset = 0x1A]
      15. 7.6.15 CONFIG14 Register Name (address = 0x0E) [reset = 0x16]
      16. 7.6.16 CONFIG15 Register Name (address = 0x0F) [reset = 0xAA]
      17. 7.6.17 CONFIG16 (address = 0x10) [reset = 0xC6]
      18. 7.6.18 CONFIG17 (address = 0x11) [reset = 0x00]
      19. 7.6.19 CONFIG18 (address = 0x12) [reset = 0x02]
      20. 7.6.20 CONFIG19 (address = 0x13) [reset = 0x00]
      21. 7.6.21 CONFIG20 (address = 0x14) [reset = 0x00] (CAUSES AUTOSYNC)
      22. 7.6.22 CONFIG21 (address = 0x15) [reset = 0x00]
      23. 7.6.23 CONFIG22 (address = 0x16) [reset = 0x00]
      24. 7.6.24 CONFIG23 (address = 0x17) [reset = 0x00]
      25. 7.6.25 CONFIG24 (address = 0x18) [reset = 0x83]
      26. 7.6.26 CONFIG25 (address = 0x19) [reset = 0x00]
      27. 7.6.27 CONFIG26 (address = 0x1A) [reset = 0x00]
      28. 7.6.28 CONFIG27 (address =0x1B) [reset = 0x00]
      29. 7.6.29 CONFIG28 (address = 0x1C) [reset = 0x00]
      30. 7.6.30 CONFIG29 (address = 0x1D) [reset = 0x00]
      31. 7.6.31 CONFIG30 (address = 0x1E) [reset = 0x00]
      32. 7.6.32 VERSION31 (address = 0x1F) [reset = 0x43] (READ ONLY)
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Multi-device Synchronization
        1. 8.1.1.1 Multi-device Synchronization: Dual Sync Sources Mode
        2. 8.1.1.2 Multi-device Operation: Single Sync Source Mode
      2. 8.1.2 Analog Current Outputs
      3. 8.1.3 Passive Interface to Analog Quadrature Modulators
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Performance Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power-up Sequence
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Definition Of Specifications
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.