SBAS337E April   2005  – March 2018 DAC7811

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics: VDD = 5 V
    7. 6.7 Typical Characteristics: VDD = 2.7 V
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Serial Interface
      2. 7.4.2 Input Shift Register
      3. 7.4.3 SYNC Interrupt (Stand-Alone Mode)
      4. 7.4.4 Daisy-Chain
      5. 7.4.5 Control Bits C3 to C0
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Unipolar Operation Using DAC7811
      2. 8.1.2 Bipolar Operation Using the DAC7811
      3. 8.1.3 Stability Circuit
      4. 8.1.4 Amplifier Selection
      5. 8.1.5 Programmable Current Source Circuit
    2. 8.2 Typical Application
      1. 8.2.1 Single Supply Unipolar Multiplying DAC
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resource
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
VDD to GND –0.3 7 V
Digital input voltage to GND –0.3 VDD + 0.3 V
IOUT1, IOUT2 to GND –0.3 VDD + 0.3 V
Operating temperature –40 125 °C
Junction temperature, (TJ max) 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.