SBAS337E April   2005  – March 2018 DAC7811

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Block Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics: VDD = 5 V
    7. 6.7 Typical Characteristics: VDD = 2.7 V
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Serial Interface
      2. 7.4.2 Input Shift Register
      3. 7.4.3 SYNC Interrupt (Stand-Alone Mode)
      4. 7.4.4 Daisy-Chain
      5. 7.4.5 Control Bits C3 to C0
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Unipolar Operation Using DAC7811
      2. 8.1.2 Bipolar Operation Using the DAC7811
      3. 8.1.3 Stability Circuit
      4. 8.1.4 Amplifier Selection
      5. 8.1.5 Programmable Current Source Circuit
    2. 8.2 Typical Application
      1. 8.2.1 Single Supply Unipolar Multiplying DAC
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resource
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

A precision analog component requires careful layout, the list below provides some insight into good layout practices.

  • All Power Supply pins should be bypassed to ground with a low ESR ceramic bypass capacitor. The typical recommended bypass capacitance is 0.1 to 0.22-µF ceramic with a X7R or NP0 dielectric.
  • Power supplies and VREF bypass capacitors should be placed close to terminals or planes to minimize inductance and optimize performance.
  • A high-quality ceramic type NP0 or X7R is recommended for its optimal performance across temperature, and very low dissipation factor.
  • The digital and analog sections should have proper placement with respect to the digital pins and analog pins of the DAC9881 device. The separation of analog and digital blocks will allow for better design and practice as it will ensure less coupling into neighboring blocks, and will minimize the interaction between analog and digital return currents.