DLPS013G April   2010  – January 2019 DLP5500

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  Storage Conditions
    3. 7.3  ESD Ratings
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  Timing Requirements
    8. 7.8  System Mounting Interface Loads
    9. 7.9  Micromirror Array Physical Characteristics
    10. 7.10 Micromirror Array Optical Characteristics
    11. 7.11 Window Characteristics
    12. 7.12 Chipset Component Usage Specification
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Video Modes
      2. 8.4.2 Structured Light Modes
        1. 8.4.2.1 Static Image Buffer Mode
        2. 8.4.2.2 Real Time Structured Light Mode
    5. 8.5 Window Characteristics and Optics
      1. 8.5.1 Optical Interface and System Image Quality
      2. 8.5.2 Numerical Aperture and Stray Light Control
      3. 8.5.3 Pupil Match
      4. 8.5.4 Illumination Overfill
    6. 8.6 Micromirror Array Temperature Calculation
      1. 8.6.1 Package Thermal Resistance
      2. 8.6.2 Case Temperature
      3. 8.6.3 Micromirror Array Temperature Calculation for Uniform Illumination
    7. 8.7 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 8.7.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 8.7.2 Landed Duty Cycle and Useful Life of the DMD
      3. 8.7.3 Landed Duty Cycle and Operational DMD Temperature
      4. 8.7.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 DLP5500 System Interface
  10. 10Power Supply Recommendations
    1. 10.1 DMD Power-Up and Power-Down Procedures
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Impedance Requirements
      2. 11.1.2 PCB Signal Routing
      3. 11.1.3 Fiducials
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Documentation
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 Timing Requirements

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
LVDS TIMING PARAMETERS (See Figure 9)
tc Clock Cycle DLCK_A or DCLKC_B 5 ns
tw Pulse Width DCLK_A or DCLK_B 2.5 ns
ts Setup Time, D_A[0:15] before DCLK_A .35 ns
ts Setup Time, D_B[0:15] before DCLK_B .35 ns
th Hold Time, D_A[0:15] after DCLK_A .35 ns
th Hold Time, D_B[0:15] after DCLK_B .35 ns
tskew Channel B relative to Channel A –1.25 1.25 ns
LVDS WAVEFORM REQUIREMENTS(See Figure 6)
|VID| Input Differential Voltage (absolute difference) 100 400 600 mV
VCM Common Mode Voltage 1200 mV
VLVDS LVDS Voltage 0 2000 mV
tr Rise Time (20% to 80%) 100 400 ps
tr Fall Time (80% to 20%) 100 400 ps
SERIAL CONTROL BUS TIMING PARAMETERS(See Figure 3 and Figure 4)
fSCP_CLK SCP Clock Frequency 50 500 kHz
tSCP_SKEW Time between valid SCP_DI and rising edge of SCP_CLK –300 300 ns
tSCP_DELAY Time between valid SCP_DO and rising edge of SCP_CLK 2600 ns
tSCP_EN Time between falling edge of SCP_EN and the first rising edge of SCP_CLK 30 ns
tr_SCP Rise time for SCP signals 200 ns
tfP Fall time for SCP signals 200 ns
DLP5500 SCP_Timing_Parameters.gifFigure 3. Serial Communications Bus Timing Parameters
DLP5500 inputrisefall_cmos_lps013.gifFigure 4. Serial Communications Bus Waveform Requirements
DLP5500 LVDS_Voltage_Definitions_(References).png
Refer to LVDS Interface section of the Recommended Operating Conditions.
Refer to Pin Configuration and Functions for list of LVDS pins.
Figure 5. LVDS Voltage Definitions (References)
DLP5500 lvdswavereqs_lps013.gif
Not to scale.
Refer to LVDS Interface section of the Recommended Operating Conditions.
Figure 6. LVDS Waveform Requirements
DLP5500 LVDS_Voltage_Definitions_Parameters.png
Refer to LVDS Interface section of the Recommended Operating Conditions.
Refer to Pin Configuration and Functions for list of LVDS pins.
Figure 7. LVDS Equivalent Input Circuit
DLP5500 Rise_Time_Fall_Time.gif
Not to scale.
Refer to the Timing Requirements.
Refer to Pin Configuration and Functions for list of LVDS pins and SCP pins.
Figure 8. Rise Time and Fall Time
DLP5500 lvdscriticaltim_wvfms_lps013.gifFigure 9. LVDS Timing Waveforms