SBOS094B January   1998  – December 2014 DRV134 , DRV135

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Simplified Schematic
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Electrical Characteristics
    5. 7.5 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Audio Performance
      2. 8.3.2 Output Common-Mode Rejection
      3. 8.3.3 Signal Balance Ratio
    4. 8.4 Device Functional Modes
      1. 8.4.1 Differential-Output Mode
      2. 8.4.2 Single-Ended Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Cable Driving Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
    3. 11.3 Thermal Performance
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage, V+ to V– 40 V
Input voltage range V– V+
Output short-circuit (to ground) Continuous
Operating temperature –55 125 °C
Junction temperature 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –55 125 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –2000 2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) –500 500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Tspe Specification temperature range –40 85 °C
TA Operation temperature range –55 125 °C
V+ Positive supply 4.5 18 18 V
V– Negative supply –4.5 –18 –18 V

7.4 Electrical Characteristics

At TA = +25°C, VS = ±18 V, RL = 600 Ω differential connected between +VO and –VO, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
AUDIO PERFORMANCE
THD+N Total Harmonic Distortion + Noise f = 20Hz to 20kHz, VO = 10Vrms
f = 1kHz, VO = 10Vrms
20 kHz BW
THD+N < 1%
0.001%
0.0005%
RTO(1) Noise Floor –98 dBu
RTO(1) Headroom 27 dBu
INPUT
ZIN Input Impedance(2) 10
IIN Input Current VIN = ±7.07 V –1000 ±700 1000 µA
GAIN
Differential [(+VO) – (–VO)]/VIN
VIN = ±10V
Initial 5.8 6 dB
Error –2% ±0.1% 2%
Error vs Temperature ±10 ppm/°C
Single-Ended VIN = ±5V
Initial 5.8 6 dB
Error –2% ±0.7% 2%
Error vs Temperature ±10 ppm/°C
Nonlinearity 0.0003 % of FS
OUTPUT
OCMR Common-Mode Rejection, f = 1kHz See Figure 25 46 68 dB
SBR Signal Balance Ratio, f = 1kHz See Figure 26 35 54 dB
Output Offset Voltage
VOCM(3) Offset Voltage, Common-Mode VIN = 0 –250 ±50 250 mV
Offset Voltage, Common-Mode vs Temperature ±150 µV/°C
VOD(4) Offset Voltage, Differential VIN = 0 –10 ±1 10 mV
Offset Voltage, Differential vs Temperature ±5 µV/°C
PSRR Offset Voltage, Differential vs Power Supply VS = ±4.5V to ±18V 80 110 dB
Output Voltage Swing, Positive No Load(5) (V+) – 3 (V+) – 2.5 V
Negative (V–) + 2 (V–) + 1.5
Impedance 50 Ω
CL Load Capacitance, Stable Operation CL Tied to Ground (each output) 1 µF
ISC Short-Circuit Current ±85 mA
FREQUENCY RESPONSE
Small-Signal Bandwidth 1.5 MHz
SR Slew Rate 15 V/µs
Settling Time: 0.01% VOUT = 10V Step 2.5 µs
Overload Recovery Output Overdriven 10% 3 µs
POWER SUPPLY
VS Rated Voltage ±18 V
Voltage Range ±4.5 ±18 V
IQ Quiescent Current IO = 0 –5.5 ±5.2 5.5 mA
TEMPERATURE RANGE
Specification Range –40 85 °C
Operation Range –55 125 °C
Storage Range –55 125 °C
θJA Thermal Resistance 8-Pin DIP 100 °C/W
SO-8 Surface mount 150 °C/W
SOL-16 Surface mount 80 °C/W
(1) dBu = 20log (Vrms /0.7746); RTO = Referred-to-Output.
(2) Resistors are ratio matched but have ±20% absolute value.
(3) VOCM = [(+VO) + (–VO)] / 2.
(4) VOD = (+VO) – (–VO).
(5) Ensures linear operation. Includes common-mode offset.

7.5 Typical Characteristics

At TA = 25°C, VS = ±18 V, RL = 600 Ω differential connected between +VO and –VO, unless otherwise noted.
graph_1_sbos094.gif
Figure 1. Total Harmonic Distortion + Noise vs Frequency
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Figure 3. Total Harmonic Distortion + Noise
vs Frequency
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Figure 2. Total Harmonic Distortion + Noise vs Frequency
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Figure 4. System Total Harmonic Distortion + Noise
vs Frequency
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Figure 5. Headroom – Total Harmonic Distortion + Noise
vs Output Amplitude
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Figure 7. Harmonic Distortion Products vs Frequency
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Figure 9. Output Voltage Noise Spectral Density
vs Frequency
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Figure 11. Power Supply Rejection vs Frequency
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Figure 13. Output Voltage Swing vs Supply Voltage
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Figure 15. Quiescent Current vs Supply Voltage
graph_17_sbos094.gif
Figure 17. Differential Offset Voltage
Production Distribution
graph_19_sbos094.gif
CL = 100 pF
Figure 19. Small-Signal Step Response
graph_21_sbos094.gif
CL = 100 pF
Figure 21. Large-Signal Step Response
graph_23_sbos094.gif
Figure 23. Small-Signal Step Overshoot vs Load Capacitance
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Figure 6. Dim Intermodulation Distortion
vs Output Amplitude
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Figure 8. Gain vs Frequency
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Figure 10. Output Voltage Noise
vs Noise Bandwidth
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Figure 12. Maximum Output Voltage Swing vs Frequency
graph_14_sbos094.gif
Figure 14. Output Voltage Swing vs Output Current
graph_16_sbos094.gif
Figure 16. Short-Circuit Current vs Temperature
graph_18_sbos094.gif
A.
Figure 18. Common-Mode Offset Voltage
Production Distribution
graph_20_sbos094.gif
CL = 1000 pF
Figure 20. Small-Signal Step Response
graph_22_sbos094.gif
CL = 1000 pF
Figure 22. Large-Signal Step Response