SLVSF66A August   2019  – December  2019 DRV8874

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 External Components
      2. 7.3.2 Control Modes
        1. 7.3.2.1 PH/EN Control Mode (PMODE = Logic Low)
        2. 7.3.2.2 PWM Control Mode (PMODE = Logic High)
        3. 7.3.2.3 Independent Half-Bridge Control Mode (PMODE = Hi-Z)
      3. 7.3.3 Current Sense and Regulation
        1. 7.3.3.1 Current Sensing
        2. 7.3.3.2 Current Regulation
          1. 7.3.3.2.1 Fixed Off-Time Current Chopping
          2. 7.3.3.2.2 Cycle-By-Cycle Current Chopping
      4. 7.3.4 Protection Circuits
        1. 7.3.4.1 VM Supply Undervoltage Lockout (UVLO)
        2. 7.3.4.2 VCP Charge Pump Undervoltage Lockout (CPUV)
        3. 7.3.4.3 OUTx Overcurrent Protection (OCP)
        4. 7.3.4.4 Thermal Shutdown (TSD)
        5. 7.3.4.5 Fault Condition Summary
      5. 7.3.5 Pin Diagrams
        1. 7.3.5.1 Logic-Level Inputs
        2. 7.3.5.2 Tri-Level Inputs
        3. 7.3.5.3 Quad-Level Inputs
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Low-Power Sleep Mode
      3. 7.4.3 Fault Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Primary Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Current Sense and Regulation
          2. 8.2.1.2.2 Power Dissipation and Output Current Capability
          3. 8.2.1.2.3 Thermal Performance
            1. 8.2.1.2.3.1 Steady-State Thermal Performance
            2. 8.2.1.2.3.2 Transient Thermal Performance
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Alternative Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Current Sense and Regulation
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 HTSSOP Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

Since the DRV887x family of devices are integrated power MOSFETs device capable of driving high current, careful attention should be paid to the layout design and external component placement. Some design and layout guidelines are provided below.

  • Low ESR ceramic capacitors should be utilized for the VM to GND bypass capacitor, the VCP to VM charge pump storage capacitor, and the charge pump flying capacitor. X5R and X7R types are recommended.
  • The VM power supply and VCP, CPH, CPL charge pump capacitors should be placed as close to the device as possible to minimize the loop inductance.
  • The VM power supply bulk capacitor can be of ceramic or electrolytic type, but should also be placed as close as possible to the device to minimize the loop inductance.
  • VM, OUT1, OUT2, and PGND carry the high current from the power supply to the outputs and back to ground. Thick metal routing should be utilized for these traces as is feasible.
  • PGND and GND should connect together directly on the PCB ground plane. They are not intended to be isolated from each other.
  • The device thermal pad should be attached to the PCB top layer ground plane and internal ground plane (when available) through thermal vias to maximize the PCB heat sinking.
  • A recommended land pattern for the thermal vias is provided in the package drawing section.
  • The copper plane area attached to the thermal pad should be maximized to ensure optimal heat sinking.