SLVSDS7B August   2019  – November 2019 DRV8876

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 External Components
      2. 7.3.2 Control Modes
        1. 7.3.2.1 PH/EN Control Mode (PMODE = Logic Low)
        2. 7.3.2.2 PWM Control Mode (PMODE = Logic High)
        3. 7.3.2.3 Independent Half-Bridge Control Mode (PMODE = Hi-Z)
      3. 7.3.3 Current Sense and Regulation
        1. 7.3.3.1 Current Sensing
        2. 7.3.3.2 Current Regulation
          1. 7.3.3.2.1 Fixed Off-Time Current Chopping
          2. 7.3.3.2.2 Cycle-By-Cycle Current Chopping
      4. 7.3.4 Protection Circuits
        1. 7.3.4.1 VM Supply Undervoltage Lockout (UVLO)
        2. 7.3.4.2 VCP Charge Pump Undervoltage Lockout (CPUV)
        3. 7.3.4.3 OUTx Overcurrent Protection (OCP)
        4. 7.3.4.4 Thermal Shutdown (TSD)
        5. 7.3.4.5 Fault Condition Summary
      5. 7.3.5 Pin Diagrams
        1. 7.3.5.1 Logic-Level Inputs
        2. 7.3.5.2 Tri-Level Inputs
        3. 7.3.5.3 Quad-Level Inputs
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Low-Power Sleep Mode
      3. 7.4.3 Fault Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Primary Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Current Sense and Regulation
          2. 8.2.1.2.2 Power Dissipation and Output Current Capability
          3. 8.2.1.2.3 Thermal Performance
            1. 8.2.1.2.3.1 Steady-State Thermal Performance
            2. 8.2.1.2.3.2 Transient Thermal Performance
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Alternative Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Current Sense and Regulation
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Bulk Capacitance
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 HTSSOP Layout Example
      2. 10.2.2 VQFN Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGT|16
  • PWP|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.1 External Components

Table 1 lists the recommended external components for the device.

Table 1. Recommended External Components

COMPONENT PIN 1 PIN 2 RECOMMENDED
CVM1 VM GND 0.1-µF, low ESR ceramic capacitor, VM-rated.
CVM2 VM GND Bulk Capacitance, VM-rated.
CVCP VCP VM X5R or X7R, 100-nF, 16-V ceramic capacitor
CFLY CPH CPL X5R or X7R, 22-nF, VM-rated ceramic capacitor
RIMODE IMODE GND See Current Regulation.
RPMODE PMODE GND See Control Modes.
RnFAULT VCC nFAULT Pullup resistor, IOD ≤ 5-mA
RIPROPI IPROPI GND See Current Sensing.